JP2014082362A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014082362A5 JP2014082362A5 JP2012229799A JP2012229799A JP2014082362A5 JP 2014082362 A5 JP2014082362 A5 JP 2014082362A5 JP 2012229799 A JP2012229799 A JP 2012229799A JP 2012229799 A JP2012229799 A JP 2012229799A JP 2014082362 A5 JP2014082362 A5 JP 2014082362A5
- Authority
- JP
- Japan
- Prior art keywords
- solder
- recess
- preparing
- manufacturing
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012229799A JP5889160B2 (ja) | 2012-10-17 | 2012-10-17 | 電子機器の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012229799A JP5889160B2 (ja) | 2012-10-17 | 2012-10-17 | 電子機器の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014082362A JP2014082362A (ja) | 2014-05-08 |
| JP2014082362A5 true JP2014082362A5 (enExample) | 2014-11-20 |
| JP5889160B2 JP5889160B2 (ja) | 2016-03-22 |
Family
ID=50786282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012229799A Active JP5889160B2 (ja) | 2012-10-17 | 2012-10-17 | 電子機器の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5889160B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240027705A (ko) * | 2021-06-30 | 2024-03-04 | 가부시끼가이샤 레조낙 | 땜납 범프 형성 방법 |
| KR20240027706A (ko) * | 2021-06-30 | 2024-03-04 | 가부시끼가이샤 레조낙 | 땜납 범프 형성용 부재 |
| CN119340211A (zh) * | 2024-12-18 | 2025-01-21 | 广州先艺电子科技有限公司 | 一种在陶瓷管壳上预置金锡焊料的方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04321230A (ja) * | 1990-12-04 | 1992-11-11 | Nec Corp | 半田供給方法 |
| JPH09199504A (ja) * | 1996-01-18 | 1997-07-31 | Nec Corp | 半田供給方法 |
| JP3401391B2 (ja) * | 1996-04-16 | 2003-04-28 | 日本特殊陶業株式会社 | 半田バンプを有する基板の製造方法 |
| JP4811655B2 (ja) * | 2006-07-05 | 2011-11-09 | 日立金属株式会社 | 異径ボール搭載用治具及び異径ボール搭載方法 |
| JP2012049207A (ja) * | 2010-08-25 | 2012-03-08 | Ulvac Seimaku Kk | バンプ形成方法 |
-
2012
- 2012-10-17 JP JP2012229799A patent/JP5889160B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016096292A5 (enExample) | ||
| JP2012054578A5 (enExample) | ||
| JP2013118255A5 (enExample) | ||
| JP2015216344A5 (enExample) | ||
| JP2016046418A5 (enExample) | ||
| EP2645415A3 (en) | Lead frame, semiconductor device, and method for manufacturing lead frame | |
| JP2014036110A5 (enExample) | ||
| JP2016173541A5 (enExample) | ||
| JP2017022300A5 (enExample) | ||
| JP2012024564A5 (enExample) | ||
| JP2013106033A (ja) | 半導体パッケージ及びその製造方法 | |
| JP2014049558A5 (enExample) | ||
| JP2011222596A5 (enExample) | ||
| JP2013098209A5 (enExample) | ||
| JP2013243221A5 (enExample) | ||
| JP2014192386A5 (enExample) | ||
| JP2016207959A5 (enExample) | ||
| JP2014082362A5 (enExample) | ||
| JP2013012522A5 (ja) | パッケージの製造方法およびｐｏｐ構造体 | |
| JP2012082510A5 (enExample) | ||
| JP2015220428A5 (enExample) | ||
| JP2014057124A5 (enExample) | ||
| JP2017139433A5 (enExample) | ||
| JP2015204263A5 (enExample) | ||
| JP6263554B2 (ja) | 半導体チップ配置の形成方法 |