MY171474A - Workpiece ejection device and workpiece supply device provided with same - Google Patents

Workpiece ejection device and workpiece supply device provided with same

Info

Publication number
MY171474A
MY171474A MYPI2014704044A MYPI2014704044A MY171474A MY 171474 A MY171474 A MY 171474A MY PI2014704044 A MYPI2014704044 A MY PI2014704044A MY PI2014704044 A MYPI2014704044 A MY PI2014704044A MY 171474 A MY171474 A MY 171474A
Authority
MY
Malaysia
Prior art keywords
workpiece
ejection
ejection member
supply device
same
Prior art date
Application number
MYPI2014704044A
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Eng Inc filed Critical Musashi Eng Inc
Publication of MY171474A publication Critical patent/MY171474A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coating Apparatus (AREA)

Abstract

To provide a workpiece ejection device (1) in which flexure of an ejection member (2) is small, a height of a leading end can be maintained constant, and a long service life is ensured, and a workpiece supply device. Solution: The workpiece ejection device includes an ejection member (2) and a driving unit (23) that pushes the ejection member in a first direction, the ejection member pushing a workpiece in a second direction that is different from the first direction, wherein the ejection member includes a plurality of connecting pieces (3) and a string-like member (12) that interconnects the plural connecting pieces in a bendable fashion, and a direction turning section (41) is provided to turn an advancing direction of the ejection member to the second direction. The workpiece supply device includes the workpiece ejection device, a magazine mounting unit, and an elevator (56) that moves the magazine mounting unit up and down.
MYPI2014704044A 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same MY171474A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012146240A JP5992229B2 (en) 2012-06-29 2012-06-29 Work extruding apparatus and work supplying apparatus having the same

Publications (1)

Publication Number Publication Date
MY171474A true MY171474A (en) 2019-10-15

Family

ID=49783170

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014704044A MY171474A (en) 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same

Country Status (8)

Country Link
JP (1) JP5992229B2 (en)
KR (1) KR102070744B1 (en)
CN (1) CN104395037B (en)
HK (1) HK1203889A1 (en)
MY (1) MY171474A (en)
SG (1) SG11201408744UA (en)
TW (1) TWI566320B (en)
WO (1) WO2014003029A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7104081B2 (en) * 2020-01-30 2022-07-20 株式会社鈴木 Work supply device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4742400Y1 (en) 1968-12-09 1972-12-21
JPS606115Y2 (en) * 1980-03-18 1985-02-26 神鋼アルフレツシユ株式会社 Support frame device for renovated buildings
JPH0447159Y2 (en) * 1985-05-14 1992-11-06
JPS62216243A (en) * 1986-03-17 1987-09-22 Tokyo Seimitsu Co Ltd Extruder for wafer
JPH066115Y2 (en) * 1987-03-16 1994-02-16 東京エレクトロン株式会社 Wafer supply device
JP3238786B2 (en) * 1993-03-23 2001-12-17 ローム株式会社 Lead frame or printed circuit board feeding device
JP2000298099A (en) * 1999-04-15 2000-10-24 Citizen Watch Co Ltd Component inspection method, component control method and component sorting method
JP3943293B2 (en) * 1999-08-17 2007-07-11 武蔵エンジニアリング株式会社 Work feeder with overload detection function
JP4742400B2 (en) * 1999-10-01 2011-08-10 パナソニック株式会社 Pusher and loader
KR100750413B1 (en) * 1999-12-16 2007-08-21 지멘스 악티엔게젤샤프트 Assembly device comprising several transport lines for substrates to be assembled
DE10117023A1 (en) * 2001-04-05 2002-10-10 Bsh Bosch Siemens Hausgeraete Cooking appliance
US20030002964A1 (en) * 2001-06-27 2003-01-02 Hee Wee Boon Handler system incorporating a semi-automatic tray replacement apparatus and method of use
JP4278584B2 (en) * 2004-08-03 2009-06-17 日新工機株式会社 Pool floor lifting device
ATE554018T1 (en) * 2009-08-17 2012-05-15 Tetra Laval Holdings & Finance MULTI-LAYER FILM PACKAGING MATERIAL FOR PRODUCING SEALED PACKAGINGS FOR POURABLE FOOD PRODUCTS

Also Published As

Publication number Publication date
KR102070744B1 (en) 2020-01-29
JP2014008567A (en) 2014-01-20
TW201409600A (en) 2014-03-01
CN104395037B (en) 2017-02-22
CN104395037A (en) 2015-03-04
WO2014003029A1 (en) 2014-01-03
HK1203889A1 (en) 2015-11-06
JP5992229B2 (en) 2016-09-14
TWI566320B (en) 2017-01-11
SG11201408744UA (en) 2015-02-27
KR20150021130A (en) 2015-02-27

Similar Documents

Publication Publication Date Title
MX2017014571A (en) In-vehicle drive device.
MX2015000750A (en) Trigger dispenser.
MX344531B (en) Flexible conveyance system.
WO2013074970A8 (en) Motive device for use in magnetically-sensitive environments
GB2509472B (en) Display with dual-edge light-emitting diode backlight
MY165233A (en) Mechanical locking system for floor panels
MX2015011113A (en) Cleaning head assemblies having touch-free attachment and alignment technology.
MX369615B (en) Hot-press stamping cooling method and hot-press stamping device.
MX2014002277A (en) Protected wear assembly for material handling apparatus.
EP3238278A4 (en) Improved efficiency lighting apparatus with led directly mounted to a heatsink
EP2549307A3 (en) Light guide plate and backlight assembly including the same
PH12018500234B1 (en) Electric vehicle
PH12016501010A1 (en) Fluid ejection apparatus with single power supply connector
MY182565A (en) Led streetlamp
MY171474A (en) Workpiece ejection device and workpiece supply device provided with same
PH12016500036A1 (en) Vehicle assembly line
EA026321B9 (en) Marking device for marking an object with marking light
FR2976417B1 (en) STABILIZED CONTINUOUS POWER SUPPLY DEVICE WITH MULTIPLE OUTPUTS
GB201118058D0 (en) Fastening member and a fastening system
EP2639017A3 (en) Status indicating device for a power nail gun
TW201614247A (en) Test unit positioning mechanism of test device and test equipment using same
PH12015500075A1 (en) Delivery unit for a liquid additive
GB2536851B (en) Driver module for driving LEDs
MY174547A (en) Fluid ejection apparatus with single power supply connector
AU328408S (en) Right side power base fin with flanged base for detachable fin attachment