JP5901991B2 - 電子部品パッケージ及びその製造方法 - Google Patents

電子部品パッケージ及びその製造方法 Download PDF

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Publication number
JP5901991B2
JP5901991B2 JP2012034103A JP2012034103A JP5901991B2 JP 5901991 B2 JP5901991 B2 JP 5901991B2 JP 2012034103 A JP2012034103 A JP 2012034103A JP 2012034103 A JP2012034103 A JP 2012034103A JP 5901991 B2 JP5901991 B2 JP 5901991B2
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Prior art keywords
electronic component
adhesive
substrate
inorganic film
component package
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JP2012034103A
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English (en)
Japanese (ja)
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JP2013171930A5 (https=
JP2013171930A (ja
Inventor
白石　晶紀
晶紀 白石
村山　啓
啓 村山
東　光敏
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2012034103A priority Critical patent/JP5901991B2/ja
Publication of JP2013171930A publication Critical patent/JP2013171930A/ja
Publication of JP2013171930A5 publication Critical patent/JP2013171930A5/ja
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Publication of JP5901991B2 publication Critical patent/JP5901991B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Micromachines (AREA)
JP2012034103A 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法 Active JP5901991B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012034103A JP5901991B2 (ja) 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012034103A JP5901991B2 (ja) 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013171930A JP2013171930A (ja) 2013-09-02
JP2013171930A5 JP2013171930A5 (https=) 2015-03-05
JP5901991B2 true JP5901991B2 (ja) 2016-04-13

Family

ID=49265712

Family Applications (1)

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JP2012034103A Active JP5901991B2 (ja) 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法

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JP (1) JP5901991B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200035600A (ko) * 2018-09-27 2020-04-06 삼성전자주식회사 팬-아웃 반도체 패키지

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10508030B2 (en) * 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
JP7755462B2 (ja) * 2021-11-16 2025-10-16 株式会社東芝 センサ及び電子装置
JP2024002471A (ja) * 2022-06-24 2024-01-11 セイコーエプソン株式会社 振動デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4342174B2 (ja) * 2002-12-27 2009-10-14 新光電気工業株式会社 電子デバイス及びその製造方法
JP2010028025A (ja) * 2008-07-24 2010-02-04 Toyota Motor Corp 電子装置
JP2010177435A (ja) * 2009-01-29 2010-08-12 Yokogawa Electric Corp 赤外線光源
JP5568786B2 (ja) * 2009-12-24 2014-08-13 新光電気工業株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP5134045B2 (ja) * 2010-06-23 2013-01-30 日本電波工業株式会社 圧電デバイス及びその製造方法
JP2012028454A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd 部分めっき方法、金属製蓋部材、および電子部品。

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200035600A (ko) * 2018-09-27 2020-04-06 삼성전자주식회사 팬-아웃 반도체 패키지

Also Published As

Publication number Publication date
JP2013171930A (ja) 2013-09-02

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