JP5921970B2 - 熱伝導性粘着組成物 - Google Patents
熱伝導性粘着組成物 Download PDFInfo
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- JP5921970B2 JP5921970B2 JP2012139764A JP2012139764A JP5921970B2 JP 5921970 B2 JP5921970 B2 JP 5921970B2 JP 2012139764 A JP2012139764 A JP 2012139764A JP 2012139764 A JP2012139764 A JP 2012139764A JP 5921970 B2 JP5921970 B2 JP 5921970B2
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- Prior art keywords
- heat conductive
- meth
- conductive adhesive
- mass
- monomer
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- 238000001035 drying Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- PVBRSNZAOAJRKO-UHFFFAOYSA-N ethyl 2-sulfanylacetate Chemical compound CCOC(=O)CS PVBRSNZAOAJRKO-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
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- 239000006260 foam Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
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- 150000003949 imides Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
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- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
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- 230000014759 maintenance of location Effects 0.000 description 1
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- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- MKIJJIMOAABWGF-UHFFFAOYSA-N methyl 2-sulfanylacetate Chemical compound COC(=O)CS MKIJJIMOAABWGF-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 239000003960 organic solvent Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- GGROONUBGIWGGS-UHFFFAOYSA-N oxygen(2-);zirconium(4+);hydrate Chemical compound O.[O-2].[O-2].[Zr+4] GGROONUBGIWGGS-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- PWGIEBRSWMQVCO-UHFFFAOYSA-N phosphono prop-2-enoate Chemical compound OP(O)(=O)OC(=O)C=C PWGIEBRSWMQVCO-UHFFFAOYSA-N 0.000 description 1
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- 229920002647 polyamide Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
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- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
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- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- YHPUTXNFABTCGG-UHFFFAOYSA-N propyl 2-sulfanylacetate Chemical compound CCCOC(=O)CS YHPUTXNFABTCGG-UHFFFAOYSA-N 0.000 description 1
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- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000010378 sodium ascorbate Nutrition 0.000 description 1
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 description 1
- 229960005055 sodium ascorbate Drugs 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
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- YXIMCNGUIIEJMO-UHFFFAOYSA-N tert-butyl 2-sulfanylacetate Chemical compound CC(C)(C)OC(=O)CS YXIMCNGUIIEJMO-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229940035024 thioglycerol Drugs 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Description
また、本発明の熱伝導性粘着組成物では、下記試験により測定される剪断ずれが、1.5mm/時間以下であることが好適である。
粘着成分のゲル分率が上記上限以下であれば、剪断ずれを低減させることできるとともに、剥離接着力を向上させることができる。そのため、熱伝導性粘着シート6の接着性を向上させることができる。
(低重合体の調製)
シクロヘキシルメタクリレート(CHMA)60質量部、イソブチルメタクリレート(IBMA)40質量部、および、連鎖移動剤としてチオグリコール酸4質量部を攪拌羽根、温度計、窒素ガス導入管、冷却器、滴下ロートを備えた4つ口フラスコに投入した。そして、70℃にて窒素雰囲気下で1時間攪拌した後、90℃まで昇温し、重合開始剤としてt−ヘキシルパーオキシ−2−エチル(商品名「パーヘキシルO」、日油社製)0.005質量部およびジ−t−t−ヘキシルパーオキサイド(商品名「パーヘキシルD」、日油社製)0.01質量部を混合した。さらに、100℃で1時間攪拌後、1時間かけて150℃まで昇温し、150℃で1時間攪拌した。次いで、1時間かけて170℃まで昇温し、170℃で60分間攪拌した。次に、170℃の状態で減圧し、1時間攪拌して残留単量体を除去し、低重合体を得た。
(単量体組成物の調製)
第1の単量体として、アクリル酸2−エチルヘキシル85質量部、アクリル酸2−メトキシエチル9質量部、N−ビニル−2−ピロリドン(NVP)7質量部、および、ヒドロキシエチルアクリルアミド(HEAA)1質量部を配合して、それらを混合して、単量体の混合物を得た。
