JP5980566B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5980566B2
JP5980566B2 JP2012112990A JP2012112990A JP5980566B2 JP 5980566 B2 JP5980566 B2 JP 5980566B2 JP 2012112990 A JP2012112990 A JP 2012112990A JP 2012112990 A JP2012112990 A JP 2012112990A JP 5980566 B2 JP5980566 B2 JP 5980566B2
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Japan
Prior art keywords
semiconductor chip
auxiliary member
resin
semiconductor device
thermal expansion
Prior art date
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Active
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JP2012112990A
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English (en)
Japanese (ja)
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JP2013239660A (ja
JP2013239660A5 (https=
Inventor
明宣 井上
明宣 井上
東夫 反町
東夫 反町
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012112990A priority Critical patent/JP5980566B2/ja
Priority to KR1020130049749A priority patent/KR101997548B1/ko
Priority to US13/892,483 priority patent/US9087781B2/en
Publication of JP2013239660A publication Critical patent/JP2013239660A/ja
Publication of JP2013239660A5 publication Critical patent/JP2013239660A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2012112990A 2012-05-17 2012-05-17 半導体装置及びその製造方法 Active JP5980566B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012112990A JP5980566B2 (ja) 2012-05-17 2012-05-17 半導体装置及びその製造方法
KR1020130049749A KR101997548B1 (ko) 2012-05-17 2013-05-03 반도체 장치 및 그 제조 방법
US13/892,483 US9087781B2 (en) 2012-05-17 2013-05-13 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012112990A JP5980566B2 (ja) 2012-05-17 2012-05-17 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013239660A JP2013239660A (ja) 2013-11-28
JP2013239660A5 JP2013239660A5 (https=) 2015-04-30
JP5980566B2 true JP5980566B2 (ja) 2016-08-31

Family

ID=49580690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012112990A Active JP5980566B2 (ja) 2012-05-17 2012-05-17 半導体装置及びその製造方法

Country Status (3)

Country Link
US (1) US9087781B2 (https=)
JP (1) JP5980566B2 (https=)
KR (1) KR101997548B1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9559064B2 (en) 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
KR102250997B1 (ko) * 2014-05-02 2021-05-12 삼성전자주식회사 반도체 패키지
JP2016046469A (ja) * 2014-08-26 2016-04-04 日東電工株式会社 半導体装置の製造方法及び封止用シート
CN106601629B (zh) * 2015-10-15 2018-11-30 力成科技股份有限公司 保护片服贴于芯片感应面的芯片封装构造
US10242927B2 (en) * 2015-12-31 2019-03-26 Mediatek Inc. Semiconductor package, semiconductor device using the same and manufacturing method thereof
WO2018038134A1 (ja) * 2016-08-23 2018-03-01 株式会社村田製作所 回路モジュール
US11264330B2 (en) 2017-08-04 2022-03-01 Nepes Co., Ltd. Chip package with connection portion that passes through an encapsulation portion
KR102144933B1 (ko) * 2017-08-04 2020-08-18 주식회사 네패스 칩 패키지 및 그 제조방법
KR102790247B1 (ko) 2020-06-25 2025-04-03 에스케이하이닉스 주식회사 보강층을 가진 반도체 패키지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3057130B2 (ja) * 1993-02-18 2000-06-26 三菱電機株式会社 樹脂封止型半導体パッケージおよびその製造方法
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US6104093A (en) * 1997-04-24 2000-08-15 International Business Machines Corporation Thermally enhanced and mechanically balanced flip chip package and method of forming
JP3565319B2 (ja) 1999-04-14 2004-09-15 シャープ株式会社 半導体装置及びその製造方法
JP3374812B2 (ja) * 1999-11-10 2003-02-10 日本電気株式会社 半導体装置
JP4390541B2 (ja) * 2003-02-03 2009-12-24 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP2007149931A (ja) * 2005-11-28 2007-06-14 Renesas Technology Corp 半導体装置およびその製造方法
JP4110189B2 (ja) * 2006-12-13 2008-07-02 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
JP2009230619A (ja) * 2008-03-25 2009-10-08 Fujitsu Ltd Ｉｃタグおよびその製造方法
JP2011135749A (ja) * 2009-12-25 2011-07-07 Sony Corp 電力供給装置、電力受電装置及び情報通知方法
JP2012009655A (ja) 2010-06-25 2012-01-12 Shinko Electric Ind Co Ltd 半導体パッケージおよび半導体パッケージの製造方法
JP2012009713A (ja) * 2010-06-25 2012-01-12 Shinko Electric Ind Co Ltd 半導体パッケージおよび半導体パッケージの製造方法
KR101719636B1 (ko) 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법

Also Published As

Publication number Publication date
JP2013239660A (ja) 2013-11-28
KR101997548B1 (ko) 2019-07-09
KR20130129100A (ko) 2013-11-27
US9087781B2 (en) 2015-07-21
US20130307163A1 (en) 2013-11-21

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