JP5988569B2 - 決定方法、決定装置およびプログラム - Google Patents

決定方法、決定装置およびプログラム Download PDF

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Publication number
JP5988569B2
JP5988569B2 JP2011268368A JP2011268368A JP5988569B2 JP 5988569 B2 JP5988569 B2 JP 5988569B2 JP 2011268368 A JP2011268368 A JP 2011268368A JP 2011268368 A JP2011268368 A JP 2011268368A JP 5988569 B2 JP5988569 B2 JP 5988569B2
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JP
Japan
Prior art keywords
pattern
mask
value
calculation step
evaluation function
Prior art date
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JP2011268368A
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English (en)
Japanese (ja)
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JP2013120290A5 (https=
JP2013120290A (ja
Inventor
裕一 行田
裕一 行田
晃司 三上
晃司 三上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011268368A priority Critical patent/JP5988569B2/ja
Priority to US13/685,791 priority patent/US8839169B2/en
Priority to KR1020120141155A priority patent/KR101597866B1/ko
Publication of JP2013120290A publication Critical patent/JP2013120290A/ja
Publication of JP2013120290A5 publication Critical patent/JP2013120290A5/ja
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Publication of JP5988569B2 publication Critical patent/JP5988569B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Architecture (AREA)
  • Software Systems (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2011268368A 2011-12-07 2011-12-07 決定方法、決定装置およびプログラム Active JP5988569B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011268368A JP5988569B2 (ja) 2011-12-07 2011-12-07 決定方法、決定装置およびプログラム
US13/685,791 US8839169B2 (en) 2011-12-07 2012-11-27 Pattern determining method, pattern determining apparatus and storage medium
KR1020120141155A KR101597866B1 (ko) 2011-12-07 2012-12-06 패턴 결정 방법, 패턴 결정 장치, 및 저장 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011268368A JP5988569B2 (ja) 2011-12-07 2011-12-07 決定方法、決定装置およびプログラム

Publications (3)

Publication Number Publication Date
JP2013120290A JP2013120290A (ja) 2013-06-17
JP2013120290A5 JP2013120290A5 (https=) 2015-01-29
JP5988569B2 true JP5988569B2 (ja) 2016-09-07

Family

ID=48572277

Family Applications (1)

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JP2011268368A Active JP5988569B2 (ja) 2011-12-07 2011-12-07 決定方法、決定装置およびプログラム

Country Status (3)

Country Link
US (1) US8839169B2 (https=)
JP (1) JP5988569B2 (https=)
KR (1) KR101597866B1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102029645B1 (ko) * 2013-01-14 2019-11-18 삼성전자 주식회사 맞춤형 마스크의 제조 방법 및 맞춤형 마스크를 이용한 반도체 장치의 제조 방법
US10338480B2 (en) 2014-05-30 2019-07-02 Nikon Corporation Lithography system, simulation apparatus, and pattern forming method
WO2016096365A1 (en) * 2014-12-17 2016-06-23 Asml Netherlands B.V. Method and apparatus for using patterning device topography induced phase
TWI745351B (zh) * 2017-02-24 2021-11-11 聯華電子股份有限公司 半導體佈局圖案分割方法
CN108196422B (zh) * 2017-12-14 2021-05-11 中国电子科技集团公司第四十七研究所 一种提高分步重复精缩机制作4寸版曝光面积的方法
US12372864B2 (en) * 2020-10-22 2025-07-29 D2S, Inc. Methods and systems to determine shapes for semiconductor or flat panel display fabrication
CN113495435B (zh) * 2021-05-26 2023-08-08 暨南大学 一种数字掩模投影光刻优化方法及系统
JP2023045120A (ja) * 2021-09-21 2023-04-03 キオクシア株式会社 マスク設計方法及びその記録媒体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3445045B2 (ja) 1994-12-29 2003-09-08 キヤノン株式会社 投影露光装置及びそれを用いたデバイスの製造方法
JP2001318455A (ja) * 2000-05-12 2001-11-16 Hitachi Ltd 半導体集積回路装置の製造方法
JP2002190443A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 露光方法およびその露光システム
US6792592B2 (en) 2002-08-30 2004-09-14 Numerical Technologies, Inc. Considering mask writer properties during the optical proximity correction process
JP2004288694A (ja) * 2003-03-19 2004-10-14 Renesas Technology Corp 半導体装置の製造方法およびそのシステム
US6931617B2 (en) * 2003-04-21 2005-08-16 Synopsys, Inc. Mask cost driven logic optimization and synthesis
JP2004361507A (ja) * 2003-06-02 2004-12-24 Renesas Technology Corp フォトマスクの製造方法およびフォトマスク描画システム
WO2007019269A2 (en) * 2005-08-08 2007-02-15 Brion Technologies, Inc. System and method for creating a focus-exposure model of a lithography process
JP2008233355A (ja) * 2007-03-19 2008-10-02 Renesas Technology Corp フォトマスクの製造方法
JP5149719B2 (ja) * 2007-09-14 2013-02-20 ルネサスエレクトロニクス株式会社 フォトマスクの製造方法
US8390781B2 (en) * 2008-09-23 2013-03-05 Pinebrook Imaging Technology, Ltd. Optical imaging writer system
CN102224459B (zh) * 2008-11-21 2013-06-19 Asml荷兰有限公司 用于优化光刻过程的方法及设备
JP5182641B2 (ja) * 2008-12-01 2013-04-17 凸版印刷株式会社 フォトマスクのパターンデータ生成方法、フォトマスクのパターンデータ生成装置、およびプログラム
KR101198348B1 (ko) * 2009-10-28 2012-11-06 에이에스엠엘 네델란즈 비.브이. 풀-칩 소스 및 마스크 최적화를 위한 패턴 선택
US8739079B2 (en) * 2009-10-30 2014-05-27 Canon Kabushiki Kaisha Recording medium and determination method
JP2011197520A (ja) * 2010-03-23 2011-10-06 Toppan Printing Co Ltd フォトマスク製造方法

Also Published As

Publication number Publication date
US20130149636A1 (en) 2013-06-13
US8839169B2 (en) 2014-09-16
KR101597866B1 (ko) 2016-02-25
KR20130064029A (ko) 2013-06-17
JP2013120290A (ja) 2013-06-17

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