JP5989338B2 - 処理液生成装置、処理液生成方法、基板処理装置及び基板処理方法 - Google Patents

処理液生成装置、処理液生成方法、基板処理装置及び基板処理方法 Download PDF

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JP5989338B2
JP5989338B2 JP2011288361A JP2011288361A JP5989338B2 JP 5989338 B2 JP5989338 B2 JP 5989338B2 JP 2011288361 A JP2011288361 A JP 2011288361A JP 2011288361 A JP2011288361 A JP 2011288361A JP 5989338 B2 JP5989338 B2 JP 5989338B2
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gas
liquid
carbon dioxide
dissolution
amount
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JP2013136024A5 (enExample
JP2013136024A (ja
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廣瀬　治道
治道 廣瀬
淳 木名瀬
淳 木名瀬
博隆 小山
博隆 小山
邦浩 宮崎
邦浩 宮崎
高志 宮本
高志 宮本
翔 戸板
翔 戸板
宏 城所
宏 城所
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2011288361A 2011-12-28 2011-12-28 処理液生成装置、処理液生成方法、基板処理装置及び基板処理方法 Active JP5989338B2 (ja)

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JP2013136024A5 JP2013136024A5 (enExample) 2015-02-19
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WO2015030035A1 (ja) * 2013-08-28 2015-03-05 国立大学法人筑波大学 洗浄装置および洗浄方法
KR20160138280A (ko) * 2014-03-31 2016-12-02 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 반도체의 제조 방법 및 웨이퍼 기판의 세정 방법
JP6608515B2 (ja) * 2014-08-26 2019-11-20 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置
JP2017050460A (ja) * 2015-09-03 2017-03-09 株式会社ディスコ 溶液製造装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
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JPH0763687B2 (ja) * 1986-06-11 1995-07-12 株式会社オ−・エイチ・エル 物品洗浄方法及び装置
JP2002172318A (ja) * 2000-09-27 2002-06-18 Dainippon Ink & Chem Inc 超純水の比抵抗調整装置及び調整方法
JP2005093873A (ja) * 2003-09-19 2005-04-07 Ebara Corp 基板処理装置
JP2004344821A (ja) * 2003-05-23 2004-12-09 Nomura Micro Sci Co Ltd 超純水又は純水の帯電防止方法及び帯電防止装置
JPWO2008050832A1 (ja) * 2006-10-27 2010-02-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体

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