JP5992229B2 - ワーク押出装置およびそれを備えるワーク供給装置 - Google Patents

ワーク押出装置およびそれを備えるワーク供給装置 Download PDF

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Publication number
JP5992229B2
JP5992229B2 JP2012146240A JP2012146240A JP5992229B2 JP 5992229 B2 JP5992229 B2 JP 5992229B2 JP 2012146240 A JP2012146240 A JP 2012146240A JP 2012146240 A JP2012146240 A JP 2012146240A JP 5992229 B2 JP5992229 B2 JP 5992229B2
Authority
JP
Japan
Prior art keywords
extrusion
connecting piece
workpiece
convex portion
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012146240A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014008567A (ja
JP2014008567A5 (ko
Inventor
生島　和正
和正 生島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012146240A priority Critical patent/JP5992229B2/ja
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Priority to SG11201408744UA priority patent/SG11201408744UA/en
Priority to KR1020157002348A priority patent/KR102070744B1/ko
Priority to MYPI2014704044A priority patent/MY171474A/en
Priority to PCT/JP2013/067438 priority patent/WO2014003029A1/ja
Priority to CN201380034695.9A priority patent/CN104395037B/zh
Priority to TW102123222A priority patent/TWI566320B/zh
Publication of JP2014008567A publication Critical patent/JP2014008567A/ja
Priority to HK15104374.1A priority patent/HK1203889A1/xx
Publication of JP2014008567A5 publication Critical patent/JP2014008567A5/ja
Application granted granted Critical
Publication of JP5992229B2 publication Critical patent/JP5992229B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
  • Coating Apparatus (AREA)
JP2012146240A 2012-06-29 2012-06-29 ワーク押出装置およびそれを備えるワーク供給装置 Active JP5992229B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2012146240A JP5992229B2 (ja) 2012-06-29 2012-06-29 ワーク押出装置およびそれを備えるワーク供給装置
KR1020157002348A KR102070744B1 (ko) 2012-06-29 2013-06-26 공작물 압출 장치 및 이것을 구비하는 공작물 공급 장치
MYPI2014704044A MY171474A (en) 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same
PCT/JP2013/067438 WO2014003029A1 (ja) 2012-06-29 2013-06-26 ワーク押出装置およびそれを備えるワーク供給装置
SG11201408744UA SG11201408744UA (en) 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same
CN201380034695.9A CN104395037B (zh) 2012-06-29 2013-06-26 工件挤出装置及具备其的工件供给装置
TW102123222A TWI566320B (zh) 2012-06-29 2013-06-28 A workpiece ejecting device and a workpiece supplying device provided with the workpiece
HK15104374.1A HK1203889A1 (en) 2012-06-29 2015-05-08 Workpiece ejection device and workpiece supply device provided with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012146240A JP5992229B2 (ja) 2012-06-29 2012-06-29 ワーク押出装置およびそれを備えるワーク供給装置

Publications (3)

Publication Number Publication Date
JP2014008567A JP2014008567A (ja) 2014-01-20
JP2014008567A5 JP2014008567A5 (ko) 2015-08-06
JP5992229B2 true JP5992229B2 (ja) 2016-09-14

Family

ID=49783170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012146240A Active JP5992229B2 (ja) 2012-06-29 2012-06-29 ワーク押出装置およびそれを備えるワーク供給装置

Country Status (8)

Country Link
JP (1) JP5992229B2 (ko)
KR (1) KR102070744B1 (ko)
CN (1) CN104395037B (ko)
HK (1) HK1203889A1 (ko)
MY (1) MY171474A (ko)
SG (1) SG11201408744UA (ko)
TW (1) TWI566320B (ko)
WO (1) WO2014003029A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7104081B2 (ja) * 2020-01-30 2022-07-20 株式会社鈴木 ワーク供給装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4742400Y1 (ko) 1968-12-09 1972-12-21
JPS606115Y2 (ja) * 1980-03-18 1985-02-26 神鋼アルフレツシユ株式会社 改装建物用支持枠装置
JPH0447159Y2 (ko) * 1985-05-14 1992-11-06
JPS62216243A (ja) * 1986-03-17 1987-09-22 Tokyo Seimitsu Co Ltd ウエ−ハ押し出し装置
JPH066115Y2 (ja) * 1987-03-16 1994-02-16 東京エレクトロン株式会社 ウエハ供給装置
JP3238786B2 (ja) * 1993-03-23 2001-12-17 ローム株式会社 リードフレーム又はプリント基板の繰り出し装置
JP2000298099A (ja) * 1999-04-15 2000-10-24 Citizen Watch Co Ltd 部品検査方法、部品管理方法および部品選別方法
JP3943293B2 (ja) * 1999-08-17 2007-07-11 武蔵エンジニアリング株式会社 過負荷検出機能を備えたワークフィーダ
JP4742400B2 (ja) * 1999-10-01 2011-08-10 パナソニック株式会社 プッシャおよびローダ
CN1248563C (zh) * 1999-12-16 2006-03-29 西门子公司 装配基板的装配设备和带有所述装配设备的装配线
DE10117023A1 (de) * 2001-04-05 2002-10-10 Bsh Bosch Siemens Hausgeraete Gargerät
US20030002964A1 (en) * 2001-06-27 2003-01-02 Hee Wee Boon Handler system incorporating a semi-automatic tray replacement apparatus and method of use
JP4278584B2 (ja) * 2004-08-03 2009-06-17 日新工機株式会社 プール床の昇降装置
ES2385859T3 (es) * 2009-08-17 2012-08-01 Tetra Laval Holdings & Finance Sa Material de envasado de lámina de múltiples capas para producir envases de productos de alimentación vertibles

Also Published As

Publication number Publication date
KR20150021130A (ko) 2015-02-27
JP2014008567A (ja) 2014-01-20
TWI566320B (zh) 2017-01-11
KR102070744B1 (ko) 2020-01-29
CN104395037B (zh) 2017-02-22
MY171474A (en) 2019-10-15
SG11201408744UA (en) 2015-02-27
HK1203889A1 (en) 2015-11-06
CN104395037A (zh) 2015-03-04
WO2014003029A1 (ja) 2014-01-03
TW201409600A (zh) 2014-03-01

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