JP5964142B2 - 配線基板及び半導体装置 - Google Patents

配線基板及び半導体装置 Download PDF

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Publication number
JP5964142B2
JP5964142B2 JP2012124463A JP2012124463A JP5964142B2 JP 5964142 B2 JP5964142 B2 JP 5964142B2 JP 2012124463 A JP2012124463 A JP 2012124463A JP 2012124463 A JP2012124463 A JP 2012124463A JP 5964142 B2 JP5964142 B2 JP 5964142B2
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Japan
Prior art keywords
wiring board
substrate
substrate body
wiring
pads
Prior art date
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JP2012124463A
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English (en)
Japanese (ja)
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JP2013251372A (ja
JP2013251372A5 (enExample
Inventor
村山　啓
啓 村山
光浩 相澤
光浩 相澤
浩児 原
浩児 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012124463A priority Critical patent/JP5964142B2/ja
Publication of JP2013251372A publication Critical patent/JP2013251372A/ja
Publication of JP2013251372A5 publication Critical patent/JP2013251372A5/ja
Application granted granted Critical
Publication of JP5964142B2 publication Critical patent/JP5964142B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2012124463A 2012-05-31 2012-05-31 配線基板及び半導体装置 Active JP5964142B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012124463A JP5964142B2 (ja) 2012-05-31 2012-05-31 配線基板及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012124463A JP5964142B2 (ja) 2012-05-31 2012-05-31 配線基板及び半導体装置

Publications (3)

Publication Number Publication Date
JP2013251372A JP2013251372A (ja) 2013-12-12
JP2013251372A5 JP2013251372A5 (enExample) 2015-07-09
JP5964142B2 true JP5964142B2 (ja) 2016-08-03

Family

ID=49849783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012124463A Active JP5964142B2 (ja) 2012-05-31 2012-05-31 配線基板及び半導体装置

Country Status (1)

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JP (1) JP5964142B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022163598A1 (ja) * 2021-01-29 2022-08-04 京セラ株式会社 電子素子実装用基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5197920B2 (ja) * 2006-02-15 2013-05-15 株式会社フジクラ 貫通電極基板及びその製造方法

Also Published As

Publication number Publication date
JP2013251372A (ja) 2013-12-12

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