JP6023453B2 - 記憶装置 - Google Patents
記憶装置 Download PDFInfo
- Publication number
- JP6023453B2 JP6023453B2 JP2012089267A JP2012089267A JP6023453B2 JP 6023453 B2 JP6023453 B2 JP 6023453B2 JP 2012089267 A JP2012089267 A JP 2012089267A JP 2012089267 A JP2012089267 A JP 2012089267A JP 6023453 B2 JP6023453 B2 JP 6023453B2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- data
- layer
- value
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C15/00—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
- G11C15/04—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C15/00—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C15/00—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
- G11C15/04—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
- G11C15/046—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements using non-volatile storage elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Memory System (AREA)
- Non-Volatile Memory (AREA)
- Dram (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012089267A JP6023453B2 (ja) | 2011-04-15 | 2012-04-10 | 記憶装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011091582 | 2011-04-15 | ||
| JP2011091582 | 2011-04-15 | ||
| JP2011112453 | 2011-05-19 | ||
| JP2011112453 | 2011-05-19 | ||
| JP2012089267A JP6023453B2 (ja) | 2011-04-15 | 2012-04-10 | 記憶装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016198843A Division JP6201023B2 (ja) | 2011-04-15 | 2016-10-07 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012256407A JP2012256407A (ja) | 2012-12-27 |
| JP2012256407A5 JP2012256407A5 (enExample) | 2015-05-07 |
| JP6023453B2 true JP6023453B2 (ja) | 2016-11-09 |
Family
ID=47006296
Family Applications (11)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012089267A Expired - Fee Related JP6023453B2 (ja) | 2011-04-15 | 2012-04-10 | 記憶装置 |
| JP2016198843A Active JP6201023B2 (ja) | 2011-04-15 | 2016-10-07 | 半導体装置 |
| JP2017163000A Active JP6445635B2 (ja) | 2011-04-15 | 2017-08-28 | 半導体装置 |
| JP2018222971A Active JP6661253B2 (ja) | 2011-04-15 | 2018-11-29 | 半導体装置 |
| JP2020021069A Active JP6705069B1 (ja) | 2011-04-15 | 2020-02-11 | 半導体装置 |
| JP2020084228A Active JP6936360B2 (ja) | 2011-04-15 | 2020-05-13 | 半導体装置 |
| JP2021137924A Withdrawn JP2021185617A (ja) | 2011-04-15 | 2021-08-26 | 半導体装置 |
| JP2022145753A Active JP7368570B2 (ja) | 2011-04-15 | 2022-09-14 | 半導体装置 |
| JP2023177015A Active JP7589311B2 (ja) | 2011-04-15 | 2023-10-12 | 半導体装置 |
| JP2024198481A Active JP7734816B2 (ja) | 2011-04-15 | 2024-11-13 | 半導体装置 |
| JP2025140679A Pending JP2025161944A (ja) | 2011-04-15 | 2025-08-26 | 半導体装置 |
Family Applications After (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016198843A Active JP6201023B2 (ja) | 2011-04-15 | 2016-10-07 | 半導体装置 |
| JP2017163000A Active JP6445635B2 (ja) | 2011-04-15 | 2017-08-28 | 半導体装置 |
| JP2018222971A Active JP6661253B2 (ja) | 2011-04-15 | 2018-11-29 | 半導体装置 |
| JP2020021069A Active JP6705069B1 (ja) | 2011-04-15 | 2020-02-11 | 半導体装置 |
| JP2020084228A Active JP6936360B2 (ja) | 2011-04-15 | 2020-05-13 | 半導体装置 |
| JP2021137924A Withdrawn JP2021185617A (ja) | 2011-04-15 | 2021-08-26 | 半導体装置 |
| JP2022145753A Active JP7368570B2 (ja) | 2011-04-15 | 2022-09-14 | 半導体装置 |
| JP2023177015A Active JP7589311B2 (ja) | 2011-04-15 | 2023-10-12 | 半導体装置 |
| JP2024198481A Active JP7734816B2 (ja) | 2011-04-15 | 2024-11-13 | 半導体装置 |
| JP2025140679A Pending JP2025161944A (ja) | 2011-04-15 | 2025-08-26 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9230648B2 (enExample) |
