JP5951207B2 - ダイシング・ダイボンディングシート - Google Patents

ダイシング・ダイボンディングシート Download PDF

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Publication number
JP5951207B2
JP5951207B2 JP2011201167A JP2011201167A JP5951207B2 JP 5951207 B2 JP5951207 B2 JP 5951207B2 JP 2011201167 A JP2011201167 A JP 2011201167A JP 2011201167 A JP2011201167 A JP 2011201167A JP 5951207 B2 JP5951207 B2 JP 5951207B2
Authority
JP
Japan
Prior art keywords
mass
adhesive layer
parts
bonding sheet
acrylic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011201167A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013062446A5 (OSRAM
JP2013062446A (ja
Inventor
裕介 根津
裕介 根津
泰紀 柄澤
泰紀 柄澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2011201167A priority Critical patent/JP5951207B2/ja
Priority to TW101126559A priority patent/TWI566282B/zh
Priority to KR1020120100670A priority patent/KR102105515B1/ko
Publication of JP2013062446A publication Critical patent/JP2013062446A/ja
Publication of JP2013062446A5 publication Critical patent/JP2013062446A5/ja
Application granted granted Critical
Publication of JP5951207B2 publication Critical patent/JP5951207B2/ja
Priority to KR1020190027593A priority patent/KR20190030667A/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
JP2011201167A 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート Active JP5951207B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート
TW101126559A TWI566282B (zh) 2011-09-14 2012-07-24 Cut the adhesive sheet
KR1020120100670A KR102105515B1 (ko) 2011-09-14 2012-09-11 다이싱ㆍ다이 본딩 시트
KR1020190027593A KR20190030667A (ko) 2011-09-14 2019-03-11 다이싱ㆍ다이 본딩 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (3)

Publication Number Publication Date
JP2013062446A JP2013062446A (ja) 2013-04-04
JP2013062446A5 JP2013062446A5 (OSRAM) 2014-10-30
JP5951207B2 true JP5951207B2 (ja) 2016-07-13

Family

ID=48179321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011201167A Active JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Country Status (3)

Country Link
JP (1) JP5951207B2 (OSRAM)
KR (2) KR102105515B1 (OSRAM)
TW (1) TWI566282B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108987294A (zh) * 2018-06-21 2018-12-11 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877982B2 (ja) * 2016-12-08 2021-05-26 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
WO2020157029A1 (en) * 2019-01-29 2020-08-06 Trinamix Gmbh Optical detector
JP7625784B2 (ja) * 2019-11-15 2025-02-04 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
CN112341975B (zh) * 2020-11-25 2022-03-08 中路交科科技股份有限公司 一种二阶环氧粘层油、制备方法及其应用方法
JPWO2022138341A1 (OSRAM) 2020-12-25 2022-06-30

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
KR100804891B1 (ko) * 2006-02-14 2008-02-20 엘에스전선 주식회사 다이싱 다이 접착필름 및 이를 이용한 반도체 패키징 방법
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108987294A (zh) * 2018-06-21 2018-12-11 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法

Also Published As

Publication number Publication date
TWI566282B (zh) 2017-01-11
KR20130029341A (ko) 2013-03-22
KR102105515B1 (ko) 2020-04-28
JP2013062446A (ja) 2013-04-04
KR20190030667A (ko) 2019-03-22
TW201327653A (zh) 2013-07-01

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