JP5906022B2 - マクロピンハイブリッド相互接続アレイ及びその製造方法 - Google Patents
マクロピンハイブリッド相互接続アレイ及びその製造方法 Download PDFInfo
- Publication number
- JP5906022B2 JP5906022B2 JP2011088708A JP2011088708A JP5906022B2 JP 5906022 B2 JP5906022 B2 JP 5906022B2 JP 2011088708 A JP2011088708 A JP 2011088708A JP 2011088708 A JP2011088708 A JP 2011088708A JP 5906022 B2 JP5906022 B2 JP 5906022B2
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- Japan
- Prior art keywords
- array
- substrate
- interconnect
- macropin
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
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- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
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- H—ELECTRICITY
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- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
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- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
- H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
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- H10W72/01—Manufacture or treatment
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- H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/07221—Aligning
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
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- H10W72/07221—Aligning
- H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
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- H10W72/07231—Techniques
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- H10W72/07231—Techniques
- H10W72/07232—Compression bonding, e.g. thermocompression bonding
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- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
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- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
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- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
- H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/221—Structures or relative sizes
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- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
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- H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
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- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/248—Top-view layouts, e.g. mirror arrays
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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- H10W74/00—Encapsulations, e.g. protective coatings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Measurement Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/762,610 US8296940B2 (en) | 2010-04-19 | 2010-04-19 | Method of forming a micro pin hybrid interconnect array |
| US12/762,610 | 2010-04-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011228704A JP2011228704A (ja) | 2011-11-10 |
| JP2011228704A5 JP2011228704A5 (https=) | 2014-05-29 |
| JP5906022B2 true JP5906022B2 (ja) | 2016-04-20 |
Family
ID=44280969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011088708A Expired - Fee Related JP5906022B2 (ja) | 2010-04-19 | 2011-04-13 | マクロピンハイブリッド相互接続アレイ及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8296940B2 (https=) |
| EP (1) | EP2378551A3 (https=) |
| JP (1) | JP5906022B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5832956B2 (ja) | 2012-05-25 | 2015-12-16 | 株式会社東芝 | 半導体発光装置 |
| JP5869961B2 (ja) | 2012-05-28 | 2016-02-24 | 株式会社東芝 | 半導体発光装置 |
| US9351436B2 (en) * | 2013-03-08 | 2016-05-24 | Cochlear Limited | Stud bump bonding in implantable medical devices |
| DE102013214575B3 (de) * | 2013-07-25 | 2014-09-18 | Siemens Aktiengesellschaft | Halbleiterelement mit Lötstopplage und Verfahren zu seiner Erzeugung sowie Strahlungsdetektor und medizintechnisches Gerät mit einem solchen Strahlungsdetektor |
| US20150149534A1 (en) * | 2013-11-25 | 2015-05-28 | Contadd Limited | Systems and methods for creating, displaying and managing content units |
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| US4545610A (en) * | 1983-11-25 | 1985-10-08 | International Business Machines Corporation | Method for forming elongated solder connections between a semiconductor device and a supporting substrate |
| BR9510290A (pt) | 1994-12-23 | 1997-11-11 | Digirad | Câmera de raios gama semicondutores e sistema médico de formação de imagens |
| WO1999045411A1 (en) | 1997-02-18 | 1999-09-10 | Simage Oy | Semiconductor imaging device |
| JPH1117309A (ja) * | 1997-06-19 | 1999-01-22 | Hitachi Ltd | 電子部品の接続機構、これを用いた電子回路基板、接続機構の製造方法 |
| US6337445B1 (en) * | 1998-03-16 | 2002-01-08 | Texas Instruments Incorporated | Composite connection structure and method of manufacturing |
| US6657313B1 (en) * | 1999-01-19 | 2003-12-02 | International Business Machines Corporation | Dielectric interposer for chip to substrate soldering |
| JP3872236B2 (ja) * | 1999-09-28 | 2007-01-24 | 京セラ株式会社 | 配線基板およびその実装構造 |
| US6683375B2 (en) | 2001-06-15 | 2004-01-27 | Fairchild Semiconductor Corporation | Semiconductor die including conductive columns |
| DE10164494B9 (de) * | 2001-12-28 | 2014-08-21 | Epcos Ag | Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung |
| US6852926B2 (en) * | 2002-03-26 | 2005-02-08 | Intel Corporation | Packaging microelectromechanical structures |
| US20040007779A1 (en) | 2002-07-15 | 2004-01-15 | Diane Arbuthnot | Wafer-level method for fine-pitch, high aspect ratio chip interconnect |
| DE10238523B4 (de) * | 2002-08-22 | 2014-10-02 | Epcos Ag | Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung |
| US7223981B1 (en) | 2002-12-04 | 2007-05-29 | Aguila Technologies Inc. | Gamma ray detector modules |
| US8641913B2 (en) * | 2003-10-06 | 2014-02-04 | Tessera, Inc. | Fine pitch microcontacts and method for forming thereof |
| WO2005065207A2 (en) | 2003-12-30 | 2005-07-21 | Tessera, Inc. | Microelectronic packages and methods therefor |
| WO2005065333A2 (en) | 2003-12-30 | 2005-07-21 | Dxray, Inc. | Pixelated cadmium zinc telluride based photon counting mode detector |
| US7291842B2 (en) * | 2005-06-14 | 2007-11-06 | Varian Medical Systems Technologies, Inc. | Photoconductor imagers with sandwich structure |
| FR2890235B1 (fr) * | 2005-08-30 | 2007-09-28 | Commissariat Energie Atomique | Procede d'hybridation par protuberances de soudure de tailles differentes de deux composants entre eux et dispositif mettant en oeuvre deux composants hybrides entre eux selon ce procede |
| JP2007214191A (ja) * | 2006-02-07 | 2007-08-23 | Sumitomo Heavy Ind Ltd | 放射線検出器および放射線検査装置 |
| CA2541256A1 (en) | 2006-02-22 | 2007-08-22 | Redlen Technologies Inc. | Shielding electrode for monolithic radiation detector |
| US7462833B2 (en) * | 2007-04-17 | 2008-12-09 | Redlen Technologies | Multi-functional cathode packaging design for solid-state radiation detectors |
| JP2009081153A (ja) * | 2007-09-25 | 2009-04-16 | Taiyo Yuden Co Ltd | 半導体装置及び半導体装置を実装した回路装置 |
| SG152101A1 (en) | 2007-11-06 | 2009-05-29 | Agency Science Tech & Res | An interconnect structure and a method of fabricating the same |
-
2010
- 2010-04-19 US US12/762,610 patent/US8296940B2/en not_active Expired - Fee Related
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2011
- 2011-04-13 JP JP2011088708A patent/JP5906022B2/ja not_active Expired - Fee Related
- 2011-04-13 EP EP11162153A patent/EP2378551A3/en not_active Ceased
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2012
- 2012-09-14 US US13/616,217 patent/US20130000963A1/en not_active Abandoned
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| US8296940B2 (en) | 2012-10-30 |
| US20130000963A1 (en) | 2013-01-03 |
| JP2011228704A (ja) | 2011-11-10 |
| EP2378551A2 (en) | 2011-10-19 |
| US20110253430A1 (en) | 2011-10-20 |
| EP2378551A3 (en) | 2012-01-11 |
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