JP5914457B2 - 調節可能な内部直径を有するウェーハコンテナ - Google Patents

調節可能な内部直径を有するウェーハコンテナ Download PDF

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Publication number
JP5914457B2
JP5914457B2 JP2013502513A JP2013502513A JP5914457B2 JP 5914457 B2 JP5914457 B2 JP 5914457B2 JP 2013502513 A JP2013502513 A JP 2013502513A JP 2013502513 A JP2013502513 A JP 2013502513A JP 5914457 B2 JP5914457 B2 JP 5914457B2
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JP
Japan
Prior art keywords
wafer
flexible wall
rib
lower housing
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013502513A
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English (en)
Japanese (ja)
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JP2013526011A (ja
JP2013526011A5 (https=
Inventor
ディー． パイラント ジェイムズ
ディー． パイラント ジェイムズ
エル． ウェイバー アラン
エル． ウェイバー アラン
アール． マック クリストファー
アール． マック クリストファー
Original Assignee
テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．
テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．
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Application filed by テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．, テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー． filed Critical テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．
Publication of JP2013526011A publication Critical patent/JP2013526011A/ja
Publication of JP2013526011A5 publication Critical patent/JP2013526011A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
    • B65D53/04—Discs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/16—Container closures formed after filling by collapsing and twisting mouth portion
    • B65D77/18—Container closures formed after filling by collapsing and twisting mouth portion and securing by a deformable clip or binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013502513A 2010-03-29 2010-06-28 調節可能な内部直径を有するウェーハコンテナ Active JP5914457B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/749,448 US8556079B2 (en) 2009-08-26 2010-03-29 Wafer container with adjustable inside diameter
US12/749,448 2010-03-29
PCT/MY2010/000109 WO2011122928A1 (en) 2010-03-29 2010-06-28 Wafer container with adjustable inside diameter

Publications (3)

Publication Number Publication Date
JP2013526011A JP2013526011A (ja) 2013-06-20
JP2013526011A5 JP2013526011A5 (https=) 2013-08-15
JP5914457B2 true JP5914457B2 (ja) 2016-05-11

Family

ID=44712425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013502513A Active JP5914457B2 (ja) 2010-03-29 2010-06-28 調節可能な内部直径を有するウェーハコンテナ

Country Status (8)

Country Link
US (1) US8556079B2 (https=)
EP (1) EP2470456A4 (https=)
JP (1) JP5914457B2 (https=)
KR (1) KR20130014047A (https=)
CN (2) CN104787502A (https=)
MY (1) MY160279A (https=)
TW (1) TWI410360B (https=)
WO (1) WO2011122928A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR102853162B1 (ko) 2022-03-30 2025-09-01 아키레스 가부시키가이샤 반도체 웨이퍼 반송 용기

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KR20170076179A (ko) * 2015-12-24 2017-07-04 삼성전자주식회사 웨이퍼 수납 용기
CN105501635B (zh) * 2016-01-07 2017-07-07 安庆市兴龙印业有限责任公司 一种易碎品防护式安全包装盒
EP3579265B1 (en) * 2017-02-06 2020-08-19 Achilles Corporation Substrate housing container
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11658059B2 (en) 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
EP3806138B1 (en) * 2019-10-09 2022-11-30 Infineon Technologies AG Transport system
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
CN114023676B (zh) * 2021-10-13 2022-09-16 广东万维半导体技术有限公司 一种移动式晶圆载盘承载装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102853162B1 (ko) 2022-03-30 2025-09-01 아키레스 가부시키가이샤 반도체 웨이퍼 반송 용기

Also Published As

Publication number Publication date
US8556079B2 (en) 2013-10-15
EP2470456A1 (en) 2012-07-04
TWI410360B (zh) 2013-10-01
JP2013526011A (ja) 2013-06-20
US20100236977A1 (en) 2010-09-23
EP2470456A4 (en) 2016-10-26
WO2011122928A1 (en) 2011-10-06
CN104787502A (zh) 2015-07-22
TW201132564A (en) 2011-10-01
KR20130014047A (ko) 2013-02-06
CN102666315B (zh) 2015-03-25
CN102666315A (zh) 2012-09-12
MY160279A (en) 2017-02-28

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