JP6033652B2 - 両面研削装置における静圧パッドの熱変形防止装置および両面研削装置 - Google Patents

両面研削装置における静圧パッドの熱変形防止装置および両面研削装置 Download PDF

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Publication number
JP6033652B2
JP6033652B2 JP2012256952A JP2012256952A JP6033652B2 JP 6033652 B2 JP6033652 B2 JP 6033652B2 JP 2012256952 A JP2012256952 A JP 2012256952A JP 2012256952 A JP2012256952 A JP 2012256952A JP 6033652 B2 JP6033652 B2 JP 6033652B2
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grinding
static pressure
workpiece
thermal deformation
pad
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JP2014104515A5 (enExample
JP2014104515A (ja
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篤志 芝中
篤志 芝中
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JTEKT Machine Systems Corp
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Koyo Machine Industries Co Ltd
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Priority to JP2012256952A priority Critical patent/JP6033652B2/ja
Priority to TW102141722A priority patent/TWI652140B/zh
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  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012256952A 2012-11-23 2012-11-23 両面研削装置における静圧パッドの熱変形防止装置および両面研削装置 Active JP6033652B2 (ja)

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JP2012256952A JP6033652B2 (ja) 2012-11-23 2012-11-23 両面研削装置における静圧パッドの熱変形防止装置および両面研削装置
TW102141722A TWI652140B (zh) 2012-11-23 2013-11-15 雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床

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JP2012256952A JP6033652B2 (ja) 2012-11-23 2012-11-23 両面研削装置における静圧パッドの熱変形防止装置および両面研削装置

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JP2014104515A JP2014104515A (ja) 2014-06-09
JP2014104515A5 JP2014104515A5 (enExample) 2015-07-23
JP6033652B2 true JP6033652B2 (ja) 2016-11-30

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Publication number Priority date Publication date Assignee Title
JP6401082B2 (ja) * 2015-03-10 2018-10-03 日本碍子株式会社 セラミック構造体の製法
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
CN109352445B (zh) * 2018-12-05 2019-11-12 江苏博克斯科技股份有限公司 一种用于电子产品内部板件的打磨装置及其工作方法
CN111716204B (zh) * 2020-07-01 2021-08-13 中山市国景家具有限公司 一种木材表面精细化处理加工系统
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法

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Publication number Priority date Publication date Assignee Title
JPS4613665Y1 (enExample) * 1967-09-28 1971-05-14
US4262452A (en) * 1978-11-24 1981-04-21 Lopez Francisco R Disc brake grinding apparatus and method
JPS5755000Y2 (enExample) * 1979-09-29 1982-11-27
JP5411862B2 (ja) 2008-08-08 2014-02-12 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP2010064214A (ja) * 2008-09-12 2010-03-25 Koyo Mach Ind Co Ltd 両頭平面研削盤及びワークの両面研削方法

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TW201433409A (zh) 2014-09-01
TWI652140B (zh) 2019-03-01
JP2014104515A (ja) 2014-06-09

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