JP5873251B2 - 基板トレイ及び該トレイを用いた基板処理装置 - Google Patents
基板トレイ及び該トレイを用いた基板処理装置 Download PDFInfo
- Publication number
- JP5873251B2 JP5873251B2 JP2011101645A JP2011101645A JP5873251B2 JP 5873251 B2 JP5873251 B2 JP 5873251B2 JP 2011101645 A JP2011101645 A JP 2011101645A JP 2011101645 A JP2011101645 A JP 2011101645A JP 5873251 B2 JP5873251 B2 JP 5873251B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tray
- mounting plate
- holder
- magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 title claims description 512
- 238000012545 processing Methods 0.000 title claims description 58
- 239000000112 cooling gas Substances 0.000 claims description 30
- 230000004907 flux Effects 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 17
- 239000010936 titanium Substances 0.000 claims description 17
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 239000007789 gas Substances 0.000 claims description 14
- 239000000696 magnetic material Substances 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 26
- 230000000694 effects Effects 0.000 description 24
- 238000001816 cooling Methods 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 11
- 238000004544 sputter deposition Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005404 monopole Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011101645A JP5873251B2 (ja) | 2011-04-28 | 2011-04-28 | 基板トレイ及び該トレイを用いた基板処理装置 |
KR1020120041377A KR101366441B1 (ko) | 2011-04-28 | 2012-04-20 | 기판 트레이 및 상기 트레이를 이용한 기판 처리 장치 |
TW101114162A TWI503921B (zh) | 2011-04-28 | 2012-04-20 | A substrate tray and a substrate processing device using the tray |
CN201210128524.XA CN102760679B (zh) | 2011-04-28 | 2012-04-27 | 基板托架以及使用了该托架的基板处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011101645A JP5873251B2 (ja) | 2011-04-28 | 2011-04-28 | 基板トレイ及び該トレイを用いた基板処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012234930A JP2012234930A (ja) | 2012-11-29 |
JP2012234930A5 JP2012234930A5 (zh) | 2014-04-24 |
JP5873251B2 true JP5873251B2 (ja) | 2016-03-01 |
Family
ID=47055081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011101645A Active JP5873251B2 (ja) | 2011-04-28 | 2011-04-28 | 基板トレイ及び該トレイを用いた基板処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5873251B2 (zh) |
KR (1) | KR101366441B1 (zh) |
CN (1) | CN102760679B (zh) |
TW (1) | TWI503921B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105189812B (zh) * | 2013-03-15 | 2017-10-20 | 应用材料公司 | 用于基板的载具 |
GB201402126D0 (en) * | 2014-02-07 | 2014-03-26 | Spts Technologies Ltd | Method of processing a substrate |
US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
CN114054419B (zh) * | 2021-11-17 | 2023-04-11 | 新美光(苏州)半导体科技有限公司 | 硅电极的清洗装置、清洗方法 |
WO2023158555A1 (en) * | 2022-02-18 | 2023-08-24 | Applied Materials, Inc. | Substrate carrier to control temperature of substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02229421A (ja) * | 1989-03-02 | 1990-09-12 | Sumitomo Electric Ind Ltd | 露光装置 |
JP4428799B2 (ja) * | 2000-04-03 | 2010-03-10 | キヤノン株式会社 | 磁気支持機構、位置決め装置および半導体デバイス製造方法 |
JP4121763B2 (ja) * | 2002-04-08 | 2008-07-23 | Tdk株式会社 | 薄膜形成装置に対する基板の交換ユニットおよび基板交換方法 |
KR100523824B1 (ko) * | 2002-07-11 | 2005-10-25 | 에이에스엠엘 네델란즈 비.브이. | 기판홀더 및 디바이스 제조방법 |
JP2005120410A (ja) * | 2003-10-15 | 2005-05-12 | Renesas Technology Corp | 半導体装置の製造方法 |
JP4386753B2 (ja) * | 2004-02-19 | 2009-12-16 | キヤノンアネルバ株式会社 | ウェハーステージ及びプラズマ処理装置 |
KR100582036B1 (ko) * | 2004-04-12 | 2006-05-22 | 주식회사 테라세미콘 | 반도체 제조공법 및 반도체 제조장치의 기판홀더 |
JP4576200B2 (ja) * | 2004-10-21 | 2010-11-04 | キヤノンアネルバ株式会社 | 基板処理装置及び基板処理装置におけるアーキング発生監視方法 |
JP2007281050A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 半導体ウエハのウエハトレイ |
JP4699272B2 (ja) * | 2006-04-27 | 2011-06-08 | 株式会社フジクラ | 基板ホルダー |
JP4990636B2 (ja) * | 2007-01-11 | 2012-08-01 | 株式会社アルバック | 搬送トレーを用いた真空処理装置 |
JP4997141B2 (ja) * | 2008-02-21 | 2012-08-08 | 株式会社アルバック | 真空処理装置、基板の温度制御方法 |
US20100151680A1 (en) * | 2008-12-17 | 2010-06-17 | Optisolar Inc. | Substrate carrier with enhanced temperature uniformity |
JP2010177267A (ja) * | 2009-01-27 | 2010-08-12 | Ulvac Japan Ltd | 搬送トレー及びこの搬送トレーを用いた真空処理装置 |
JP2011023425A (ja) * | 2009-07-13 | 2011-02-03 | Canon Inc | ステージ装置、露光装置及びデバイス製造方法 |
-
2011
- 2011-04-28 JP JP2011101645A patent/JP5873251B2/ja active Active
-
2012
- 2012-04-20 TW TW101114162A patent/TWI503921B/zh active
- 2012-04-20 KR KR1020120041377A patent/KR101366441B1/ko active IP Right Grant
- 2012-04-27 CN CN201210128524.XA patent/CN102760679B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012234930A (ja) | 2012-11-29 |
KR101366441B1 (ko) | 2014-02-21 |
TWI503921B (zh) | 2015-10-11 |
CN102760679A (zh) | 2012-10-31 |
CN102760679B (zh) | 2015-07-15 |
TW201306164A (zh) | 2013-02-01 |
KR20120122905A (ko) | 2012-11-07 |
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