KR102089928B1 - 반도체 웨이퍼 가공용 점착 테이프 및 반도체 웨이퍼의 가공 방법 - Google Patents

반도체 웨이퍼 가공용 점착 테이프 및 반도체 웨이퍼의 가공 방법 Download PDF

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Publication number
KR102089928B1
KR102089928B1 KR1020177031167A KR20177031167A KR102089928B1 KR 102089928 B1 KR102089928 B1 KR 102089928B1 KR 1020177031167 A KR1020177031167 A KR 1020177031167A KR 20177031167 A KR20177031167 A KR 20177031167A KR 102089928 B1 KR102089928 B1 KR 102089928B1
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KR
South Korea
Prior art keywords
semiconductor wafer
adhesive
adhesive tape
group
wafer processing
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KR1020177031167A
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English (en)
Korean (ko)
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KR20180020956A (ko
Inventor
마사토 오쿠라
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20180020956A publication Critical patent/KR20180020956A/ko
Application granted granted Critical
Publication of KR102089928B1 publication Critical patent/KR102089928B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020177031167A 2016-03-17 2017-02-28 반도체 웨이퍼 가공용 점착 테이프 및 반도체 웨이퍼의 가공 방법 KR102089928B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-054269 2016-03-17
JP2016054269A JP6034522B1 (ja) 2016-03-17 2016-03-17 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
PCT/JP2017/007709 WO2017159343A1 (fr) 2016-03-17 2017-02-28 Ruban adhésif pour traitement de plaquette de semi-conducteur et procédé de traitement de plaquette de semi-conducteur

Publications (2)

Publication Number Publication Date
KR20180020956A KR20180020956A (ko) 2018-02-28
KR102089928B1 true KR102089928B1 (ko) 2020-03-17

Family

ID=57419839

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177031167A KR102089928B1 (ko) 2016-03-17 2017-02-28 반도체 웨이퍼 가공용 점착 테이프 및 반도체 웨이퍼의 가공 방법

Country Status (5)

Country Link
JP (1) JP6034522B1 (fr)
KR (1) KR102089928B1 (fr)
CN (1) CN107960131B (fr)
TW (1) TWI744290B (fr)
WO (1) WO2017159343A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6200611B1 (ja) * 2016-03-17 2017-09-20 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、半導体ウェハ加工用粘着テープの製造方法および半導体ウェハの加工方法
KR102191706B1 (ko) 2017-02-24 2020-12-16 후루카와 덴키 고교 가부시키가이샤 마스크 일체형 표면 보호 테이프 및 그것을 이용하는 반도체 칩의 제조 방법
CN109075055B (zh) * 2017-03-31 2023-08-15 古河电气工业株式会社 半导体晶片表面保护用胶带和半导体晶片的加工方法
JP7284856B2 (ja) * 2018-03-14 2023-05-31 マクセル株式会社 バックグラインド用粘着テープ
CN112930584A (zh) * 2018-11-12 2021-06-08 昭和电工材料株式会社 半导体装置的制造方法及半导体晶圆加工用胶黏膜
CN110763255A (zh) * 2019-11-26 2020-02-07 衡阳开拓光电科技有限公司 一种光纤绕环固化工艺
CN116406410A (zh) * 2020-11-09 2023-07-07 电化株式会社 粘合带及加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101198254B1 (ko) 2010-05-31 2012-11-07 주식회사 케이씨씨 반도체 제조용 점·접착쉬트
JP2016014124A (ja) * 2014-07-03 2016-01-28 リンテック株式会社 表面保護フィルム

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JP2661950B2 (ja) * 1988-03-31 1997-10-08 古河電気工業株式会社 半導体ウエハ固定用放射線硬化性粘着テープ
JP3620810B2 (ja) 1996-05-02 2005-02-16 リンテック株式会社 ウエハ保護用粘着シート
JP4369584B2 (ja) 2000-01-21 2009-11-25 日東電工株式会社 半導体ウエハ保持保護用粘着シート
JP5057697B2 (ja) * 2006-05-12 2012-10-24 日東電工株式会社 半導体ウエハ又は半導体基板加工用粘着シート
JP4861081B2 (ja) 2006-07-14 2012-01-25 電気化学工業株式会社 半導体部材固定用粘着シート及びそれを用いた電子部品製造方法。
JP5286084B2 (ja) * 2006-07-19 2013-09-11 積水化学工業株式会社 ダイシング・ダイボンディングテープ及び半導体チップの製造方法
JP5069662B2 (ja) * 2007-11-12 2012-11-07 リンテック株式会社 粘着シート
JP5743555B2 (ja) * 2010-02-02 2015-07-01 リンテック株式会社 ダイシングシート
KR101140790B1 (ko) * 2010-03-30 2012-05-03 티티티케미칼 주식회사 웨이퍼 다이싱용 아크릴계 점착 조성물 및 이를 포함하는 다이싱 테이프
KR20110131772A (ko) * 2010-05-31 2011-12-07 주식회사 케이씨씨 자외선 경화성 점착수지 조성물 및 이를 포함하는 다이싱용 또는 표면보호용 점착 테이프
JP5687897B2 (ja) * 2010-12-28 2015-03-25 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
CN102504623B (zh) * 2011-09-28 2014-01-08 中钞特种防伪科技有限公司 一种剥离层组合物及其制备方法和应用
JP2013122005A (ja) * 2011-12-09 2013-06-20 Samsung Yokohama Research Institute Co Ltd 半導体用感光性接着フィルムおよび当該フィルムを用いた半導体装置の製造方法
JP6210827B2 (ja) * 2013-10-04 2017-10-11 リンテック株式会社 半導体加工用シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101198254B1 (ko) 2010-05-31 2012-11-07 주식회사 케이씨씨 반도체 제조용 점·접착쉬트
JP2016014124A (ja) * 2014-07-03 2016-01-28 リンテック株式会社 表面保護フィルム

Also Published As

Publication number Publication date
KR20180020956A (ko) 2018-02-28
WO2017159343A1 (fr) 2017-09-21
JP2017168739A (ja) 2017-09-21
TWI744290B (zh) 2021-11-01
CN107960131B (zh) 2022-02-25
CN107960131A (zh) 2018-04-24
JP6034522B1 (ja) 2016-11-30
TW201802207A (zh) 2018-01-16

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