JP6006972B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP6006972B2
JP6006972B2 JP2012100925A JP2012100925A JP6006972B2 JP 6006972 B2 JP6006972 B2 JP 6006972B2 JP 2012100925 A JP2012100925 A JP 2012100925A JP 2012100925 A JP2012100925 A JP 2012100925A JP 6006972 B2 JP6006972 B2 JP 6006972B2
Authority
JP
Japan
Prior art keywords
hole
electrostatic chuck
insulating member
adhesive layer
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012100925A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013229464A5 (enExample
JP2013229464A (ja
Inventor
則雄 白岩
則雄 白岩
治郎 川合
治郎 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012100925A priority Critical patent/JP6006972B2/ja
Priority to KR1020130041512A priority patent/KR102092094B1/ko
Priority to US13/863,870 priority patent/US9240340B2/en
Priority to TW102113700A priority patent/TWI587441B/zh
Publication of JP2013229464A publication Critical patent/JP2013229464A/ja
Publication of JP2013229464A5 publication Critical patent/JP2013229464A5/ja
Application granted granted Critical
Publication of JP6006972B2 publication Critical patent/JP6006972B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2012100925A 2012-04-26 2012-04-26 静電チャック Active JP6006972B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012100925A JP6006972B2 (ja) 2012-04-26 2012-04-26 静電チャック
KR1020130041512A KR102092094B1 (ko) 2012-04-26 2013-04-16 정전 척
US13/863,870 US9240340B2 (en) 2012-04-26 2013-04-16 Electrostatic chuck
TW102113700A TWI587441B (zh) 2012-04-26 2013-04-18 靜電夾頭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012100925A JP6006972B2 (ja) 2012-04-26 2012-04-26 静電チャック

Publications (3)

Publication Number Publication Date
JP2013229464A JP2013229464A (ja) 2013-11-07
JP2013229464A5 JP2013229464A5 (enExample) 2015-04-30
JP6006972B2 true JP6006972B2 (ja) 2016-10-12

Family

ID=49477074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012100925A Active JP6006972B2 (ja) 2012-04-26 2012-04-26 静電チャック

Country Status (4)

Country Link
US (1) US9240340B2 (enExample)
JP (1) JP6006972B2 (enExample)
KR (1) KR102092094B1 (enExample)
TW (1) TWI587441B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5829509B2 (ja) * 2011-12-20 2015-12-09 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
JP5811513B2 (ja) 2014-03-27 2015-11-11 Toto株式会社 静電チャック
JP6219227B2 (ja) * 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
JP6292977B2 (ja) 2014-05-22 2018-03-14 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6308871B2 (ja) * 2014-05-28 2018-04-11 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6433204B2 (ja) * 2014-09-01 2018-12-05 株式会社ディスコ 静電支持プレート及び静電支持プレートの製造方法
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
WO2018016587A1 (ja) * 2016-07-20 2018-01-25 Toto株式会社 静電チャック
WO2018016588A1 (ja) * 2016-07-20 2018-01-25 Toto株式会社 静電チャック
JP6238097B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
JP6238098B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
US10388558B2 (en) * 2016-12-05 2019-08-20 Tokyo Electron Limited Plasma processing apparatus
JP6758175B2 (ja) * 2016-12-21 2020-09-23 日本特殊陶業株式会社 静電チャック
KR102441256B1 (ko) * 2018-01-29 2022-09-07 교세라 가부시키가이샤 시료 유지구
JP7090481B2 (ja) 2018-06-15 2022-06-24 新光電気工業株式会社 静電チャック及びその製造方法
JP2020061445A (ja) * 2018-10-09 2020-04-16 京セラ株式会社 試料保持具
JP7157822B2 (ja) * 2018-11-30 2022-10-20 京セラ株式会社 試料保持具
KR102203859B1 (ko) * 2019-05-14 2021-01-15 주식회사 동탄이엔지 절연 저항이 우수한 정전척
JP7586682B2 (ja) * 2020-10-07 2024-11-19 日本特殊陶業株式会社 保持装置
JP7550685B2 (ja) 2021-03-17 2024-09-13 新光電気工業株式会社 静電チャック及び基板固定装置
JP2023031603A (ja) * 2021-08-25 2023-03-09 新光電気工業株式会社 基板固定装置
JP7554171B2 (ja) * 2021-10-19 2024-09-19 日本碍子株式会社 ウエハ載置台
US20250273498A1 (en) * 2024-02-23 2025-08-28 Applied Materials, Inc. Embedded electrostatic chuck (esc)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238925B2 (ja) * 1990-11-17 2001-12-17 株式会社東芝 静電チャック
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
JP2003060016A (ja) 2001-07-31 2003-02-28 Applied Materials Inc 電流導入端子及び半導体製造装置
JP3993408B2 (ja) 2001-10-05 2007-10-17 株式会社巴川製紙所 静電チャック装置、その組立方法および静電チャック装置用部材
JP2003197727A (ja) * 2001-12-21 2003-07-11 Kyocera Corp ウエハ載置ステージ
JP2006344613A (ja) 2003-06-24 2006-12-21 Shin-Etsu Engineering Co Ltd 基板貼り合わせ装置
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
JP5507198B2 (ja) * 2009-10-26 2014-05-28 新光電気工業株式会社 静電チャック

Also Published As

Publication number Publication date
US20130286531A1 (en) 2013-10-31
US9240340B2 (en) 2016-01-19
KR20130121020A (ko) 2013-11-05
KR102092094B1 (ko) 2020-03-23
TWI587441B (zh) 2017-06-11
JP2013229464A (ja) 2013-11-07
TW201347082A (zh) 2013-11-16

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