JP5889160B2 - 電子機器の製造方法 - Google Patents

電子機器の製造方法 Download PDF

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Publication number
JP5889160B2
JP5889160B2 JP2012229799A JP2012229799A JP5889160B2 JP 5889160 B2 JP5889160 B2 JP 5889160B2 JP 2012229799 A JP2012229799 A JP 2012229799A JP 2012229799 A JP2012229799 A JP 2012229799A JP 5889160 B2 JP5889160 B2 JP 5889160B2
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solder
recess
solder bump
substrate
electrode
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JP2012229799A
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Japanese (ja)
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JP2014082362A5 (enExample
JP2014082362A (ja
Inventor
晋助 浅田
晋助 浅田
濱口　恒夫
恒夫 濱口
林　建一
建一 林
山口　義弘
義弘 山口
秀俊 石橋
秀俊 石橋
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2012229799A priority Critical patent/JP5889160B2/ja
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Publication of JP2014082362A5 publication Critical patent/JP2014082362A5/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012229799A 2012-10-17 2012-10-17 電子機器の製造方法 Active JP5889160B2 (ja)

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JP2012229799A JP5889160B2 (ja) 2012-10-17 2012-10-17 電子機器の製造方法

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JP2012229799A JP5889160B2 (ja) 2012-10-17 2012-10-17 電子機器の製造方法

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JP2014082362A JP2014082362A (ja) 2014-05-08
JP2014082362A5 JP2014082362A5 (enExample) 2014-11-20
JP5889160B2 true JP5889160B2 (ja) 2016-03-22

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117581343A (zh) * 2021-06-30 2024-02-20 株式会社力森诺科 焊料凸块形成方法
WO2023277085A1 (ja) * 2021-06-30 2023-01-05 昭和電工マテリアルズ株式会社 はんだバンプ形成用部材
CN119340211A (zh) * 2024-12-18 2025-01-21 广州先艺电子科技有限公司 一种在陶瓷管壳上预置金锡焊料的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04321230A (ja) * 1990-12-04 1992-11-11 Nec Corp 半田供給方法
JPH09199504A (ja) * 1996-01-18 1997-07-31 Nec Corp 半田供給方法
JP3401391B2 (ja) * 1996-04-16 2003-04-28 日本特殊陶業株式会社 半田バンプを有する基板の製造方法
JP4811655B2 (ja) * 2006-07-05 2011-11-09 日立金属株式会社 異径ボール搭載用治具及び異径ボール搭載方法
JP2012049207A (ja) * 2010-08-25 2012-03-08 Ulvac Seimaku Kk バンプ形成方法

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