JP5929969B2 - プリント回路基板及びプリント回路基板におけるノイズ低減方法 - Google Patents

プリント回路基板及びプリント回路基板におけるノイズ低減方法 Download PDF

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Publication number
JP5929969B2
JP5929969B2 JP2014121596A JP2014121596A JP5929969B2 JP 5929969 B2 JP5929969 B2 JP 5929969B2 JP 2014121596 A JP2014121596 A JP 2014121596A JP 2014121596 A JP2014121596 A JP 2014121596A JP 5929969 B2 JP5929969 B2 JP 5929969B2
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JP
Japan
Prior art keywords
band gap
electromagnetic
circuit board
printed circuit
gap structure
Prior art date
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Expired - Fee Related
Application number
JP2014121596A
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English (en)
Japanese (ja)
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JP2016001691A5 (https=
JP2016001691A (ja
Inventor
章弘 川田
章弘 川田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP2014121596A priority Critical patent/JP5929969B2/ja
Priority to CN201580031404.XA priority patent/CN106465551B/zh
Priority to US15/317,437 priority patent/US10111318B2/en
Priority to PCT/JP2015/067090 priority patent/WO2015190610A1/ja
Publication of JP2016001691A publication Critical patent/JP2016001691A/ja
Publication of JP2016001691A5 publication Critical patent/JP2016001691A5/ja
Application granted granted Critical
Publication of JP5929969B2 publication Critical patent/JP5929969B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2014121596A 2014-06-12 2014-06-12 プリント回路基板及びプリント回路基板におけるノイズ低減方法 Expired - Fee Related JP5929969B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014121596A JP5929969B2 (ja) 2014-06-12 2014-06-12 プリント回路基板及びプリント回路基板におけるノイズ低減方法
CN201580031404.XA CN106465551B (zh) 2014-06-12 2015-06-12 电路基板以及电路基板的减噪方法
US15/317,437 US10111318B2 (en) 2014-06-12 2015-06-12 Circuit substrate, and noise reduction method for circuit substrate
PCT/JP2015/067090 WO2015190610A1 (ja) 2014-06-12 2015-06-12 回路基板及び回路基板におけるノイズ低減方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014121596A JP5929969B2 (ja) 2014-06-12 2014-06-12 プリント回路基板及びプリント回路基板におけるノイズ低減方法

Publications (3)

Publication Number Publication Date
JP2016001691A JP2016001691A (ja) 2016-01-07
JP2016001691A5 JP2016001691A5 (https=) 2016-03-31
JP5929969B2 true JP5929969B2 (ja) 2016-06-08

Family

ID=54833693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014121596A Expired - Fee Related JP5929969B2 (ja) 2014-06-12 2014-06-12 プリント回路基板及びプリント回路基板におけるノイズ低減方法

Country Status (4)

Country Link
US (1) US10111318B2 (https=)
JP (1) JP5929969B2 (https=)
CN (1) CN106465551B (https=)
WO (1) WO2015190610A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6611065B2 (ja) * 2016-07-27 2019-11-27 国立大学法人 岡山大学 印刷配線板
JP6744201B2 (ja) * 2016-11-28 2020-08-19 京セラ株式会社 印刷配線板
KR101867856B1 (ko) * 2017-06-07 2018-06-15 엘지전자 주식회사 전자파 장해 감쇄 장치 및 이를 구비하는 홈 어플라이언스
WO2023054633A1 (ja) 2021-09-29 2023-04-06 パナソニックＩｐマネジメント株式会社 多層デバイス

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2735060B2 (ja) * 1995-12-27 1998-04-02 日本電気株式会社 プリント回路基板およびプリント回路基板の設計方法およびプリント回路基板作製装置
US7215007B2 (en) 2003-06-09 2007-05-08 Wemtec, Inc. Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
US7148425B2 (en) * 2004-01-29 2006-12-12 National Sun Yat-Sen University Power plane system of high-speed digital circuit for suppressing ground bounce noise
US7136028B2 (en) 2004-08-27 2006-11-14 Freescale Semiconductor, Inc. Applications of a high impedance surface
US7760140B2 (en) 2006-06-09 2010-07-20 Intel Corporation Multiband antenna array using electromagnetic bandgap structures
JP2008004853A (ja) 2006-06-26 2008-01-10 Hitachi Ltd 積層半導体装置およびモジュール
JP5380919B2 (ja) * 2008-06-24 2014-01-08 日本電気株式会社 導波路構造およびプリント配線板
KR100999550B1 (ko) * 2008-10-08 2010-12-08 삼성전기주식회사 전자기 밴드갭 구조물
FI124128B (fi) * 2008-10-28 2014-03-31 Tellabs Oy Suodatinrakenne
US8106728B2 (en) 2009-04-15 2012-01-31 International Business Machines Corporation Circuit structure and design structure for an optionally switchable on-chip slow wave transmission line band-stop filter and a method of manufacture
US9269999B2 (en) * 2009-04-30 2016-02-23 Nec Corporation Structural body, printed board, antenna, transmission line waveguide converter, array antenna, and electronic device
JP5712931B2 (ja) * 2009-12-04 2015-05-07 日本電気株式会社 構造体
CN102497729A (zh) * 2011-12-07 2012-06-13 苏州日月明微电子科技有限公司 一种电磁带隙结构
JP2013153041A (ja) 2012-01-25 2013-08-08 Nec Tokin Corp ノイズ抑制構造体
TWI565400B (zh) * 2014-07-01 2017-01-01 華碩電腦股份有限公司 電磁帶隙結構與具有電磁帶隙結構的電子裝置
JP6593350B2 (ja) * 2015-02-12 2019-10-23 日本電気株式会社 構造体および配線基板

Also Published As

Publication number Publication date
US10111318B2 (en) 2018-10-23
CN106465551B (zh) 2019-01-18
WO2015190610A1 (ja) 2015-12-17
JP2016001691A (ja) 2016-01-07
US20170127510A1 (en) 2017-05-04
CN106465551A (zh) 2017-02-22

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