JP2013251372A5 - - Google Patents
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- Publication number
- JP2013251372A5 JP2013251372A5 JP2012124463A JP2012124463A JP2013251372A5 JP 2013251372 A5 JP2013251372 A5 JP 2013251372A5 JP 2012124463 A JP2012124463 A JP 2012124463A JP 2012124463 A JP2012124463 A JP 2012124463A JP 2013251372 A5 JP2013251372 A5 JP 2013251372A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pads
- crystal axis
- substrate
- substrate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012124463A JP5964142B2 (ja) | 2012-05-31 | 2012-05-31 | 配線基板及び半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012124463A JP5964142B2 (ja) | 2012-05-31 | 2012-05-31 | 配線基板及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013251372A JP2013251372A (ja) | 2013-12-12 |
| JP2013251372A5 true JP2013251372A5 (enExample) | 2015-07-09 |
| JP5964142B2 JP5964142B2 (ja) | 2016-08-03 |
Family
ID=49849783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012124463A Active JP5964142B2 (ja) | 2012-05-31 | 2012-05-31 | 配線基板及び半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5964142B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022163598A1 (ja) * | 2021-01-29 | 2022-08-04 | 京セラ株式会社 | 電子素子実装用基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5197920B2 (ja) * | 2006-02-15 | 2013-05-15 | 株式会社フジクラ | 貫通電極基板及びその製造方法 |
-
2012
- 2012-05-31 JP JP2012124463A patent/JP5964142B2/ja active Active
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