JP5875250B2 - インプリント装置、インプリント方法及びデバイス製造方法 - Google Patents

インプリント装置、インプリント方法及びデバイス製造方法 Download PDF

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Publication number
JP5875250B2
JP5875250B2 JP2011101311A JP2011101311A JP5875250B2 JP 5875250 B2 JP5875250 B2 JP 5875250B2 JP 2011101311 A JP2011101311 A JP 2011101311A JP 2011101311 A JP2011101311 A JP 2011101311A JP 5875250 B2 JP5875250 B2 JP 5875250B2
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Japan
Prior art keywords
substrate
pattern
mold
shot
region
Prior art date
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Active
Application number
JP2011101311A
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English (en)
Japanese (ja)
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JP2012234913A5 (enExample
JP2012234913A (ja
Inventor
松本　英樹
英樹 松本
文夫 坂井
文夫 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011101311A priority Critical patent/JP5875250B2/ja
Priority to US13/451,925 priority patent/US9387607B2/en
Priority to KR1020120044491A priority patent/KR101503975B1/ko
Publication of JP2012234913A publication Critical patent/JP2012234913A/ja
Publication of JP2012234913A5 publication Critical patent/JP2012234913A5/ja
Priority to US14/748,104 priority patent/US10144156B2/en
Application granted granted Critical
Publication of JP5875250B2 publication Critical patent/JP5875250B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/757—Moulds, cores, dies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2011101311A 2011-04-28 2011-04-28 インプリント装置、インプリント方法及びデバイス製造方法 Active JP5875250B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011101311A JP5875250B2 (ja) 2011-04-28 2011-04-28 インプリント装置、インプリント方法及びデバイス製造方法
US13/451,925 US9387607B2 (en) 2011-04-28 2012-04-20 Imprint apparatus, imprint method, and method for producing device
KR1020120044491A KR101503975B1 (ko) 2011-04-28 2012-04-27 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법
US14/748,104 US10144156B2 (en) 2011-04-28 2015-06-23 Imprint apparatus, imprint method, and method for producing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011101311A JP5875250B2 (ja) 2011-04-28 2011-04-28 インプリント装置、インプリント方法及びデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2012234913A JP2012234913A (ja) 2012-11-29
JP2012234913A5 JP2012234913A5 (enExample) 2014-06-19
JP5875250B2 true JP5875250B2 (ja) 2016-03-02

Family

ID=47067295

Family Applications (1)

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JP2011101311A Active JP5875250B2 (ja) 2011-04-28 2011-04-28 インプリント装置、インプリント方法及びデバイス製造方法

Country Status (3)

Country Link
US (2) US9387607B2 (enExample)
JP (1) JP5875250B2 (enExample)
KR (1) KR101503975B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102137A (ja) * 2011-10-14 2013-05-23 Canon Inc インプリント装置、それを用いた物品の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6021365B2 (ja) * 2012-03-12 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6242099B2 (ja) * 2013-07-23 2017-12-06 キヤノン株式会社 インプリント方法、インプリント装置およびデバイス製造方法
JP6178694B2 (ja) * 2013-10-17 2017-08-09 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6333031B2 (ja) 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6478565B2 (ja) * 2014-11-06 2019-03-06 キヤノン株式会社 インプリントシステム及び物品の製造方法
SG10201603103UA (en) * 2015-04-30 2016-11-29 Canon Kk Imprint device, substrate conveying device, imprinting method, and method for manufacturing article
US10199244B2 (en) 2015-08-11 2019-02-05 Canon Kabushiki Kaisha Imprint apparatus, and method of manufacturing article
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
JP7039222B2 (ja) * 2017-09-11 2022-03-22 キオクシア株式会社 インプリント装置及びインプリント方法
US11036130B2 (en) * 2017-10-19 2021-06-15 Canon Kabushiki Kaisha Drop placement evaluation
JP7284639B2 (ja) * 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法
JP7508285B2 (ja) 2020-06-22 2024-07-01 キヤノン株式会社 パターン形成方法、インプリント装置、及び物品の製造方法

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US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
KR100633019B1 (ko) * 2004-12-24 2006-10-12 한국기계연구원 미세 임프린트 리소그래피 공정에서 스탬프와 기판의이격공정 및 그 장치
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7635263B2 (en) * 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
US20070035717A1 (en) * 2005-08-12 2007-02-15 Wei Wu Contact lithography apparatus, system and method
JP2007083626A (ja) * 2005-09-22 2007-04-05 Ricoh Co Ltd 微細構造転写装置
US7517211B2 (en) * 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US7695667B2 (en) * 2006-03-01 2010-04-13 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for separating a stamper from a patterned substrate
EP2007566A4 (en) * 2006-04-03 2010-10-13 Molecular Imprints Inc CHUCK SYSTEM COMPRISING A NETWORK OF FLUID CHAMBERS
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
WO2008068701A2 (en) * 2006-12-04 2008-06-12 Koninklijke Philips Electronics N.V. Method and apparatus for applying a sheet to a substrate
NL2003380A (en) 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
JP2010239118A (ja) * 2009-03-11 2010-10-21 Canon Inc インプリント装置および方法
NL2004932A (en) * 2009-07-27 2011-01-31 Asml Netherlands Bv Imprint lithography template.
WO2011139782A1 (en) * 2010-04-27 2011-11-10 Molecular Imprints, Inc. Separation control substrate/template for nanoimprint lithography
JP2012134214A (ja) * 2010-12-20 2012-07-12 Canon Inc インプリント装置、および、物品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102137A (ja) * 2011-10-14 2013-05-23 Canon Inc インプリント装置、それを用いた物品の製造方法
US9566741B2 (en) 2011-10-14 2017-02-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, and article manufacturing method

Also Published As

Publication number Publication date
KR101503975B1 (ko) 2015-03-18
US10144156B2 (en) 2018-12-04
US20120274006A1 (en) 2012-11-01
US9387607B2 (en) 2016-07-12
JP2012234913A (ja) 2012-11-29
KR20120122955A (ko) 2012-11-07
US20150290846A1 (en) 2015-10-15

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