JP5959138B2 - 半導体ウェハ操作装置 - Google Patents
半導体ウェハ操作装置 Download PDFInfo
- Publication number
- JP5959138B2 JP5959138B2 JP2008558497A JP2008558497A JP5959138B2 JP 5959138 B2 JP5959138 B2 JP 5959138B2 JP 2008558497 A JP2008558497 A JP 2008558497A JP 2008558497 A JP2008558497 A JP 2008558497A JP 5959138 B2 JP5959138 B2 JP 5959138B2
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- JP
- Japan
- Prior art keywords
- wafer
- sensors
- semiconductor wafer
- interior
- inlets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Human Computer Interaction (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Element Separation (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
Applications Claiming Priority (19)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77947806P | 2006-03-05 | 2006-03-05 | |
US77968406P | 2006-03-05 | 2006-03-05 | |
US77946306P | 2006-03-05 | 2006-03-05 | |
US77960906P | 2006-03-05 | 2006-03-05 | |
US77970706P | 2006-03-05 | 2006-03-05 | |
US60/779,684 | 2006-03-05 | ||
US60/779,707 | 2006-03-05 | ||
US60/779,478 | 2006-03-05 | ||
US60/779,463 | 2006-03-05 | ||
US60/779,609 | 2006-03-05 | ||
US78483206P | 2006-03-21 | 2006-03-21 | |
US60/784,832 | 2006-03-21 | ||
US74616306P | 2006-05-01 | 2006-05-01 | |
US60/746,163 | 2006-05-01 | ||
US80718906P | 2006-07-12 | 2006-07-12 | |
US60/807,189 | 2006-07-12 | ||
US82345406P | 2006-08-24 | 2006-08-24 | |
US60/823,454 | 2006-08-24 | ||
PCT/US2007/063345 WO2007103896A2 (fr) | 2006-03-05 | 2007-03-05 | Procedes pour identifier le centre d'une plaquette. |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013111441A Division JP5689920B2 (ja) | 2006-03-05 | 2013-05-28 | ウェハ中心検出 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009529248A JP2009529248A (ja) | 2009-08-13 |
JP5959138B2 true JP5959138B2 (ja) | 2016-08-02 |
Family
ID=39494162
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008558497A Active JP5959138B2 (ja) | 2006-03-05 | 2007-03-05 | 半導体ウェハ操作装置 |
JP2013111441A Active JP5689920B2 (ja) | 2006-03-05 | 2013-05-28 | ウェハ中心検出 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013111441A Active JP5689920B2 (ja) | 2006-03-05 | 2013-05-28 | ウェハ中心検出 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5959138B2 (fr) |
KR (2) | KR20080111036A (fr) |
SG (1) | SG172675A1 (fr) |
WO (3) | WO2007103870A2 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
KR20100137429A (ko) | 2008-01-25 | 2010-12-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 입출력 및 챔버 슬릿 밸브를 위한 일체형 로컬 기판 중심 탐지장치를 위한 방법 및 장치 |
WO2011028597A1 (fr) * | 2009-08-26 | 2011-03-10 | Veeco Instruments, Inc. | Système de fabrication d'un motif sur des supports d'enregistrement magnétiques |
US8406918B2 (en) * | 2009-12-21 | 2013-03-26 | WD Media, LLC | Master teaching jig |
US11587813B2 (en) | 2013-12-17 | 2023-02-21 | Brooks Automation Us, Llc | Substrate transport apparatus |
JP7409800B2 (ja) | 2019-08-09 | 2024-01-09 | 川崎重工業株式会社 | ロボット制御装置、ロボット、及びロボット制御方法 |
CN110767587B (zh) * | 2019-10-21 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | 一种晶圆处理装置和上下料方法 |
KR102289382B1 (ko) * | 2019-12-31 | 2021-08-12 | 한국기술교육대학교 산학협력단 | 반도체 공장용 위치보정방법 |
US11813757B2 (en) * | 2020-10-13 | 2023-11-14 | Applied Materials, Inc. | Centerfinding for a process kit or process kit carrier at a manufacturing system |
KR20220077384A (ko) | 2020-12-02 | 2022-06-09 | 에스케이실트론 주식회사 | 블록 위치 조정장치 및 방법 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3740617A (en) * | 1968-11-20 | 1973-06-19 | Matsushita Electronics Corp | Semiconductor structure and method of manufacturing same |
