JP5869709B1 - 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 - Google Patents
熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 Download PDFInfo
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- JP5869709B1 JP5869709B1 JP2015011099A JP2015011099A JP5869709B1 JP 5869709 B1 JP5869709 B1 JP 5869709B1 JP 2015011099 A JP2015011099 A JP 2015011099A JP 2015011099 A JP2015011099 A JP 2015011099A JP 5869709 B1 JP5869709 B1 JP 5869709B1
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- 239000011342 resin composition Substances 0.000 title claims abstract description 48
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 44
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- 239000003086 colorant Substances 0.000 claims abstract description 42
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 33
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 20
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 13
- 229910052623 talc Inorganic materials 0.000 claims abstract description 13
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- 239000000758 substrate Substances 0.000 claims description 40
- 239000011521 glass Substances 0.000 claims description 34
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000002904 solvent Substances 0.000 abstract description 23
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- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
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- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
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- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
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- 125000000217 alkyl group Chemical group 0.000 description 2
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- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical Kinetics & Catalysis (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2015011099A JP5869709B1 (ja) | 2015-01-23 | 2015-01-23 | 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 |
| KR1020150160856A KR101880344B1 (ko) | 2015-01-23 | 2015-11-17 | 열경화성 수지 조성물, 그의 경화물, 및 그것을 사용한 디스플레이용 부재 |
| TW104139703A TWI585138B (zh) | 2015-01-23 | 2015-11-27 | A thermosetting resin composition, a hardened product thereof, and a display member using the same |
| CN201610023462.4A CN105820516B (zh) | 2015-01-23 | 2016-01-14 | 热硬化性树脂组成物、其硬化物、及使用其的显示器用构件 |
| HK16112090.6A HK1223959A1 (zh) | 2015-01-23 | 2016-10-20 | 熱硬化性樹脂組成物、其硬化物、及使用其的顯示器用構件 |
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| KR (1) | KR101880344B1 (zh) |
| CN (1) | CN105820516B (zh) |
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| KR102518495B1 (ko) | 2017-02-23 | 2023-04-05 | 동우 화인켐 주식회사 | 실리콘 화합물, 착색 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 화상 표시 장치 |
| CN114656771B (zh) * | 2020-12-24 | 2023-09-12 | 广东生益科技股份有限公司 | 一种树脂组合物及其应用 |
| CN115537165B (zh) * | 2022-11-30 | 2023-03-10 | 苏州润邦半导体材料科技有限公司 | 一种粘合剂组合物及其应用 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1112440A (ja) * | 1997-06-25 | 1999-01-19 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JP2013526639A (ja) * | 2010-05-20 | 2013-06-24 | サハトレーベン・ヒェミー・ゲーエムベーハー | 官能化粒子及びその使用 |
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| JPS62266805A (ja) | 1986-05-15 | 1987-11-19 | ダイヤ電子株式会社 | 印刷抵抗体の製造法 |
| EP2581423A1 (en) * | 2011-10-14 | 2013-04-17 | 3M Innovative Properties Company | Primerless multilayer adhesive film for bonding glass substrates |
| US8728345B2 (en) * | 2011-12-19 | 2014-05-20 | Momentive Performance Materials Inc. | Epoxy-containing polysiloxane oligomer compositions, process for making same and uses thereof |
| CN102827456B (zh) * | 2012-09-07 | 2016-03-16 | 黄山金瑞泰投资发展有限公司 | 环氧树脂组合物及其制备方法 |
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- 2015-11-17 KR KR1020150160856A patent/KR101880344B1/ko active IP Right Grant
- 2015-11-27 TW TW104139703A patent/TWI585138B/zh active
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2016
- 2016-01-14 CN CN201610023462.4A patent/CN105820516B/zh active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112440A (ja) * | 1997-06-25 | 1999-01-19 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JP2013526639A (ja) * | 2010-05-20 | 2013-06-24 | サハトレーベン・ヒェミー・ゲーエムベーハー | 官能化粒子及びその使用 |
Cited By (1)
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| JPWO2020196010A1 (zh) * | 2019-03-28 | 2020-10-01 |
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| Publication number | Publication date |
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| JP2016135827A (ja) | 2016-07-28 |
| HK1223959A1 (zh) | 2017-08-11 |
| CN105820516A (zh) | 2016-08-03 |
| KR20160091233A (ko) | 2016-08-02 |
| TWI585138B (zh) | 2017-06-01 |
| TW201627374A (zh) | 2016-08-01 |
| KR101880344B1 (ko) | 2018-07-19 |
| CN105820516B (zh) | 2018-01-16 |
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