JP5981047B2 - プリント基板におけるビア構造の選択的パーティショニング - Google Patents
プリント基板におけるビア構造の選択的パーティショニング Download PDFInfo
- Publication number
- JP5981047B2 JP5981047B2 JP2015544037A JP2015544037A JP5981047B2 JP 5981047 B2 JP5981047 B2 JP 5981047B2 JP 2015544037 A JP2015544037 A JP 2015544037A JP 2015544037 A JP2015544037 A JP 2015544037A JP 5981047 B2 JP5981047 B2 JP 5981047B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating resist
- hole
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (8)
- ビア内の2つの導電部間に電気的絶縁部を作製するように、多層プリント基板(200)において前記ビアをパーティショニングする方法であって、
少なくとも1つの島状の第1のめっきレジスト層(233)を、第1の導電層(205)及び第1の誘電体層(222)を備える第1の層構造上に配置すること(1)、並びに、少なくとも1つの島状の第2のめっきレジスト層(234)を、第2の導電層(206)及び第2の誘電体層(223)を備える第2の層構造上に配置するステップ(1)、
前記第1の層構造及び第2の層構造を、前記島状の第1のめっきレジスト層(233)及び前記島状の第2のめっきレジスト層(234)が、少なくとも1つの第3の誘電体層(213)内に埋め込まれることになるように適合される、前記少なくとも1つの第3の誘電体層(213)を備える、第3の中間層構造と、積層するステップ(2)、
第1の孔(240)が前記島状の第1のめっきレジスト層(233)及び前記島状の第2のめっきレジスト層(234)を貫通するように、前記多層プリント基板(200)に前記第1の孔(240)を穿孔するステップ(3)、
前記第1及び第2のめっきレジスト層(233、234)を備える部分(252、253)を除く前記第1の孔(240)の内部に、銅が配置されるように、前記多層プリント基板(200)を銅シード触媒浴内に配置するステップ(4)、
前記第1及び第2のめっきレジスト層(233、234)を備える部分(252、253)を除き、且つ、前記少なくとも1つの第3の誘電体層(213)の部分(255)を除く、前記第1の孔(240)の内部に、追加の銅が配置されるように、前記多層プリント基板(200)を、前記第1の孔(240)の前記少なくとも1つの第3の誘電体層部分(255)上に配置された銅が、前記第1の導電層(205)及び前記第2の導電層(206)から電気的に絶縁される、電解銅めっき浴内に配置するステップ(5)、
前記第1の孔(240)の前記少なくとも1つの第3の誘電体層部分(255)に配置された銅を除去するステップ(6)
を含む、方法。 - 前記第1の孔(240)の前記少なくとも1つの第3の誘電体層部分(255)から銅を除去するステップ(6)は、マイクロエッチングによって実施される、請求項1に記載の方法。
- 前記少なくとも1つの第3の誘電体層(213)は、前記島状の第1のめっきレジスト層(233)及び前記島状の第2のめっきレジスト層(234)を埋め込むように適合される、含浸された繊維織布で作製される、請求項1又は2に記載の方法。
- 前記第1の孔(240)は、前記多層プリント基板(200)に部分的に貫入する、請求項1から3のいずれか一項に記載の方法。
- 前記第1の孔(240)は、前記多層プリント基板(200)を貫通するスルーホールである、請求項1から3のいずれか一項に記載の方法。
- 前記第1の孔を穿孔するステップ(3)は、異なる径を有する、前記ビアの2つの部分(530、535)を作製するように、前記多層プリント基板の反対側からより大きいドリルで穿孔する追加のステップを含み、
前記2つの部分(530、535)が、前記第1のめっきレジスト層(541)と前記第2のめっきレジスト層(542)との間の位置で、互いと繋がる、
請求項5に記載の方法。 - 少なくとも1つのマイクロプロセッサ、並びに、前記少なくとも1つのマイクロプロセッサによって実行される場合に、請求項1から6のいずれか一項に記載の方法ステップを実施するために製造設備を制御するように構成される、コンピュータ可読指令を含むコンピュータ可読媒体を備える、装置。
- ビア内の2つの導電部間に電気的絶縁部を有する、少なくとも1つの前記ビアを備える多層プリント基板(200)であって、前記少なくとも1つのビアが、請求項1から6のいずれか一項に記載の方法に従って作製される、多層プリント基板(200)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361831400P | 2013-06-05 | 2013-06-05 | |
US61/831,400 | 2013-06-05 | ||
PCT/SE2014/050619 WO2014196911A1 (en) | 2013-06-05 | 2014-05-20 | Selective partitioning of via structures in printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016502272A JP2016502272A (ja) | 2016-01-21 |
JP5981047B2 true JP5981047B2 (ja) | 2016-08-31 |
Family
ID=50928218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015544037A Active JP5981047B2 (ja) | 2013-06-05 | 2014-05-20 | プリント基板におけるビア構造の選択的パーティショニング |
Country Status (16)
Country | Link |
---|---|
US (2) | US10034391B2 (ja) |
EP (2) | EP3131374A1 (ja) |
JP (1) | JP5981047B2 (ja) |
KR (1) | KR101748507B1 (ja) |
CN (1) | CN104782238B (ja) |
