JP5901991B2 - 電子部品パッケージ及びその製造方法 - Google Patents

電子部品パッケージ及びその製造方法 Download PDF

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Publication number
JP5901991B2
JP5901991B2 JP2012034103A JP2012034103A JP5901991B2 JP 5901991 B2 JP5901991 B2 JP 5901991B2 JP 2012034103 A JP2012034103 A JP 2012034103A JP 2012034103 A JP2012034103 A JP 2012034103A JP 5901991 B2 JP5901991 B2 JP 5901991B2
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JP
Japan
Prior art keywords
electronic component
adhesive
substrate
inorganic film
component package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012034103A
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English (en)
Japanese (ja)
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JP2013171930A (ja
JP2013171930A5 (enExample
Inventor
白石　晶紀
晶紀 白石
村山　啓
啓 村山
東　光敏
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012034103A priority Critical patent/JP5901991B2/ja
Publication of JP2013171930A publication Critical patent/JP2013171930A/ja
Publication of JP2013171930A5 publication Critical patent/JP2013171930A5/ja
Application granted granted Critical
Publication of JP5901991B2 publication Critical patent/JP5901991B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Micromachines (AREA)
JP2012034103A 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法 Active JP5901991B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012034103A JP5901991B2 (ja) 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012034103A JP5901991B2 (ja) 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013171930A JP2013171930A (ja) 2013-09-02
JP2013171930A5 JP2013171930A5 (enExample) 2015-03-05
JP5901991B2 true JP5901991B2 (ja) 2016-04-13

Family

ID=49265712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012034103A Active JP5901991B2 (ja) 2012-02-20 2012-02-20 電子部品パッケージ及びその製造方法

Country Status (1)

Country Link
JP (1) JP5901991B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200035600A (ko) * 2018-09-27 2020-04-06 삼성전자주식회사 팬-아웃 반도체 패키지

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10508030B2 (en) * 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
JP7755462B2 (ja) * 2021-11-16 2025-10-16 株式会社東芝 センサ及び電子装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4342174B2 (ja) * 2002-12-27 2009-10-14 新光電気工業株式会社 電子デバイス及びその製造方法
JP2010028025A (ja) * 2008-07-24 2010-02-04 Toyota Motor Corp 電子装置
JP2010177435A (ja) * 2009-01-29 2010-08-12 Yokogawa Electric Corp 赤外線光源
JP5568786B2 (ja) * 2009-12-24 2014-08-13 新光電気工業株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP5134045B2 (ja) * 2010-06-23 2013-01-30 日本電波工業株式会社 圧電デバイス及びその製造方法
JP2012028454A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd 部分めっき方法、金属製蓋部材、および電子部品。

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200035600A (ko) * 2018-09-27 2020-04-06 삼성전자주식회사 팬-아웃 반도체 패키지

Also Published As

Publication number Publication date
JP2013171930A (ja) 2013-09-02

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