JP5903118B2 - 基板処理設備及び方法 - Google Patents

基板処理設備及び方法 Download PDF

Info

Publication number
JP5903118B2
JP5903118B2 JP2014040191A JP2014040191A JP5903118B2 JP 5903118 B2 JP5903118 B2 JP 5903118B2 JP 2014040191 A JP2014040191 A JP 2014040191A JP 2014040191 A JP2014040191 A JP 2014040191A JP 5903118 B2 JP5903118 B2 JP 5903118B2
Authority
JP
Japan
Prior art keywords
substrate
chamber
alignment
cooling
pusher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014040191A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014204121A (ja
Inventor
ジュ，チョルウォン
リー，セオクウィ
Original Assignee
ピーエスケー インコーポレイテッド
ピーエスケー インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ピーエスケー インコーポレイテッド, ピーエスケー インコーポレイテッド filed Critical ピーエスケー インコーポレイテッド
Publication of JP2014204121A publication Critical patent/JP2014204121A/ja
Application granted granted Critical
Publication of JP5903118B2 publication Critical patent/JP5903118B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2014040191A 2013-04-08 2014-03-03 基板処理設備及び方法 Active JP5903118B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0038100 2013-04-08
KR1020130038100A KR101433810B1 (ko) 2013-04-08 2013-04-08 기판 처리 설비 및 방법

Publications (2)

Publication Number Publication Date
JP2014204121A JP2014204121A (ja) 2014-10-27
JP5903118B2 true JP5903118B2 (ja) 2016-04-13

Family

ID=51671586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014040191A Active JP5903118B2 (ja) 2013-04-08 2014-03-03 基板処理設備及び方法

Country Status (4)

Country Link
JP (1) JP5903118B2 (zh)
KR (1) KR101433810B1 (zh)
CN (1) CN104103557B (zh)
TW (1) TWI532115B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101754589B1 (ko) * 2016-11-21 2017-07-10 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
US11139190B2 (en) * 2019-04-23 2021-10-05 Applied Materials, Inc. Equipment front end modules including multiple aligners, assemblies, and methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0857296A (ja) * 1994-08-17 1996-03-05 Dainippon Screen Mfg Co Ltd プラズマ処理装置
JPH09219437A (ja) * 1996-02-13 1997-08-19 Nikon Corp 位置決め装置
JP2000223547A (ja) * 1999-01-27 2000-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000286325A (ja) * 1999-03-31 2000-10-13 Jeol Ltd ウエハアライメント装置
SG94851A1 (en) * 2000-07-12 2003-03-18 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP3801849B2 (ja) * 2000-08-07 2006-07-26 東京エレクトロン株式会社 基板処理装置及びその方法
KR20070014277A (ko) * 2005-07-28 2007-02-01 삼성전자주식회사 반도체 제조설비
JP2007150280A (ja) * 2005-11-04 2007-06-14 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
KR100839911B1 (ko) * 2006-12-29 2008-06-19 세메스 주식회사 기판 처리 장치
JP2009071008A (ja) * 2007-09-13 2009-04-02 Sokudo:Kk 基板処理装置
JP5388279B2 (ja) * 2009-02-27 2014-01-15 インテバック・インコーポレイテッド 基板搬送処理装置及び方法
JP5755844B2 (ja) * 2010-05-31 2015-07-29 株式会社ダイヘン ワーク搬送システム

Also Published As

Publication number Publication date
CN104103557A (zh) 2014-10-15
JP2014204121A (ja) 2014-10-27
TW201440168A (zh) 2014-10-16
KR101433810B1 (ko) 2014-08-26
CN104103557B (zh) 2017-04-12
TWI532115B (zh) 2016-05-01

Similar Documents

Publication Publication Date Title
US10431481B2 (en) Load lock apparatus and substrate processing system
US20190341283A1 (en) Substrate processing apparatus
TWI526382B (zh) 用於基板處理的叢集式設備
US20080236755A1 (en) Single-wafer type substrate processing apparatus having a carry-in port provided with first and second placement tables arranged in a line
KR20040044624A (ko) 다중 클러스터 장치
TWI534935B (zh) 基板處理模組、包括該基板處理模組之基板處理裝置以及基板轉移方法
US20150096685A1 (en) Vacuum processing apparatus
JP5903118B2 (ja) 基板処理設備及び方法
JP2001230312A (ja) 半導体製造装置
WO2012108439A1 (ja) 基板中継装置，基板中継方法，基板処理装置
JP2019520701A (ja) １２面形の移送チャンバ、及び、かかる移送チャンバを有する処理システム
US20160379858A1 (en) Substrate processing apparatus
US20160086835A1 (en) Cover opening/closing apparatus and cover opening/closing method
KR102344109B1 (ko) 본딩 스테이지 및 이를 구비하는 다이 본딩 장치
KR20100135626A (ko) 기판이송장치 및 이를 포함하는 기판처리시스템
JP2011222633A (ja) 基板貼り合わせ装置、積層半導体の製造方法および積層半導体
KR102431938B1 (ko) 기판 반송 장치 및 기판 반송 방법
KR100749755B1 (ko) 웨이퍼 처리장치
KR100781082B1 (ko) 기판 반송 장치 및 그것을 사용한 기판 처리 설비
JP2004080053A (ja) 半導体製造装置
KR20060082486A (ko) 기판 냉각 장치
KR100566697B1 (ko) 반도체 소자 제조용 멀티 챔버 시스템 및 이를 이용한반도체 소자의 제조방법
KR101131417B1 (ko) 로드락 장치 및 이를 설치한 로드락 챔버
JP2021072424A (ja) 基板収容ユニット及び基板搬送装置における真空搬送ユニットのメンテナンス方法
KR20090070666A (ko) 지지유닛 및 상기 지지유닛의 기판 처리 방법, 그리고 상기지지유닛을 구비하는 베이크 장치

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150317

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150612

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150617

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160301

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160311

R150 Certificate of patent or registration of utility model

Ref document number: 5903118

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250