AU (1) | AU2014275589B2 (ja) |
BR (1) | BR112015008761B1 (ja) |
HK (1) | HK1210903A1 (ja) |
IN (1) | IN2015DN02964A (ja) |
MX (1) | MX348666B (ja) |
MY (1) | MY175132A (ja) |
PH (1) | PH12015502555B1 (ja) |
RU (1) | RU2630416C2 (ja) |
SG (1) | SG11201509323RA (ja) |
WO (1) | WO2014196911A1 (ja) |
ZA (1) | ZA201502653B (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9781844B2 (en) * | 2013-03-15 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
US10820427B2 (en) | 2013-03-15 | 2020-10-27 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
US9801277B1 (en) | 2013-08-27 | 2017-10-24 | Flextronics Ap, Llc | Bellows interconnect |
US9867290B2 (en) * | 2015-03-19 | 2018-01-09 | Multek Technologies Limited | Selective segment via plating process and structure |
US10264720B1 (en) | 2015-06-23 | 2019-04-16 | Flextronics Ap, Llc | Lead trimming module |
US10100607B2 (en) | 2015-10-19 | 2018-10-16 | Baker Hughes, A Ge Company, Llc | High temperature, bi-directional shear seal and related methods |
US10321560B2 (en) | 2015-11-12 | 2019-06-11 | Multek Technologies Limited | Dummy core plus plating resist restrict resin process and structure |
US10292279B2 (en) * | 2016-04-27 | 2019-05-14 | Multek Technologies Limited | Disconnect cavity by plating resist process and structure |
US10712398B1 (en) | 2016-06-21 | 2020-07-14 | Multek Technologies Limited | Measuring complex PCB-based interconnects in a production environment |
EP3482566B1 (en) | 2016-07-08 | 2024-02-28 | InterDigital Madison Patent Holdings, SAS | Systems and methods for region-of-interest tone remapping |
US9872399B1 (en) * | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
US10499500B2 (en) * | 2016-11-04 | 2019-12-03 | Flex Ltd. | Circuit board with embedded metal pallet and a method of fabricating the circuit board |
CN108168444B (zh) | 2016-11-17 | 2021-03-30 | 马尔泰克技术有限公司 | 用于pcb应用的在空气悬浮上的在线计量 |
US10182494B1 (en) | 2017-09-07 | 2019-01-15 | Flex Ltd. | Landless via concept |
KR20190041215A (ko) * | 2017-10-12 | 2019-04-22 | 주식회사 아모그린텍 | 인쇄회로기판 제조 방법 및 이에 의해 제조된 인쇄회로기판 |
CN107708335A (zh) * | 2017-11-07 | 2018-02-16 | 竞华电子(深圳)有限公司 | 一种多层pcb板的线路制作方法 |
CN107960019A (zh) * | 2017-11-21 | 2018-04-24 | 生益电子股份有限公司 | 一种实现零残桩的pcb制作方法及pcb |
US10212828B1 (en) * | 2017-11-27 | 2019-02-19 | International Business Machines Corporation | Via stub elimination by disrupting plating |
US11039531B1 (en) | 2018-02-05 | 2021-06-15 | Flex Ltd. | System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features |
CN108449886B (zh) * | 2018-04-04 | 2019-08-20 | 生益电子股份有限公司 | 一种pcb的加工方法 |
CN109862718A (zh) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | 一种孔壁铜层在指定层断开的过孔加工方法及pcb |
CN112399708A (zh) * | 2019-08-12 | 2021-02-23 | 中兴通讯股份有限公司 | 一种印制电路板、支架和通流装置 |
CN110708864B (zh) * | 2019-10-16 | 2021-06-25 | 生益电子股份有限公司 | 一种含有散热介质的印制电路板及其制备方法 |
