JP5944866B2 - 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 - Google Patents

電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 Download PDF

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JP5944866B2
JP5944866B2 JP2013129859A JP2013129859A JP5944866B2 JP 5944866 B2 JP5944866 B2 JP 5944866B2 JP 2013129859 A JP2013129859 A JP 2013129859A JP 2013129859 A JP2013129859 A JP 2013129859A JP 5944866 B2 JP5944866 B2 JP 5944866B2
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mold
cavity
resin
lower mold
pressure
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JP2015005611A (ja
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高瀬　慎二
慎二 高瀬
佳久 川本
佳久 川本
衛 砂田
衛 砂田
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Towa Corp
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Towa Corp
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Priority to JP2013129859A priority Critical patent/JP5944866B2/ja
Priority to TW103114446A priority patent/TWI573199B/zh
Priority to CN201410188299.8A priority patent/CN104227897B/zh
Priority to KR1020140071223A priority patent/KR101610474B1/ko
Publication of JP2015005611A publication Critical patent/JP2015005611A/ja
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  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
JP2013129859A 2013-06-20 2013-06-20 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 Active JP5944866B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013129859A JP5944866B2 (ja) 2013-06-20 2013-06-20 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
TW103114446A TWI573199B (zh) 2013-06-20 2014-04-22 Electronic component compression resin sealing method and compression resin sealing device
CN201410188299.8A CN104227897B (zh) 2013-06-20 2014-05-06 电子元件的压缩树脂封装方法及压缩树脂封装装置
KR1020140071223A KR101610474B1 (ko) 2013-06-20 2014-06-12 전자 부품의 압축 수지 밀봉 방법 및 압축 수지 밀봉 장치

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JP2013129859A JP5944866B2 (ja) 2013-06-20 2013-06-20 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置

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JP2015005611A JP2015005611A (ja) 2015-01-08
JP5944866B2 true JP5944866B2 (ja) 2016-07-05

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JP2013129859A Active JP5944866B2 (ja) 2013-06-20 2013-06-20 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置

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JP (1) JP5944866B2 (zh)
KR (1) KR101610474B1 (zh)
CN (1) CN104227897B (zh)
TW (1) TWI573199B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP2017051972A (ja) * 2015-09-09 2017-03-16 Ｔｏｗａ株式会社 プレス機構、プレス方法、圧縮成形装置および圧縮成形方法
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6499105B2 (ja) * 2016-03-11 2019-04-10 東芝メモリ株式会社 金型
JP6640003B2 (ja) * 2016-04-05 2020-02-05 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6723177B2 (ja) * 2017-02-24 2020-07-15 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法
JP7084247B2 (ja) * 2018-08-02 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置、成形型、及び樹脂成形品の製造方法
TW202116535A (zh) 2019-08-23 2021-05-01 日商長瀨化成股份有限公司 密封結構體之製造方法
JP6704159B1 (ja) * 2019-12-02 2020-06-03 アサヒ・エンジニアリング株式会社 樹脂封止装置
JP7203715B2 (ja) * 2019-12-06 2023-01-13 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
CN112976666B (zh) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 一种应用于压缩成形的模具上的动平衡缓冲机构
JP7470982B2 (ja) * 2020-11-17 2024-04-19 アピックヤマダ株式会社 樹脂供給装置、樹脂封止装置、及び樹脂封止品の製造方法
WO2022163026A1 (ja) * 2021-01-27 2022-08-04 富士高分子工業株式会社 押圧成形体及びその製造方法
CN114864430B (zh) * 2021-02-03 2024-07-05 济南职业学院 一种集成电路封装焊接机压板装置
JP7430152B2 (ja) * 2021-03-24 2024-02-09 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7447047B2 (ja) * 2021-03-24 2024-03-11 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP2004042356A (ja) * 2002-07-10 2004-02-12 Mitsubishi Electric Corp 型締装置
JP4519398B2 (ja) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 樹脂封止方法及び半導体装置の製造方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
WO2006100765A1 (ja) * 2005-03-23 2006-09-28 Renesas Technology Corp. 半導体装置の製造方法及び圧縮成形装置
JP4568258B2 (ja) * 2006-09-13 2010-10-27 住友重機械工業株式会社 モールド金型及びモールド方法
JP5271507B2 (ja) * 2006-09-20 2013-08-21 三菱重工プラスチックテクノロジー株式会社 型締装置
TW200901341A (en) * 2007-05-29 2009-01-01 Towa Corp Compression molding method and device for electronic component
JP2009124012A (ja) * 2007-11-16 2009-06-04 Towa Corp 電子部品の圧縮成形方法及び金型
JP5352896B2 (ja) * 2008-01-19 2013-11-27 アピックヤマダ株式会社 トランスファ成形方法及びトランスファ成形装置
JP2012035433A (ja) * 2010-08-04 2012-02-23 Sumitomo Heavy Ind Ltd 圧縮成形用金型及び圧縮成形方法
JP2013089607A (ja) 2011-10-13 2013-05-13 Nissan Motor Co Ltd モールド装置およびモールド方法

Also Published As

Publication number Publication date
CN104227897B (zh) 2017-05-17
KR101610474B1 (ko) 2016-04-07
CN104227897A (zh) 2014-12-24
TW201501217A (zh) 2015-01-01
JP2015005611A (ja) 2015-01-08
TWI573199B (zh) 2017-03-01
KR20140147698A (ko) 2014-12-30

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