HK1203889A1 - Workpiece ejection device and workpiece supply device provided with same - Google Patents

Workpiece ejection device and workpiece supply device provided with same

Info

Publication number
HK1203889A1
HK1203889A1 HK15104374.1A HK15104374A HK1203889A1 HK 1203889 A1 HK1203889 A1 HK 1203889A1 HK 15104374 A HK15104374 A HK 15104374A HK 1203889 A1 HK1203889 A1 HK 1203889A1
Authority
HK
Hong Kong
Prior art keywords
workpiece
same
supply device
device provided
ejection device
Prior art date
Application number
HK15104374.1A
Other languages
Chinese (zh)
Inventor
生島和正
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1203889A1 publication Critical patent/HK1203889A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coating Apparatus (AREA)
HK15104374.1A 2012-06-29 2015-05-08 Workpiece ejection device and workpiece supply device provided with same HK1203889A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012146240A JP5992229B2 (en) 2012-06-29 2012-06-29 Work extruding apparatus and work supplying apparatus having the same
PCT/JP2013/067438 WO2014003029A1 (en) 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same

Publications (1)

Publication Number Publication Date
HK1203889A1 true HK1203889A1 (en) 2015-11-06

Family

ID=49783170

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104374.1A HK1203889A1 (en) 2012-06-29 2015-05-08 Workpiece ejection device and workpiece supply device provided with same

Country Status (8)

Country Link
JP (1) JP5992229B2 (en)
KR (1) KR102070744B1 (en)
CN (1) CN104395037B (en)
HK (1) HK1203889A1 (en)
MY (1) MY171474A (en)
SG (1) SG11201408744UA (en)
TW (1) TWI566320B (en)
WO (1) WO2014003029A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7104081B2 (en) * 2020-01-30 2022-07-20 株式会社鈴木 Work supply device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4742400Y1 (en) 1968-12-09 1972-12-21
JPS606115Y2 (en) * 1980-03-18 1985-02-26 神鋼アルフレツシユ株式会社 Support frame device for renovated buildings
JPH0447159Y2 (en) * 1985-05-14 1992-11-06
JPS62216243A (en) * 1986-03-17 1987-09-22 Tokyo Seimitsu Co Ltd Extruder for wafer
JPH066115Y2 (en) * 1987-03-16 1994-02-16 東京エレクトロン株式会社 Wafer supply device
JP3238786B2 (en) * 1993-03-23 2001-12-17 ローム株式会社 Lead frame or printed circuit board feeding device
JP2000298099A (en) * 1999-04-15 2000-10-24 Citizen Watch Co Ltd Component inspection method, component control method and component sorting method
JP3943293B2 (en) * 1999-08-17 2007-07-11 武蔵エンジニアリング株式会社 Work feeder with overload detection function
JP4742400B2 (en) * 1999-10-01 2011-08-10 パナソニック株式会社 Pusher and loader
KR100750413B1 (en) * 1999-12-16 2007-08-21 지멘스 악티엔게젤샤프트 Assembly device comprising several transport lines for substrates to be assembled
DE10117023A1 (en) * 2001-04-05 2002-10-10 Bsh Bosch Siemens Hausgeraete Cooking appliance
US20030002964A1 (en) * 2001-06-27 2003-01-02 Hee Wee Boon Handler system incorporating a semi-automatic tray replacement apparatus and method of use
JP4278584B2 (en) * 2004-08-03 2009-06-17 日新工機株式会社 Pool floor lifting device
PT2287082E (en) * 2009-08-17 2012-06-18 Tetra Laval Holdings & Finance Multilayer sheet packaging material for producing sealed packages of pourable food products

Also Published As

Publication number Publication date
JP5992229B2 (en) 2016-09-14
JP2014008567A (en) 2014-01-20
KR20150021130A (en) 2015-02-27
SG11201408744UA (en) 2015-02-27
MY171474A (en) 2019-10-15
KR102070744B1 (en) 2020-01-29
CN104395037A (en) 2015-03-04
CN104395037B (en) 2017-02-22
TWI566320B (en) 2017-01-11
WO2014003029A1 (en) 2014-01-03
TW201409600A (en) 2014-03-01

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