| JP (11) | JP6023453B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8729545B2 (en) | 2011-04-28 | 2014-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| US8897049B2 (en) | 2011-05-13 | 2014-11-25 | Semiconductor Energy Laboratories Co., Ltd. | Semiconductor device and memory device including semiconductor device |
| TWI570891B (zh) | 2011-05-17 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US9318484B2 (en) | 2013-02-20 | 2016-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6487738B2 (ja) * | 2014-03-31 | 2019-03-20 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品 |
| JP6970511B2 (ja) * | 2016-02-12 | 2021-11-24 | 株式会社半導体エネルギー研究所 | トランジスタ |
| JP6906978B2 (ja) | 2016-02-25 | 2021-07-21 | 株式会社半導体エネルギー研究所 | 半導体装置、半導体ウェハ、および電子機器 |
| WO2022018560A1 (ja) | 2020-07-24 | 2022-01-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE1295237B (de) * | 1964-10-22 | 1969-05-14 | Siemens Ag | Druckempfindliche Halbleiteranordnung und Verfahren zu ihrer Herstellung |
| EP0053878B1 (en) | 1980-12-08 | 1985-08-14 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| JPS5853859A (ja) * | 1981-09-26 | 1983-03-30 | Matsushita Electric Ind Co Ltd | 集積型薄膜素子の製造方法 |
| JPS60210852A (ja) * | 1984-04-04 | 1985-10-23 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置およびその製造方法 |
| JPH0612799B2 (ja) * | 1986-03-03 | 1994-02-16 | 三菱電機株式会社 | 積層型半導体装置およびその製造方法 |
| JPS62274773A (ja) * | 1986-05-23 | 1987-11-28 | Hitachi Ltd | 半導体記憶装置 |
| JPS6396799A (ja) * | 1986-10-13 | 1988-04-27 | Nec Corp | 連想メモリ |
| JPS63144495A (ja) * | 1986-12-08 | 1988-06-16 | Matsushita Electric Ind Co Ltd | メモリセル回路 |
| JPS63268184A (ja) * | 1987-04-24 | 1988-11-04 | Sony Corp | 半導体メモリ装置 |
| JPH01175029A (ja) * | 1987-12-29 | 1989-07-11 | Nec Corp | 機能記憶回路 |
| JP2788265B2 (ja) * | 1988-07-08 | 1998-08-20 | オリンパス光学工業株式会社 | 強誘電体メモリ及びその駆動方法,製造方法 |
| JPH04372795A (ja) * | 1991-06-21 | 1992-12-25 | Nissan Motor Co Ltd | 連想メモリ装置 |
| JP2741810B2 (ja) * | 1991-11-26 | 1998-04-22 | 川崎製鉄株式会社 | 内容アドレス式メモリ |
| JPH07121444A (ja) | 1993-10-21 | 1995-05-12 | Fuji Xerox Co Ltd | 補助記憶装置 |
| JP3836166B2 (ja) * | 1993-11-22 | 2006-10-18 | 株式会社半導体エネルギー研究所 | 2層構造のトランジスタおよびその作製方法 |
| JP4103968B2 (ja) | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| JPH1140772A (ja) * | 1997-07-22 | 1999-02-12 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| JP3410976B2 (ja) | 1998-12-08 | 2003-05-26 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 薄膜及びバルク・シリコン・トランジスタを組み合わせる併合化論理及びメモリ集積回路チップとその形成方法 |
| US6137707A (en) * | 1999-03-26 | 2000-10-24 | Netlogic Microsystems | Method and apparatus for simultaneously performing a plurality of compare operations in content addressable memory device |
| JP4357101B2 (ja) * | 2000-08-23 | 2009-11-04 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| JP3749101B2 (ja) * | 2000-09-14 | 2006-02-22 | 株式会社ルネサステクノロジ | 半導体装置 |
| CA2342575A1 (en) | 2001-04-03 | 2002-10-03 | Mosaid Technologies Incorporated | Content addressable memory cell |
| JP2004295967A (ja) | 2003-03-26 | 2004-10-21 | Kawasaki Microelectronics Kk | 連想メモリ |
| US6900999B1 (en) * | 2003-06-30 | 2005-05-31 | Integrated Device Technology, Inc. | Ternary content addressable memory (TCAM) cells with small footprint size and efficient layout aspect ratio |
| US7016211B2 (en) * | 2003-08-18 | 2006-03-21 | Integrated Device Technology, Inc. | DRAM-based CAM cell with shared bitlines |
| JP2005101141A (ja) * | 2003-09-24 | 2005-04-14 | Renesas Technology Corp | 半導体集積回路装置およびその製造方法 |
| KR100615085B1 (ko) * | 2004-01-12 | 2006-08-22 | 삼성전자주식회사 | 노드 콘택 구조체들, 이를 채택하는 반도체소자들, 이를채택하는 에스램 셀들 및 이를 제조하는 방법들 |
| KR100583972B1 (ko) * | 2004-11-26 | 2006-05-26 | 삼성전자주식회사 | 씨모스 인버터의 노드 콘택 구조체를 갖는 반도체소자의제조방법들 |
| JP4560505B2 (ja) * | 2005-11-08 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
