JP5896346B2 - 炭化珪素半導体 - Google Patents

炭化珪素半導体 Download PDF

Info

Publication number
JP5896346B2
JP5896346B2 JP2015051636A JP2015051636A JP5896346B2 JP 5896346 B2 JP5896346 B2 JP 5896346B2 JP 2015051636 A JP2015051636 A JP 2015051636A JP 2015051636 A JP2015051636 A JP 2015051636A JP 5896346 B2 JP5896346 B2 JP 5896346B2
Authority
JP
Japan
Prior art keywords
gas
silicon carbide
nitrogen
substrate
carbide semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2015051636A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015122540A5 (enExample
JP2015122540A (ja
Inventor
太郎 西口
太郎 西口
原田 真
真 原田
木下 博之
博之 木下
弘 塩見
弘 塩見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=53533848&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5896346(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2015051636A priority Critical patent/JP5896346B2/ja
Publication of JP2015122540A publication Critical patent/JP2015122540A/ja
Publication of JP2015122540A5 publication Critical patent/JP2015122540A5/ja
Application granted granted Critical
Publication of JP5896346B2 publication Critical patent/JP5896346B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
JP2015051636A 2015-03-16 2015-03-16 炭化珪素半導体 Expired - Lifetime JP5896346B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015051636A JP5896346B2 (ja) 2015-03-16 2015-03-16 炭化珪素半導体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015051636A JP5896346B2 (ja) 2015-03-16 2015-03-16 炭化珪素半導体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2014089900A Division JP2014166957A (ja) 2014-04-24 2014-04-24 炭化珪素半導体およびその製造方法と製造装置

Publications (3)

Publication Number Publication Date
JP2015122540A JP2015122540A (ja) 2015-07-02
JP2015122540A5 JP2015122540A5 (enExample) 2015-12-24
JP5896346B2 true JP5896346B2 (ja) 2016-03-30

Family

ID=53533848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015051636A Expired - Lifetime JP5896346B2 (ja) 2015-03-16 2015-03-16 炭化珪素半導体

Country Status (1)

Country Link
JP (1) JP5896346B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115961346A (zh) * 2022-12-29 2023-04-14 深圳市重投天科半导体有限公司 大尺寸碳化硅外延气体供应装置及供应方法
CN117373913B (zh) * 2023-10-19 2025-05-16 瀚天天成电子科技(厦门)股份有限公司 一种n型掺杂碳化硅的外延生长工艺
CN118064871B (zh) * 2023-12-29 2025-05-09 苏州精材半导体科技有限公司 一种电阻率均匀的碳化硅膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177700A (ja) * 1984-09-20 1986-04-21 Nec Corp 2−6族化合物半導体への窒素ド−ピング方法
JP2749898B2 (ja) * 1989-08-21 1998-05-13 昭和電工株式会社 半導体SiC単結晶の製造法
JPH04111419A (ja) * 1990-08-31 1992-04-13 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体気相成長法および装置
JPH0570295A (ja) * 1991-03-28 1993-03-23 Tdk Corp 単結晶炭化珪素の形成方法
JPH0629228A (ja) * 1992-07-10 1994-02-04 Nec Corp 結晶成長方法
JPH07131067A (ja) * 1993-11-08 1995-05-19 Sanyo Electric Co Ltd 炭化ケイ素ウエハの製造方法及び炭化ケイ素発光ダイオード素子の製造方法
JP3671532B2 (ja) * 1996-07-19 2005-07-13 豊田合成株式会社 半導体発光素子の製造方法
JP3650727B2 (ja) * 2000-08-10 2005-05-25 Hoya株式会社 炭化珪素製造方法
JP4374786B2 (ja) * 2001-02-23 2009-12-02 住友電気工業株式会社 Cvd装置および薄膜製造方法
US6759327B2 (en) * 2001-10-09 2004-07-06 Applied Materials Inc. Method of depositing low k barrier layers
JP4284944B2 (ja) * 2002-08-23 2009-06-24 ソニー株式会社 窒化ガリウム系半導体レーザ素子の製造方法

Also Published As

Publication number Publication date
JP2015122540A (ja) 2015-07-02

Similar Documents

Publication Publication Date Title
JP4839646B2 (ja) 炭化珪素半導体の製造方法および炭化珪素半導体の製造装置
WO2015114961A1 (ja) 炭化珪素エピタキシャル基板および炭化珪素エピタキシャル基板の製造方法
JP2018522412A (ja) 単結晶シリコン上でのエピタキシャル3C−SiCの成長
JP2014166957A5 (enExample)
JP2014166957A (ja) 炭化珪素半導体およびその製造方法と製造装置
JP6915627B2 (ja) 炭化珪素エピタキシャル基板の製造方法
US9368345B2 (en) Method of manufacturing silicon carbide semiconductor substrate and method of manufacturing silicon carbide semiconductor device
CN107109694A (zh) 晶体生长装置、碳化硅单晶的制造方法、碳化硅单晶基板和碳化硅外延基板
EP3879010A1 (en) Sic semiconductor substrate, and, production method therefor and production device therefor
JP5943509B2 (ja) 炭化珪素基板への成膜方法
JP5896346B2 (ja) 炭化珪素半導体
US10337119B2 (en) Method of manufacturing silicon carbide epitaxial substrate
JP2018108916A (ja) 炭化珪素エピタキシャル基板の製造方法
JP2015122540A5 (enExample)
JP5648442B2 (ja) 炭化珪素半導体
JP2018177616A (ja) 炭化珪素エピタキシャル基板の製造方法
JP2018168052A (ja) 炭化珪素単結晶インゴットの製造方法
JP2015042602A (ja) 炭化珪素半導体基板の製造方法および炭化珪素半導体装置の製造方法
US9269572B2 (en) Method for manufacturing silicon carbide semiconductor substrate
JP2014232799A (ja) 炭化珪素半導体基板の製造方法
KR20130044789A (ko) 에피 웨이퍼 제조 장치, 에피 웨이퍼 제조 방법 및 에피 웨이퍼
US20140065800A1 (en) Method for manufacturing silicon carbide semiconductor device
JP2014103363A (ja) 炭化珪素半導体基板の製造方法
JP7143638B2 (ja) 炭化珪素エピタキシャル基板の製造方法
US20200219981A1 (en) Silicon carbide epitaxial substrate

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151105

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160208

R150 Certificate of patent or registration of utility model

Ref document number: 5896346

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160221

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D04

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term