部分重合物(シロップ)の配合部数を95質量部に変更するとともに、低重合体の配合部数を5質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を90質量部に変更するとともに、低重合体の配合部数を10質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を80質量部に変更するとともに、低重合体の配合部数を20質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を75質量部に変更するとともに、低重合体の配合部数を25質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を70質量部に変更するとともに、低重合体の配合部数を30質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を65質量部に変更するとともに、低重合体の配合部数を35質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を60質量部に変更するとともに、低重合体の配合部数を40質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を100質量部に変更するとともに、低重合体を配合しなかった以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を100質量部に変更するとともに、低重合体を配合せず、また、第2の単量体としてのジペンタエリスリトールヘキサアクリレートの配合部数を0.01質量部に変更し、さらに、水酸化アルミニウム粒子を配合しなかった以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を100質量部に変更するとともに、低重合体を配合せず、また、第2の単量体としてのジペンタエリスリトールヘキサアクリレートの配合部数を0.08質量部に変更し、さらに、水酸化アルミニウム粒子を配合しなかった以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
部分重合物(シロップ)の配合部数を100質量部に変更するとともに、低重合体を配合せず、また、水酸化アルミニウム粒子の配合部数を500質量部に変更した以外は、実施例1と同様に処理して、熱伝導性粘着シートを作製した。
(1)重量平均分子量の測定
低重合体、および、高重合体(低重合体および熱伝導性粒子を含有しない粘着成分)の重量平均分子量は、GPC装置(装置名:HLC−8220GPC、東ソー社製)を用いて測定をそれぞれ求めた。測定条件は下記の通りであり、標準ポリスチレン換算により重量平均分子量を求めた。
・サンプル濃度:0.2mass%(テトラヒドロフラン(THF)溶液)
・サンプル注入量:10μl
・溶離液:THF
・流速:0.6ml/min
・測定温度:40℃
・カラム:
サンプルカラム;TSKguardcolumn SuperHZ−H(1本)+TSKgel SuperHZM−H(2本)
リファレンスカラム;TSKgel SuperH−RC(1本)
・検出器:示差屈折計(RI)
(2)ゲル分率(粘着成分)
熱伝導性粘着組成物約1gを採取し、これを精秤した。その後、精秤した熱伝導性粘着組成物を酢酸エチル40gに7日間浸漬して、その後、熱伝導性粘着組成物の酢酸エチル不溶分をすべて回収し、これを、130℃で2時間乾燥して、乾燥質量を求めた。
(3)剪断ずれ(保持力)
熱伝導性粘着シートを、20mm×10mmの大きさに裁断した後、一方のベースフィルムを熱伝導性粘着層から引き剥がして、熱伝導性粘着シートの剥離面を25μm厚のPETフィルム(裏打ち材)に貼付けた。
(4)剥離接着力(90度剥離試験)
熱伝導性粘着シートの一方のベースフィルムを熱伝導性粘着層から引き剥がして、熱伝導性粘着シートの剥離面を厚さ25μmのPETフィルム(裏打ち材)に貼り合わせ、これを幅20mm、長さ150mmに切断した。
(5)熱伝導率および熱抵抗
熱伝導率および熱抵抗の測定は、図2に示す熱特性評価装置を用いて実施した。
R=L/λ
Q:単位面積あたりの熱流速
gradT:温度勾配
L:シートの厚み
λ:熱伝導率
R:熱抵抗
各実施例および各比較例の熱伝導性粘着組成物の配合処方と評価とを表1に示す。
6 熱伝導性粘着シート
Claims (6)
- 高重合体および低重合体を含有する粘着成分と、
熱伝導性粒子とを含有し、
前記高重合体は、1.0×10 5 を超過し、1.0×10 8 以下の重量平均分子量を有し、(メタ)アクリル酸アルキルエステル系単量体を含有する単量体の重合体であり、
前記低重合体は、5.0×10 2 〜1.0×10 5 の重量平均分子量を有し、(メタ)アクリル酸アルキルエステル系単量体を含有する単量体の重合体であり、
前記粘着成分の下記試験により測定されるゲル分率が、28〜59質量%であり、
熱伝導率が、0.3W/m・K以上であることを特徴とする、熱伝導性粘着組成物。
粘着成分のゲル分率:熱伝導性粘着組成物約1gを酢酸エチル40gに7日間浸漬して、その後、前記熱伝導性粘着組成物の酢酸エチル不溶分を採取し、これを乾燥して、下記式により求める。
ゲル分率=(酢酸エチル不溶分の乾燥質量/浸漬前の熱伝導性粘着組成物の質量)×(熱伝導性粘着組成物の質量/粘着成分の質量)×100 - 下記試験により測定される剪断ずれが、1.5mm/時間以下であることを特徴とする、請求項1に記載の熱伝導性粘着組成物。
剪断ずれ:厚み12μmのポリエステルフィルムからなる基材と、前記基材の両面に積層され、熱伝導性粘着組成物を厚み119μmのシート状に成形することにより得られる2つの熱伝導性粘着層とを備える熱伝導性粘着シートを、20mm×10mmの大きさに裁断した後、前記熱伝導性粘着シートの厚み方向に垂直な面のうちの一方面を厚み25μmのポリエチレンテレフタレートフィルムからなる裏打ち材に貼着し、次いで、23℃、50%RH環境下で、前記熱伝導性粘着シートの厚み方向に垂直な面のうちの他方面の上端部10mm×10mmの部分を、ステンレス板の下端部に貼着し、その後、80℃環境下で、30分間、静置して貼着状態を安定させた後、前記ステンレス板の上端部を固定して、前記熱伝導性粘着シートの下端部に300gのおもりを取り付け、前記熱伝導性粘着シートを80℃の条件で垂下する。その後、80℃環境下で、1時間放置させたときの、前記熱伝導性粘着シートの前記ステンレス板に対するずれ量を剪断ずれとして測定する。 - 下記試験により測定される剥離角度90度の剥離接着力が、5N/20mm以上であることを特徴とする、請求項1または2に記載の熱伝導性粘着組成物。
剥離接着力:厚み12μmのポリエステルフィルムからなる基材と、前記基材の両面に積層され、熱伝導性粘着組成物を厚み119μmのシート状に成形することにより得られる2つの熱伝導性粘着層とを備える熱伝導性粘着シートを幅20mmに加工して、前記熱伝導性粘着シートをアルミニウム板に接着した後、前記アルミニウム板に対して剥離角度90度で剥離速度300mm/分で前記熱伝導性粘着シートを剥離したときの、剥離強度を剥離接着力として測定する。 - 前記低重合体の含有割合が、前記粘着成分に対して、1質量%以上、40質量%未満であることを特徴とする、請求項1〜3のいずれか一項に記載の熱伝導性粘着組成物。
- 前記熱伝導性粒子の含有割合が、前記粘着成分100質量部に対して、500質量部未満であることを特徴とする、請求項1〜4のいずれか一項に記載の熱伝導性粘着組成物。
- 熱抵抗値が、10cm2・K/W未満であることを特徴とする、請求項1〜5のいずれか一項に記載の熱伝導性粘着組成物。
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JP6941431B2 (ja) * | 2016-11-30 | 2021-09-29 | 旭化成株式会社 | 蓄電デバイス用バインダー組成物、蓄電デバイス多孔層用スラリー、蓄電デバイス多孔層、蓄電デバイス多孔層付セパレータ及びリチウムイオン二次電池、並びにセパレータ塗工性を向上させる方法。 |
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