| KR100684115B1 (ko) * | 2006-02-03 | 2007-02-16 | 재단법인서울대학교산학협력재단 | 범위 매칭 셀 및 이를 이용한 캠 |
| JP2007250044A (ja) * | 2006-03-14 | 2007-09-27 | Sony Corp | 半導体メモリデバイスおよびその動作方法 |
| JP5110803B2 (ja) * | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| US8143115B2 (en) * | 2006-12-05 | 2012-03-27 | Canon Kabushiki Kaisha | Method for manufacturing thin film transistor using oxide semiconductor and display apparatus |
| WO2008069255A1 (en) * | 2006-12-05 | 2008-06-12 | Canon Kabushiki Kaisha | Method for manufacturing thin film transistor using oxide semiconductor and display apparatus |
| JP5406449B2 (ja) * | 2007-05-30 | 2014-02-05 | キヤノン株式会社 | 酸化物半導体を用いた薄膜トランジスタの製造方法および表示装置 |
| JP2009076879A (ja) * | 2007-08-24 | 2009-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US8232598B2 (en) * | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| US7982250B2 (en) * | 2007-09-21 | 2011-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8044464B2 (en) * | 2007-09-21 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5430846B2 (ja) * | 2007-12-03 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5366517B2 (ja) * | 2007-12-03 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI391946B (zh) * | 2008-09-18 | 2013-04-01 | Realtek Semiconductor Corp | 內容可定址記憶體 |
| JP5781720B2 (ja) | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP5322787B2 (ja) | 2009-06-11 | 2013-10-23 | 富士フイルム株式会社 | 薄膜トランジスタ及びその製造方法、電気光学装置、並びにセンサー |
| KR101073542B1 (ko) * | 2009-09-03 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR101746198B1 (ko) * | 2009-09-04 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 전자기기 |
| WO2011048929A1 (en) * | 2009-10-21 | 2011-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2011062043A1 (en) * | 2009-11-20 | 2011-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2013016243A (ja) * | 2011-06-09 | 2013-01-24 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
-
2012
- 2012-04-10 JP JP2012089267A patent/JP6023453B2/ja not_active Expired - Fee Related
- 2012-04-11 US US13/443,959 patent/US9230648B2/en not_active Expired - Fee Related
-
2016
- 2016-10-07 JP JP2016198843A patent/JP6201023B2/ja active Active
-
2017
- 2017-08-28 JP JP2017163000A patent/JP6445635B2/ja active Active
-
2018
- 2018-11-29 JP JP2018222971A patent/JP6661253B2/ja active Active
-
2020
- 2020-02-11 JP JP2020021069A patent/JP6705069B1/ja active Active
- 2020-05-13 JP JP2020084228A patent/JP6936360B2/ja active Active
-
2021
- 2021-08-26 JP JP2021137924A patent/JP2021185617A/ja not_active Withdrawn
-
2022
- 2022-09-14 JP JP2022145753A patent/JP7368570B2/ja active Active
-
2023
- 2023-10-12 JP JP2023177015A patent/JP7589311B2/ja active Active
-
2024
- 2024-11-13 JP JP2024198481A patent/JP7734816B2/ja active Active
-
2025
- 2025-08-26 JP JP2025140679A patent/JP2025161944A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019071424A (ja) | 2019-05-09 |
| JP2025015626A (ja) | 2025-01-30 |
| JP2018014508A (ja) | 2018-01-25 |
| JP2012256407A (ja) | 2012-12-27 |
| JP6661253B2 (ja) | 2020-03-11 |
| JP6445635B2 (ja) | 2018-12-26 |
| JP2023178364A (ja) | 2023-12-14 |
| JP2025161944A (ja) | 2025-10-24 |
| JP7368570B2 (ja) | 2023-10-24 |
| JP2020098659A (ja) | 2020-06-25 |
| JP2020145457A (ja) | 2020-09-10 |
| JP6705069B1 (ja) | 2020-06-03 |
| US20120262979A1 (en) | 2012-10-18 |
| US9230648B2 (en) | 2016-01-05 |
| JP6936360B2 (ja) | 2021-09-15 |
| JP2021185617A (ja) | 2021-12-09 |
| JP2017021886A (ja) | 2017-01-26 |
| JP6201023B2 (ja) | 2017-09-20 |
| JP7734816B2 (ja) | 2025-09-05 |
| JP2022177145A (ja) | 2022-11-30 |
| JP7589311B2 (ja) | 2024-11-25 |
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