MY171474A - Workpiece ejection device and workpiece supply device provided with same - Google Patents

Workpiece ejection device and workpiece supply device provided with same

Info

Publication number
MY171474A
MY171474A MYPI2014704044A MYPI2014704044A MY171474A MY 171474 A MY171474 A MY 171474A MY PI2014704044 A MYPI2014704044 A MY PI2014704044A MY PI2014704044 A MYPI2014704044 A MY PI2014704044A MY 171474 A MY171474 A MY 171474A
Authority
MY
Malaysia
Prior art keywords
workpiece
ejection
ejection member
supply device
same
Prior art date
Application number
MYPI2014704044A
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Eng Inc filed Critical Musashi Eng Inc
Publication of MY171474A publication Critical patent/MY171474A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coating Apparatus (AREA)
MYPI2014704044A 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same MY171474A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012146240A JP5992229B2 (ja) 2012-06-29 2012-06-29 ワーク押出装置およびそれを備えるワーク供給装置

Publications (1)

Publication Number Publication Date
MY171474A true MY171474A (en) 2019-10-15

Family

ID=49783170

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014704044A MY171474A (en) 2012-06-29 2013-06-26 Workpiece ejection device and workpiece supply device provided with same

Country Status (8)

Country Link
JP (1) JP5992229B2 (ko)
KR (1) KR102070744B1 (ko)
CN (1) CN104395037B (ko)
HK (1) HK1203889A1 (ko)
MY (1) MY171474A (ko)
SG (1) SG11201408744UA (ko)
TW (1) TWI566320B (ko)
WO (1) WO2014003029A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7104081B2 (ja) * 2020-01-30 2022-07-20 株式会社鈴木 ワーク供給装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4742400Y1 (ko) 1968-12-09 1972-12-21
JPS606115Y2 (ja) * 1980-03-18 1985-02-26 神鋼アルフレツシユ株式会社 改装建物用支持枠装置
JPH0447159Y2 (ko) * 1985-05-14 1992-11-06
JPS62216243A (ja) * 1986-03-17 1987-09-22 Tokyo Seimitsu Co Ltd ウエ−ハ押し出し装置
JPH066115Y2 (ja) * 1987-03-16 1994-02-16 東京エレクトロン株式会社 ウエハ供給装置
JP3238786B2 (ja) * 1993-03-23 2001-12-17 ローム株式会社 リードフレーム又はプリント基板の繰り出し装置
JP2000298099A (ja) * 1999-04-15 2000-10-24 Citizen Watch Co Ltd 部品検査方法、部品管理方法および部品選別方法
JP3943293B2 (ja) * 1999-08-17 2007-07-11 武蔵エンジニアリング株式会社 過負荷検出機能を備えたワークフィーダ
JP4742400B2 (ja) * 1999-10-01 2011-08-10 パナソニック株式会社 プッシャおよびローダ
KR100750413B1 (ko) * 1999-12-16 2007-08-21 지멘스 악티엔게젤샤프트 조립될 기판을 위한 다수의 이송 라인을 포함하는 조립장치
DE10117023A1 (de) * 2001-04-05 2002-10-10 Bsh Bosch Siemens Hausgeraete Gargerät
US20030002964A1 (en) * 2001-06-27 2003-01-02 Hee Wee Boon Handler system incorporating a semi-automatic tray replacement apparatus and method of use
JP4278584B2 (ja) * 2004-08-03 2009-06-17 日新工機株式会社 プール床の昇降装置
PT2287082E (pt) * 2009-08-17 2012-06-18 Tetra Laval Holdings & Finance Material de embalagem em folha de múltiplas camadas para produzir embalagens seladas de produtos alimentares que se podem vazar

Also Published As

Publication number Publication date
JP5992229B2 (ja) 2016-09-14
JP2014008567A (ja) 2014-01-20
KR20150021130A (ko) 2015-02-27
HK1203889A1 (en) 2015-11-06
SG11201408744UA (en) 2015-02-27
KR102070744B1 (ko) 2020-01-29
CN104395037A (zh) 2015-03-04
CN104395037B (zh) 2017-02-22
TWI566320B (zh) 2017-01-11
WO2014003029A1 (ja) 2014-01-03
TW201409600A (zh) 2014-03-01

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