JP6001796B2 - 銅粉、その製造方法、及びそれを含む導電性組成物 - Google Patents
銅粉、その製造方法、及びそれを含む導電性組成物 Download PDFInfo
- Publication number
- JP6001796B2 JP6001796B2 JP2015547184A JP2015547184A JP6001796B2 JP 6001796 B2 JP6001796 B2 JP 6001796B2 JP 2015547184 A JP2015547184 A JP 2015547184A JP 2015547184 A JP2015547184 A JP 2015547184A JP 6001796 B2 JP6001796 B2 JP 6001796B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper powder
- particles
- less
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 294
- 239000000203 mixture Substances 0.000 title claims description 44
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000002245 particle Substances 0.000 claims description 169
- 239000010949 copper Substances 0.000 claims description 112
- 229910052802 copper Inorganic materials 0.000 claims description 109
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000010191 image analysis Methods 0.000 claims description 16
- 239000011164 primary particle Substances 0.000 claims description 16
- 239000002002 slurry Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 12
- 239000011162 core material Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 2
- 238000010008 shearing Methods 0.000 claims description 2
- 239000002994 raw material Substances 0.000 description 25
- 239000004020 conductor Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 18
- 239000011230 binding agent Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000005868 electrolysis reaction Methods 0.000 description 5
- 239000008151 electrolyte solution Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011928 denatured alcohol Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- -1 silver Chemical compound 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Chemically Coating (AREA)
- Electrolytic Production Of Metals (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014123119 | 2014-06-16 | ||
| JP2014123119 | 2014-06-16 | ||
| PCT/JP2015/065574 WO2015194347A1 (ja) | 2014-06-16 | 2015-05-29 | 銅粉、その製造方法、及びそれを含む導電性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6001796B2 true JP6001796B2 (ja) | 2016-10-05 |
| JPWO2015194347A1 JPWO2015194347A1 (ja) | 2017-04-20 |
Family
ID=54935338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015547184A Active JP6001796B2 (ja) | 2014-06-16 | 2015-05-29 | 銅粉、その製造方法、及びそれを含む導電性組成物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6001796B2 (zh) |
| KR (1) | KR101874500B1 (zh) |
| CN (1) | CN106457382B (zh) |
| TW (1) | TWI652358B (zh) |
| WO (1) | WO2015194347A1 (zh) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6167702A (ja) * | 1984-09-07 | 1986-04-07 | Mitsui Mining & Smelting Co Ltd | 導電性粉末及びこれを用いた導電性組成物 |
| JPS62199705A (ja) * | 1986-02-25 | 1987-09-03 | Fukuda Kinzoku Hakufun Kogyo Kk | 微細粒状銅粉の製造方法 |
| JPH0246641B2 (zh) * | 1987-11-02 | 1990-10-16 | Mitsui Mining & Smelting Co | |
| JPH038209A (ja) * | 1989-06-01 | 1991-01-16 | Matsushita Electric Ind Co Ltd | 厚膜用組成物 |
| JPH06158103A (ja) * | 1992-11-25 | 1994-06-07 | Mitsui Mining & Smelting Co Ltd | 半田付け可能な導電性塗料用銅粉とその製造方法 |
| JP2008122030A (ja) * | 2006-11-15 | 2008-05-29 | Mitsui Mining & Smelting Co Ltd | ヒートパイプ構成原料 |
| JP2008130301A (ja) * | 2006-11-20 | 2008-06-05 | Sumitomo Bakelite Co Ltd | 導電性銅ペースト |
| JP2013053347A (ja) * | 2011-09-05 | 2013-03-21 | Mitsui Mining & Smelting Co Ltd | デンドライト状銅粉 |
| JP2013100592A (ja) * | 2011-10-21 | 2013-05-23 | Mitsui Mining & Smelting Co Ltd | 銀被覆銅粉 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2809646B2 (ja) * | 1988-08-09 | 1998-10-15 | 株式会社東芝 | Ｘ線イメージ管 |
| US6036839A (en) * | 1998-02-04 | 2000-03-14 | Electrocopper Products Limited | Low density high surface area copper powder and electrodeposition process for making same |
| JP4230017B2 (ja) * | 1998-08-31 | 2009-02-25 | 三井金属鉱業株式会社 | 微小銅粉の製造方法 |
| JP5181434B2 (ja) * | 2006-07-10 | 2013-04-10 | 住友金属鉱山株式会社 | 微小銅粉及びその製造方法 |
| JP2010215796A (ja) * | 2009-03-17 | 2010-09-30 | Hitachi Cable Ltd | 発泡樹脂組成物及びその製造方法、並びにこれを用いた発泡絶縁電線 |
| JP5320442B2 (ja) * | 2011-07-13 | 2013-10-23 | 三井金属鉱業株式会社 | デンドライト状銅粉 |
-
2015
- 2015-05-29 KR KR1020167031624A patent/KR101874500B1/ko active IP Right Grant
- 2015-05-29 JP JP2015547184A patent/JP6001796B2/ja active Active
- 2015-05-29 CN CN201580024747.3A patent/CN106457382B/zh active Active
- 2015-05-29 WO PCT/JP2015/065574 patent/WO2015194347A1/ja active Application Filing
- 2015-06-11 TW TW104118953A patent/TWI652358B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6167702A (ja) * | 1984-09-07 | 1986-04-07 | Mitsui Mining & Smelting Co Ltd | 導電性粉末及びこれを用いた導電性組成物 |
| JPS62199705A (ja) * | 1986-02-25 | 1987-09-03 | Fukuda Kinzoku Hakufun Kogyo Kk | 微細粒状銅粉の製造方法 |
| JPH0246641B2 (zh) * | 1987-11-02 | 1990-10-16 | Mitsui Mining & Smelting Co | |
| JPH038209A (ja) * | 1989-06-01 | 1991-01-16 | Matsushita Electric Ind Co Ltd | 厚膜用組成物 |
| JPH06158103A (ja) * | 1992-11-25 | 1994-06-07 | Mitsui Mining & Smelting Co Ltd | 半田付け可能な導電性塗料用銅粉とその製造方法 |
| JP2008122030A (ja) * | 2006-11-15 | 2008-05-29 | Mitsui Mining & Smelting Co Ltd | ヒートパイプ構成原料 |
| JP2008130301A (ja) * | 2006-11-20 | 2008-06-05 | Sumitomo Bakelite Co Ltd | 導電性銅ペースト |
| JP2013053347A (ja) * | 2011-09-05 | 2013-03-21 | Mitsui Mining & Smelting Co Ltd | デンドライト状銅粉 |
| JP2013100592A (ja) * | 2011-10-21 | 2013-05-23 | Mitsui Mining & Smelting Co Ltd | 銀被覆銅粉 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2015194347A1 (ja) | 2017-04-20 |
| KR101874500B1 (ko) | 2018-07-04 |
| TWI652358B (zh) | 2019-03-01 |
| CN106457382B (zh) | 2019-06-25 |
| CN106457382A (zh) | 2017-02-22 |
| WO2015194347A1 (ja) | 2015-12-23 |
| TW201606101A (zh) | 2016-02-16 |
| KR20170008744A (ko) | 2017-01-24 |
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