HK1203889A1 - 工件擠出裝置及具備其的工件供給裝置 - Google Patents

工件擠出裝置及具備其的工件供給裝置

Info

Publication number
HK1203889A1
HK1203889A1 HK15104374.1A HK15104374A HK1203889A1 HK 1203889 A1 HK1203889 A1 HK 1203889A1 HK 15104374 A HK15104374 A HK 15104374A HK 1203889 A1 HK1203889 A1 HK 1203889A1
Authority
HK
Hong Kong
Prior art keywords
workpiece
same
supply device
device provided
ejection device
Prior art date
Application number
HK15104374.1A
Other languages
English (en)
Inventor
生島和正
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1203889A1 publication Critical patent/HK1203889A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
  • Coating Apparatus (AREA)
HK15104374.1A 2012-06-29 2015-05-08 工件擠出裝置及具備其的工件供給裝置 HK1203889A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012146240A JP5992229B2 (ja) 2012-06-29 2012-06-29 ワーク押出装置およびそれを備えるワーク供給装置
PCT/JP2013/067438 WO2014003029A1 (ja) 2012-06-29 2013-06-26 ワーク押出装置およびそれを備えるワーク供給装置

Publications (1)

Publication Number Publication Date
HK1203889A1 true HK1203889A1 (zh) 2015-11-06

Family

ID=49783170

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104374.1A HK1203889A1 (zh) 2012-06-29 2015-05-08 工件擠出裝置及具備其的工件供給裝置

Country Status (8)

Country Link
JP (1) JP5992229B2 (zh)
KR (1) KR102070744B1 (zh)
CN (1) CN104395037B (zh)
HK (1) HK1203889A1 (zh)
MY (1) MY171474A (zh)
SG (1) SG11201408744UA (zh)
TW (1) TWI566320B (zh)
WO (1) WO2014003029A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7104081B2 (ja) * 2020-01-30 2022-07-20 株式会社鈴木 ワーク供給装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4742400Y1 (zh) 1968-12-09 1972-12-21
JPS606115Y2 (ja) * 1980-03-18 1985-02-26 神鋼アルフレツシユ株式会社 改装建物用支持枠装置
JPH0447159Y2 (zh) * 1985-05-14 1992-11-06
JPS62216243A (ja) * 1986-03-17 1987-09-22 Tokyo Seimitsu Co Ltd ウエ−ハ押し出し装置
JPH066115Y2 (ja) * 1987-03-16 1994-02-16 東京エレクトロン株式会社 ウエハ供給装置
JP3238786B2 (ja) * 1993-03-23 2001-12-17 ローム株式会社 リードフレーム又はプリント基板の繰り出し装置
JP2000298099A (ja) * 1999-04-15 2000-10-24 Citizen Watch Co Ltd 部品検査方法、部品管理方法および部品選別方法
JP3943293B2 (ja) * 1999-08-17 2007-07-11 武蔵エンジニアリング株式会社 過負荷検出機能を備えたワークフィーダ
JP4742400B2 (ja) * 1999-10-01 2011-08-10 パナソニック株式会社 プッシャおよびローダ
DE50010887D1 (de) * 1999-12-16 2005-09-08 Siemens Ag Bestückvorrichtung mit mehreren transportstrecken für zu bestückende substrate
DE10117023A1 (de) * 2001-04-05 2002-10-10 Bsh Bosch Siemens Hausgeraete Gargerät
US20030002964A1 (en) * 2001-06-27 2003-01-02 Hee Wee Boon Handler system incorporating a semi-automatic tray replacement apparatus and method of use
JP4278584B2 (ja) * 2004-08-03 2009-06-17 日新工機株式会社 プール床の昇降装置
EP2287082B1 (en) * 2009-08-17 2012-04-18 Tetra Laval Holdings & Finance S.A. Multilayer sheet packaging material for producing sealed packages of pourable food products

Also Published As

Publication number Publication date
SG11201408744UA (en) 2015-02-27
CN104395037A (zh) 2015-03-04
WO2014003029A1 (ja) 2014-01-03
TW201409600A (zh) 2014-03-01
TWI566320B (zh) 2017-01-11
KR102070744B1 (ko) 2020-01-29
KR20150021130A (ko) 2015-02-27
JP2014008567A (ja) 2014-01-20
JP5992229B2 (ja) 2016-09-14
MY171474A (en) 2019-10-15
CN104395037B (zh) 2017-02-22

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