KR101503975B1 - 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Download PDF

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Publication number
KR101503975B1
KR101503975B1 KR1020120044491A KR20120044491A KR101503975B1 KR 101503975 B1 KR101503975 B1 KR 101503975B1 KR 1020120044491 A KR1020120044491 A KR 1020120044491A KR 20120044491 A KR20120044491 A KR 20120044491A KR 101503975 B1 KR101503975 B1 KR 101503975B1
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South Korea
Prior art keywords
substrate
pattern
suction force
shot
holding mechanism
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English (en)
Korean (ko)
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KR20120122955A (ko
Inventor
히데끼 마쯔모또
후미오 사까이
Original Assignee
캐논 가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/757—Moulds, cores, dies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020120044491A 2011-04-28 2012-04-27 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Active KR101503975B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-101311 2011-04-28
JP2011101311A JP5875250B2 (ja) 2011-04-28 2011-04-28 インプリント装置、インプリント方法及びデバイス製造方法

Publications (2)

Publication Number Publication Date
KR20120122955A KR20120122955A (ko) 2012-11-07
KR101503975B1 true KR101503975B1 (ko) 2015-03-18

Family

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KR1020120044491A Active KR101503975B1 (ko) 2011-04-28 2012-04-27 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법

Country Status (3)

Country Link
US (2) US9387607B2 (enExample)
JP (1) JP5875250B2 (enExample)
KR (1) KR101503975B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200140717A (ko) * 2019-06-07 2020-12-16 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6140966B2 (ja) 2011-10-14 2017-06-07 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6021365B2 (ja) * 2012-03-12 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6242099B2 (ja) * 2013-07-23 2017-12-06 キヤノン株式会社 インプリント方法、インプリント装置およびデバイス製造方法
JP6178694B2 (ja) * 2013-10-17 2017-08-09 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6478565B2 (ja) * 2014-11-06 2019-03-06 キヤノン株式会社 インプリントシステム及び物品の製造方法
SG10201603103UA (en) 2015-04-30 2016-11-29 Canon Kk Imprint device, substrate conveying device, imprinting method, and method for manufacturing article
US10199244B2 (en) 2015-08-11 2019-02-05 Canon Kabushiki Kaisha Imprint apparatus, and method of manufacturing article
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
JP7039222B2 (ja) * 2017-09-11 2022-03-22 キオクシア株式会社 インプリント装置及びインプリント方法
US11036130B2 (en) * 2017-10-19 2021-06-15 Canon Kabushiki Kaisha Drop placement evaluation
JP7508285B2 (ja) 2020-06-22 2024-07-01 キヤノン株式会社 パターン形成方法、インプリント装置、及び物品の製造方法

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KR100633019B1 (ko) * 2004-12-24 2006-10-12 한국기계연구원 미세 임프린트 리소그래피 공정에서 스탬프와 기판의이격공정 및 그 장치
JP2008529826A (ja) * 2005-01-31 2008-08-07 モレキュラー・インプリンツ・インコーポレーテッド ナノ加工のためのチャッキング・システム
US7635263B2 (en) * 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers

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US6734117B2 (en) 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
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US20070035717A1 (en) * 2005-08-12 2007-02-15 Wei Wu Contact lithography apparatus, system and method
JP2007083626A (ja) * 2005-09-22 2007-04-05 Ricoh Co Ltd 微細構造転写装置
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US7695667B2 (en) * 2006-03-01 2010-04-13 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for separating a stamper from a patterned substrate
JP4667524B2 (ja) * 2006-04-03 2011-04-13 モレキュラー・インプリンツ・インコーポレーテッド 流体チャンバのアレイを備えるチャック・システム
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JP5833636B2 (ja) * 2010-04-27 2015-12-16 モレキュラー・インプリンツ・インコーポレーテッド ナノインプリント・リソグラフィのテンプレート製作方法およびそのシステム
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JP2008529826A (ja) * 2005-01-31 2008-08-07 モレキュラー・インプリンツ・インコーポレーテッド ナノ加工のためのチャッキング・システム
US7635263B2 (en) * 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200140717A (ko) * 2019-06-07 2020-12-16 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법
KR102559861B1 (ko) 2019-06-07 2023-07-27 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법

Also Published As

Publication number Publication date
US10144156B2 (en) 2018-12-04
JP5875250B2 (ja) 2016-03-02
US20120274006A1 (en) 2012-11-01
US9387607B2 (en) 2016-07-12
JP2012234913A (ja) 2012-11-29
US20150290846A1 (en) 2015-10-15
KR20120122955A (ko) 2012-11-07

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