JPS6245041A (ja) * | 1985-08-23 | 1987-02-27 | Canon Inc | 円形板状物体の位置決め装置 |
JPS62162342A (ja) * | 1986-01-13 | 1987-07-18 | Canon Inc | ウエハの位置合せ装置 |
JPS62204109A (ja) * | 1986-03-04 | 1987-09-08 | Yokogawa Electric Corp | ロボツトア−ム姿勢測定装置 |
US4819167A (en) * | 1987-04-20 | 1989-04-04 | Applied Materials, Inc. | System and method for detecting the center of an integrated circuit wafer |
JP3466607B2 (ja) * | 1989-09-13 | 2003-11-17 | ソニー株式会社 | スパッタリング装置 |
JP3063999B2 (ja) * | 1990-09-28 | 2000-07-12 | 株式会社アマダ | 柔軟構造物のフレキシビリティ制御装置 |
US5452078A (en) * | 1993-06-17 | 1995-09-19 | Ann F. Koo | Method and apparatus for finding wafer index marks and centers |
US6126380A (en) * | 1997-08-04 | 2000-10-03 | Creative Design Corporation | Robot having a centering and flat finding means |
US6530732B1 (en) * | 1997-08-12 | 2003-03-11 | Brooks Automation, Inc. | Single substrate load lock with offset cool module and buffer chamber |
US6405101B1 (en) * | 1998-11-17 | 2002-06-11 | Novellus Systems, Inc. | Wafer centering system and method |
JP4402811B2 (ja) * | 2000-05-26 | 2010-01-20 | 東京エレクトロン株式会社 | 被処理体の搬送システムおよび被処理体の位置ずれ量の検出方法 |
US6553280B2 (en) * | 2000-07-07 | 2003-04-22 | Applied Materials, Inc. | Valve/sensor assemblies |
KR100803414B1 (ko) * | 2000-08-16 | 2008-02-13 | 레이던 컴퍼니 | 근거리 물체 감지 시스템 |
JP2002270672A (ja) * | 2001-03-09 | 2002-09-20 | Olympus Optical Co Ltd | アライメント方法及び基板検査装置 |
US6962644B2 (en) * | 2002-03-18 | 2005-11-08 | Applied Materials, Inc. | Tandem etch chamber plasma processing system |
US6760976B1 (en) * | 2003-01-15 | 2004-07-13 | Novellus Systems, Inc. | Method for active wafer centering using a single sensor |
DE602004010262T2 (de) * | 2003-06-24 | 2008-09-25 | Koninklijke Philips Electronics N.V. | Verfahren zum bewegen einer mit einer kamera versehenen vorrichtung zu einer zielposition mittels eines steuersytems und steuersystem dafür |
JP2005093807A (ja) * | 2003-09-18 | 2005-04-07 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
US20050113976A1 (en) * | 2003-11-10 | 2005-05-26 | Blueshift Technologies, Inc. | Software controller for handling system |
US7458763B2 (en) * | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
JP4445293B2 (ja) * | 2004-03-11 | 2010-04-07 | 株式会社リコー | 画像形成装置における記録紙形状測定方法及び装置、並びに、画像形成装置における記録紙形状異常診断機能付き画像形成装置 |
JP2006005242A (ja) * | 2004-06-18 | 2006-01-05 | Canon Inc | 画像処理装置、画像処理方法、露光装置、およびデバイス製造方法 |
-
2007
- 2007-03-05 SG SG2011040748A patent/SG172675A1/en unknown
- 2007-03-05 JP JP2008558497A patent/JP5959138B2/ja active Active
- 2007-03-05 WO PCT/US2007/063311 patent/WO2007103870A2/fr active Application Filing
- 2007-03-05 KR KR1020087024330A patent/KR20080111036A/ko not_active Application Discontinuation
- 2007-03-05 WO PCT/US2007/063345 patent/WO2007103896A2/fr active Application Filing
- 2007-03-05 WO PCT/US2007/063333 patent/WO2007103887A2/fr active Application Filing
- 2007-03-05 KR KR1020147005807A patent/KR101570626B1/ko active IP Right Grant
-
2013
- 2013-05-28 JP JP2013111441A patent/JP5689920B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
SG172675A1 (en) | 2011-07-28 |
WO2007103887A2 (fr) | 2007-09-13 |
JP5689920B2 (ja) | 2015-03-25 |
KR101570626B1 (ko) | 2015-11-19 |
WO2007103896A3 (fr) | 2008-07-10 |
JP2009529248A (ja) | 2009-08-13 |
JP2013231726A (ja) | 2013-11-14 |
WO2007103870A2 (fr) | 2007-09-13 |
WO2007103887A3 (fr) | 2008-06-12 |
KR20140042925A (ko) | 2014-04-07 |
KR20080111036A (ko) | 2008-12-22 |
WO2007103870A3 (fr) | 2008-11-27 |
WO2007103896A2 (fr) | 2007-09-13 |
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