JP5953797B2 - 半導体発光装置の製造方法 - Google Patents

半導体発光装置の製造方法 Download PDF

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Publication number
JP5953797B2
JP5953797B2 JP2012032367A JP2012032367A JP5953797B2 JP 5953797 B2 JP5953797 B2 JP 5953797B2 JP 2012032367 A JP2012032367 A JP 2012032367A JP 2012032367 A JP2012032367 A JP 2012032367A JP 5953797 B2 JP5953797 B2 JP 5953797B2
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phosphor
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led chip
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JP2013168599A (ja
JP2013168599A5 (https=
Inventor
広宣 定国
広宣 定国
松村　宣夫
宣夫 松村
吉岡　正裕
正裕 吉岡
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Toray Industries Inc
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Toray Industries Inc
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JP2012032367A 2012-02-17 2012-02-17 半導体発光装置の製造方法 Expired - Fee Related JP5953797B2 (ja)

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JP2012032367A JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

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JP2012032367A JP5953797B2 (ja) 2012-02-17 2012-02-17 半導体発光装置の製造方法

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JP2013168599A JP2013168599A (ja) 2013-08-29
JP2013168599A5 JP2013168599A5 (https=) 2015-03-26
JP5953797B2 true JP5953797B2 (ja) 2016-07-20

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015061024A (ja) * 2013-09-20 2015-03-30 パナソニック株式会社 発光モジュール
WO2015060289A1 (ja) * 2013-10-24 2015-04-30 東レ株式会社 蛍光体組成物、蛍光体シート、蛍光体シート積層体ならびにそれらを用いたｌｅｄチップ、ｌｅｄパッケージおよびその製造方法
CN105637660B (zh) * 2013-11-07 2018-11-09 东丽株式会社 层叠体及使用所述层叠体的发光装置的制造方法
KR102408839B1 (ko) 2014-06-19 2022-06-14 루미리즈 홀딩 비.브이. 작은 소스 크기를 갖는 파장 변환 발광 디바이스
JP6852401B2 (ja) * 2015-12-04 2021-03-31 東レ株式会社 蛍光体シート、それを用いた発光体、光源ユニット、ディスプレイ、および発光体の製造方法
JP6902838B2 (ja) * 2016-09-08 2021-07-14 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光半導体素子被覆用シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971672B2 (ja) * 2005-09-09 2012-07-11 パナソニック株式会社 発光装置
JP5630966B2 (ja) * 2009-04-27 2014-11-26 日亜化学工業株式会社 発光素子チップ組立体およびその製造方法

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