CN115988730A (zh) * | 2021-10-15 | 2023-04-18 | 奥特斯奥地利科技与系统技术有限公司 | 部件承载件、以及部件承载件的制造方法和使用方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2919953B2 (ja) | 1990-11-30 | 1999-07-19 | 株式会社東芝 | 多層基板の製造方法 |
DE69520370T2 (de) | 1994-12-15 | 2001-10-31 | Exxon Chemical Patents Inc | Polymerisationskatalysatorsysteme, ihre herstellung und ihre verwendung |
US6426470B1 (en) * | 2001-01-17 | 2002-07-30 | International Business Machines Corporation | Formation of multisegmented plated through holes |
US6541712B1 (en) | 2001-12-04 | 2003-04-01 | Teradyhe, Inc. | High speed multi-layer printed circuit board via |
JP2003204157A (ja) * | 2001-12-28 | 2003-07-18 | Toshiba Corp | 多層プリント配線板、多層プリント配線板を搭載した電子機器および多層プリント配線板の製造方法 |
JP2003229666A (ja) * | 2002-02-04 | 2003-08-15 | Ibiden Co Ltd | 配線板の製造方法および配線板 |
US20040118605A1 (en) | 2002-12-20 | 2004-06-24 | Van Der Laan Ruud | Circuit board having a multi-functional hole |
US9781830B2 (en) | 2005-03-04 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
TWI389205B (zh) * | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | 使用抗鍍層分隔介層結構 |
RU2324307C2 (ru) | 2005-11-07 | 2008-05-10 | Юрий Васильевич Таланин | Способ изготовления печатной платы |
JP2012195389A (ja) * | 2011-03-15 | 2012-10-11 | Fujitsu Ltd | 配線基板、配線基板ユニット、電子装置、及び配線基板の製造方法 |
US9526184B2 (en) * | 2012-06-29 | 2016-12-20 | Viasystems, Inc. | Circuit board multi-functional hole system and method |
CN102781177B (zh) | 2012-07-20 | 2015-04-01 | 中兴通讯股份有限公司 | 印刷电路板钻孔加工的方法、印刷电路板及通信设备 |
US9781844B2 (en) * | 2013-03-15 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
KR102300288B1 (ko) * | 2014-01-22 | 2021-09-10 | 산미나 코포레이션 | 인쇄회로기판에 높은 종횡비로 도금된 관통 홀을 형성하고 높은 정밀도로 스터브를 제거하기 위한 방법 |
US9867290B2 (en) * | 2015-03-19 | 2018-01-09 | Multek Technologies Limited | Selective segment via plating process and structure |
-
2014
- 2014-05-20 EP EP16191313.2A patent/EP3131374A1/en not_active Withdrawn
- 2014-05-20 US US14/387,928 patent/US10034391B2/en active Active
- 2014-05-20 BR BR112015008761-2A patent/BR112015008761B1/pt not_active IP Right Cessation
- 2014-05-20 MY MYPI2015704367A patent/MY175132A/en unknown
- 2014-05-20 KR KR1020157015978A patent/KR101748507B1/ko active IP Right Grant
- 2014-05-20 RU RU2015155524A patent/RU2630416C2/ru active
- 2014-05-20 EP EP14729483.9A patent/EP2893784B1/en active Active
- 2014-05-20 SG SG11201509323RA patent/SG11201509323RA/en unknown
- 2014-05-20 JP JP2015544037A patent/JP5981047B2/ja active Active
- 2014-05-20 WO PCT/SE2014/050619 patent/WO2014196911A1/en active Application Filing
- 2014-05-20 CN CN201480003061.1A patent/CN104782238B/zh active Active
- 2014-05-20 IN IN2964DEN2015 patent/IN2015DN02964A/en unknown
- 2014-05-20 MX MX2015016517A patent/MX348666B/es active IP Right Grant
- 2014-05-20 AU AU2014275589A patent/AU2014275589B2/en active Active
-
2015
- 2015-04-20 ZA ZA2015/02653A patent/ZA201502653B/en unknown
