TWI566282B - Cut the adhesive sheet - Google Patents

Cut the adhesive sheet Download PDF

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Publication number
TWI566282B
TWI566282B TW101126559A TW101126559A TWI566282B TW I566282 B TWI566282 B TW I566282B TW 101126559 A TW101126559 A TW 101126559A TW 101126559 A TW101126559 A TW 101126559A TW I566282 B TWI566282 B TW I566282B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
mass
adhesive
parts
propylene polymer
Prior art date
Application number
TW101126559A
Other languages
English (en)
Chinese (zh)
Other versions
TW201327653A (zh
Inventor
根津裕介
柄澤泰紀
Original Assignee
琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 琳得科股份有限公司 filed Critical 琳得科股份有限公司
Publication of TW201327653A publication Critical patent/TW201327653A/zh
Application granted granted Critical
Publication of TWI566282B publication Critical patent/TWI566282B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
TW101126559A 2011-09-14 2012-07-24 Cut the adhesive sheet TWI566282B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (2)

Publication Number Publication Date
TW201327653A TW201327653A (zh) 2013-07-01
TWI566282B true TWI566282B (zh) 2017-01-11

Family

ID=48179321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101126559A TWI566282B (zh) 2011-09-14 2012-07-24 Cut the adhesive sheet

Country Status (3)

Country Link
JP (1) JP5951207B2 (OSRAM)
KR (2) KR102105515B1 (OSRAM)
TW (1) TWI566282B (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877982B2 (ja) * 2016-12-08 2021-05-26 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN108987294B (zh) * 2018-06-21 2021-02-02 上海飞骧电子科技有限公司 解决封装溢胶问题的无源器件砷化镓刷胶方法
WO2020157029A1 (en) * 2019-01-29 2020-08-06 Trinamix Gmbh Optical detector
JP7625784B2 (ja) * 2019-11-15 2025-02-04 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
CN112341975B (zh) * 2020-11-25 2022-03-08 中路交科科技股份有限公司 一种二阶环氧粘层油、制备方法及其应用方法
JPWO2022138341A1 (OSRAM) 2020-12-25 2022-06-30

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
US20070141330A1 (en) * 2004-08-03 2007-06-21 The Furukawa Electric Co., Ltd. Method of producing a semiconductor device, and wafer-processing tape
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
KR100804891B1 (ko) * 2006-02-14 2008-02-20 엘에스전선 주식회사 다이싱 다이 접착필름 및 이를 이용한 반도체 패키징 방법
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141330A1 (en) * 2004-08-03 2007-06-21 The Furukawa Electric Co., Ltd. Method of producing a semiconductor device, and wafer-processing tape
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Also Published As

Publication number Publication date
JP5951207B2 (ja) 2016-07-13
KR20130029341A (ko) 2013-03-22
KR102105515B1 (ko) 2020-04-28
JP2013062446A (ja) 2013-04-04
KR20190030667A (ko) 2019-03-22
TW201327653A (zh) 2013-07-01

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