MY160279A - Wafer container with adjustable inside diameter - Google Patents

Wafer container with adjustable inside diameter

Info

Publication number
MY160279A
MY160279A MYPI2012001359A MYPI2012001359A MY160279A MY 160279 A MY160279 A MY 160279A MY PI2012001359 A MYPI2012001359 A MY PI2012001359A MY PI2012001359 A MYPI2012001359 A MY PI2012001359A MY 160279 A MY160279 A MY 160279A
Authority
MY
Malaysia
Prior art keywords
wafers
wafer
stack
flexible
wafer container
Prior art date
Application number
MYPI2012001359A
Other languages
English (en)
Inventor
James D Pylant
Alan L Waber
Christopher R Mack
Original Assignee
Texchem Advanced Products Incorporated Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texchem Advanced Products Incorporated Sdn Bhd filed Critical Texchem Advanced Products Incorporated Sdn Bhd
Publication of MY160279A publication Critical patent/MY160279A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
    • B65D53/04—Discs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/16—Container closures formed after filling by collapsing and twisting mouth portion
    • B65D77/18—Container closures formed after filling by collapsing and twisting mouth portion and securing by a deformable clip or binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MYPI2012001359A 2010-03-29 2010-06-28 Wafer container with adjustable inside diameter MY160279A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/749,448 US8556079B2 (en) 2009-08-26 2010-03-29 Wafer container with adjustable inside diameter

Publications (1)

Publication Number Publication Date
MY160279A true MY160279A (en) 2017-02-28

Family

ID=44712425

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012001359A MY160279A (en) 2010-03-29 2010-06-28 Wafer container with adjustable inside diameter

Country Status (8)

Country Link
US (1) US8556079B2 (https=)
EP (1) EP2470456A4 (https=)
JP (1) JP5914457B2 (https=)
KR (1) KR20130014047A (https=)
CN (2) CN104787502A (https=)
MY (1) MY160279A (https=)
TW (1) TWI410360B (https=)
WO (1) WO2011122928A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170076179A (ko) * 2015-12-24 2017-07-04 삼성전자주식회사 웨이퍼 수납 용기
CN105501635B (zh) * 2016-01-07 2017-07-07 安庆市兴龙印业有限责任公司 一种易碎品防护式安全包装盒
EP3579265B1 (en) * 2017-02-06 2020-08-19 Achilles Corporation Substrate housing container
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11658059B2 (en) 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
EP3806138B1 (en) * 2019-10-09 2022-11-30 Infineon Technologies AG Transport system
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
CN114023676B (zh) * 2021-10-13 2022-09-16 广东万维半导体技术有限公司 一种移动式晶圆载盘承载装置
US12159799B2 (en) 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer

Family Cites Families (37)

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US3552548A (en) * 1968-08-05 1971-01-05 Fluroware Inc Wafer storage and shipping container
US5024329A (en) * 1988-04-22 1991-06-18 Siemens Aktiengesellschaft Lockable container for transporting and for storing semiconductor wafers
US5207324A (en) * 1991-03-08 1993-05-04 Fluoroware, Inc. Wafer cushion for shippers
US5501351A (en) * 1992-07-17 1996-03-26 Minnesota Mining And Manufacturing Company Reusable, multiple-piece storage container
JP2563802Y2 (ja) * 1992-08-28 1998-02-25 信越ポリマー株式会社 精密加工された薄板の収納容器
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
FR2735754B1 (fr) 1995-06-20 1998-07-17 Astra Plastique Pot, notamment pour le conditionnement de produits alimentaires
JPH09129719A (ja) * 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法
JP3212890B2 (ja) * 1996-10-15 2001-09-25 九州日本電気株式会社 ウェハキャリア
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
FR2767800B1 (fr) * 1997-09-03 1999-10-08 Oreal Capot pour dispositif de conditionnement
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
TW440536B (en) 1998-05-12 2001-06-16 Maeda Seisakusho Sealing means for a plastics container and lid, and to a product using such sealing means
US6082540A (en) * 1999-01-06 2000-07-04 Fluoroware, Inc. Cushion system for wafer carriers
US6662950B1 (en) * 1999-10-25 2003-12-16 Brian R. Cleaver Wafer shipping and storage container
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
KR100414886B1 (ko) 2000-05-15 2004-01-13 강인숙 인터넷상에서 정보 자동 검색 방법
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
DE20209288U1 (de) * 2002-06-14 2002-08-22 Ho, Ming-Hui, Hsin Chuang, Taipeh Abfallkorb für einen Papiershredder
US6988620B2 (en) * 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
US7147107B2 (en) * 2003-03-11 2006-12-12 E.Pak International, Inc. Packaging platform having an adjustable thickness
JPWO2004087535A1 (ja) 2003-03-31 2006-06-29 アキレス株式会社 半導体ウエハの容器
US7578392B2 (en) * 2003-06-06 2009-08-25 Convey Incorporated Integrated circuit wafer packaging system and method
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
EP1633660A4 (en) * 2003-06-17 2008-07-23 Illinois Tool Works MOTION RESTRICTING WAFER CONTAINER
US7131248B2 (en) * 2003-07-14 2006-11-07 Peak Plastic & Metal Products (Int'l) Limited Wafer shipper with orientation control
CA2548731A1 (en) 2003-08-26 2005-03-03 Trade Guys International Pty Ltd A hub locking device for a disc-shaped recording media
CN1845860B (zh) 2003-09-23 2011-01-19 伊利诺斯器械工程公司 低成本晶片盒的改进
US7100772B2 (en) * 2003-11-16 2006-09-05 Entegris, Inc. Wafer container with door actuated wafer restraint
KR20050113889A (ko) 2004-05-31 2005-12-05 삼성전자주식회사 웨이퍼 포장 용기
US20060042998A1 (en) * 2004-08-24 2006-03-02 Haggard Clifton C Cushion for packing disks such as semiconductor wafers
DE202005007586U1 (de) * 2005-05-13 2005-08-04 Rösler, Peter Behälter mit Rastverschluss
FI20050541A7 (fi) 2005-05-23 2006-11-24 Prevex Ab Oy CD-rasia vaihtelevalle määrälle CD-levyjä
CN101888957B (zh) * 2007-10-12 2013-01-02 大元半导体包装产业有限公司 带有交错壁结构的晶圆容器
US8109390B2 (en) * 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure

Also Published As

Publication number Publication date
US8556079B2 (en) 2013-10-15
EP2470456A1 (en) 2012-07-04
TWI410360B (zh) 2013-10-01
JP2013526011A (ja) 2013-06-20
US20100236977A1 (en) 2010-09-23
JP5914457B2 (ja) 2016-05-11
EP2470456A4 (en) 2016-10-26
WO2011122928A1 (en) 2011-10-06
CN104787502A (zh) 2015-07-22
TW201132564A (en) 2011-10-01
KR20130014047A (ko) 2013-02-06
CN102666315B (zh) 2015-03-25
CN102666315A (zh) 2012-09-12

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