- 2015-11-10 PH PH12015502555A patent/PH12015502555B1/en unknown
- 2015-11-25 HK HK15111579.9A patent/HK1210903A1/xx not_active IP Right Cessation
-
2018
- 2018-06-26 US US16/019,452 patent/US10201098B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
RU2630416C2 (ru) | 2017-09-07 |
EP2893784A1 (en) | 2015-07-15 |
MX348666B (es) | 2017-06-23 |
BR112015008761B1 (pt) | 2021-11-03 |
PH12015502555A1 (en) | 2016-02-22 |
MY175132A (en) | 2020-06-09 |
WO2014196911A1 (en) | 2014-12-11 |
EP3131374A1 (en) | 2017-02-15 |
EP2893784B1 (en) | 2016-10-05 |
PH12015502555B1 (en) | 2016-02-22 |
US20180310418A1 (en) | 2018-10-25 |
US20160021762A1 (en) | 2016-01-21 |
IN2015DN02964A (ja) | 2015-09-18 |
US10034391B2 (en) | 2018-07-24 |
KR101748507B1 (ko) | 2017-06-27 |
AU2014275589B2 (en) | 2017-03-16 |
AU2014275589A1 (en) | 2015-12-24 |
US10201098B2 (en) | 2019-02-05 |
BR112015008761A2 (pt) | 2017-07-04 |
CN104782238A (zh) | 2015-07-15 |
CN104782238B (zh) | 2018-05-29 |
SG11201509323RA (en) | 2015-12-30 |
KR20150085062A (ko) | 2015-07-22 |
JP2016502272A (ja) | 2016-01-21 |
HK1210903A1 (en) | 2016-05-06 |
ZA201502653B (en) | 2016-06-29 |
RU2015155524A (ru) | 2017-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5981047B2 (ja) | プリント基板におけるビア構造の選択的パーティショニング | |
US9883592B2 (en) | Wiring board and method for manufacturing the same | |
US9113569B2 (en) | Wiring board and method for manufacturing same | |
US9277640B2 (en) | Flexible printed circuit board and method for manufacturing same | |
US10321560B2 (en) | Dummy core plus plating resist restrict resin process and structure | |
US20170265298A1 (en) | Self-decap cavity fabrication process and structure | |
CN104883807B (zh) | 嵌入式板及其制造方法 | |
JP6795137B2 (ja) | 電子素子内蔵型印刷回路基板の製造方法 | |
KR102488164B1 (ko) | 프로파일된 도전성 층을 갖는 인쇄 회로 기판 및 그 제조 방법 | |
US9992880B2 (en) | Rigid-bend printed circuit board fabrication | |
JP2015159153A (ja) | 電子部品内蔵多層配線板 | |
US10772220B2 (en) | Dummy core restrict resin process and structure | |
KR20160080526A (ko) | 인쇄회로기판 및 그 제조방법 | |
WO2014128892A1 (ja) | プリント基板及びプリント基板の製造方法 | |
US9155199B2 (en) | Passive device embedded in substrate and substrate with passive device embedded therein | |
OA17662A (en) | Selective partitioning of via structures in printed circuit boards. | |
JPWO2014118916A1 (ja) | 部品内蔵基板の製造方法 | |
JP4963495B2 (ja) | 積層配線板およびその製造方法 | |
KR101936415B1 (ko) | 도전볼을 이용한 동박 적층판의 제조방법 | |
KR20090050140A (ko) | 칩 형태의 수동 소자가 내장된 인쇄 회로 기판 및 그 제조방법 | |
CN106211542A (zh) | 电路板及其制造方法 | |
JP2006210873A (ja) | 部分ビルドアップ配線板の製造方法 | |
JPH07221458A (ja) | 多層プリント配線板 | |
KR20180054729A (ko) | 다층 배선판 및 그의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160616 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160628 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160727 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5981047 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |