JP5928477B2 - 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板 - Google Patents

樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板 Download PDF

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JP5928477B2
JP5928477B2 JP2013541551A JP2013541551A JP5928477B2 JP 5928477 B2 JP5928477 B2 JP 5928477B2 JP 2013541551 A JP2013541551 A JP 2013541551A JP 2013541551 A JP2013541551 A JP 2013541551A JP 5928477 B2 JP5928477 B2 JP 5928477B2
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resin composition
filler
resin
cured
group
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Expired - Fee Related
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JPWO2013065159A1 (ja
Inventor
優香 吉田
優香 吉田
竹澤　由高
由高 竹澤
靖夫 宮崎
靖夫 宮崎
高橋　裕之
裕之 高橋
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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    • C08G59/62—Alcohols or phenols
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • H05K1/00—Printed circuits
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    • H05K1/00—Printed circuits
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    • H05K2201/0206—Materials
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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP2013541551A 2011-11-02 2011-11-02 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板 Expired - Fee Related JP5928477B2 (ja)

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Application Number Priority Date Filing Date Title
PCT/JP2011/075345 WO2013065159A1 (ja) 2011-11-02 2011-11-02 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板

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JP2016028805A Division JP6132041B2 (ja) 2016-02-18 2016-02-18 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板

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JPWO2013065159A1 JPWO2013065159A1 (ja) 2015-04-02
JP5928477B2 true JP5928477B2 (ja) 2016-06-01

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JP (1) JP5928477B2 (ko)
KR (1) KR101780536B1 (ko)
CN (2) CN110128786A (ko)
WO (1) WO2013065159A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013065758A1 (ja) * 2011-11-02 2015-04-02 日立化成株式会社 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板、プリント配線板及びパワー半導体装置
JP2016138276A (ja) * 2016-02-18 2016-08-04 日立化成株式会社 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板

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DE112013001969T5 (de) * 2012-08-02 2015-01-08 Fuji Electric Co., Ltd. Metallträgerplatine
WO2014208694A1 (ja) * 2013-06-27 2014-12-31 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
JP2015083663A (ja) * 2013-09-11 2015-04-30 三菱日立パワーシステムズ株式会社 電気絶縁用樹脂組成物及びその硬化物並びにこれを用いたコイル、固定子、回転機及び高電圧機器
KR101967856B1 (ko) * 2013-10-14 2019-04-12 전자부품연구원 고열전도성 필름 및 그 제조 방법
KR101579890B1 (ko) * 2014-09-22 2015-12-23 한국세라믹기술원 나노사이즈의 고분산성 α-알루미나의 합성방법 및 이에 의해 합성된 절연성 고열전도성 α-알루미나졸
TWI746448B (zh) * 2015-07-10 2021-11-21 日商昭和電工材料股份有限公司 環氧樹脂成形材料、成形物及硬化物
JP2017128662A (ja) * 2016-01-20 2017-07-27 積水化学工業株式会社 複合フィラー及び熱硬化性材料
JP6680351B2 (ja) 2016-02-25 2020-04-15 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、成形物及び成形硬化物
KR20180118739A (ko) * 2016-03-02 2018-10-31 제이엔씨 주식회사 적층체, 전자 기기, 적층체 제조 방법
CN106519581B (zh) * 2016-11-29 2018-11-02 华中科技大学 一种高导热低粘度环氧树脂复合材料及其制备方法和应用
CN110382586A (zh) * 2017-03-09 2019-10-25 日立化成株式会社 环氧聚合物、环氧树脂、环氧树脂组合物、树脂片材、b阶片材、固化物、c阶片材、带有树脂的金属箔、金属基板及环氧树脂的制造方法
JP7063021B2 (ja) * 2017-03-24 2022-05-09 東レ株式会社 プリプレグおよび炭素繊維強化複合材料
JP2019123799A (ja) * 2018-01-16 2019-07-25 日立化成株式会社 層間絶縁層用樹脂組成物、層間絶縁層用樹脂フィルム、多層プリント配線板、半導体パッケージ及び多層プリント配線板の製造方法
EP3766911B1 (en) 2018-03-15 2024-08-14 Resonac Corporation Epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, c-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device
IL265374B2 (en) * 2019-03-14 2023-11-01 Israel Aerospace Ind Ltd Composite material with improved thermal conductivity and method of production
CN113677729A (zh) 2019-03-29 2021-11-19 Tdk株式会社 环氧树脂、树脂组合物、树脂片材、树脂固化物、树脂基板及层叠基板
WO2020208547A1 (en) * 2019-04-11 2020-10-15 3M Innovative Properties Company Curable compositions, abrasion-resistant articles, and method of thermoforming the same
KR20230008879A (ko) * 2020-06-17 2023-01-16 닛폰세이테츠 가부시키가이샤 전자 강판용 코팅 조성물, 전자 강판, 적층 코어 및 회전 전기 기기
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