HK1223959A1 - 熱硬化性樹脂組成物、其硬化物、及使用其的顯示器用構件 - Google Patents

熱硬化性樹脂組成物、其硬化物、及使用其的顯示器用構件

Info

Publication number
HK1223959A1
HK1223959A1 HK16112090.6A HK16112090A HK1223959A1 HK 1223959 A1 HK1223959 A1 HK 1223959A1 HK 16112090 A HK16112090 A HK 16112090A HK 1223959 A1 HK1223959 A1 HK 1223959A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
same
thermosetting resin
cured product
display component
Prior art date
Application number
HK16112090.6A
Other languages
English (en)
Inventor
劉權雄
朱陳郁涵
黃富康
Original Assignee
Taiwan Taiyo Ink Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Taiyo Ink Co Ltd filed Critical Taiwan Taiyo Ink Co Ltd
Publication of HK1223959A1 publication Critical patent/HK1223959A1/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10Epoxy resins modified by unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/102Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
HK16112090.6A 2015-01-23 2016-10-20 熱硬化性樹脂組成物、其硬化物、及使用其的顯示器用構件 HK1223959A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015011099A JP5869709B1 (ja) 2015-01-23 2015-01-23 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材

Publications (1)

Publication Number Publication Date
HK1223959A1 true HK1223959A1 (zh) 2017-08-11

Family

ID=55360930

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16112090.6A HK1223959A1 (zh) 2015-01-23 2016-10-20 熱硬化性樹脂組成物、其硬化物、及使用其的顯示器用構件

Country Status (5)

Country Link
JP (1) JP5869709B1 (zh)
KR (1) KR101880344B1 (zh)
CN (1) CN105820516B (zh)
HK (1) HK1223959A1 (zh)
TW (1) TWI585138B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102518495B1 (ko) 2017-02-23 2023-04-05 동우 화인켐 주식회사 실리콘 화합물, 착색 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 화상 표시 장치
WO2020196010A1 (ja) * 2019-03-28 2020-10-01 富士フイルム株式会社 導電性基板の製造方法
CN114656771B (zh) * 2020-12-24 2023-09-12 广东生益科技股份有限公司 一种树脂组合物及其应用
CN115537165B (zh) * 2022-11-30 2023-03-10 苏州润邦半导体材料科技有限公司 一种粘合剂组合物及其应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62266805A (ja) 1986-05-15 1987-11-19 ダイヤ電子株式会社 印刷抵抗体の製造法
JPH1112440A (ja) * 1997-06-25 1999-01-19 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
WO2012025105A1 (de) * 2010-05-20 2012-03-01 Sachtleben Chemie Gmbh Funktionalisierte partikel und deren verwendung
EP2581423A1 (en) * 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
US8728345B2 (en) * 2011-12-19 2014-05-20 Momentive Performance Materials Inc. Epoxy-containing polysiloxane oligomer compositions, process for making same and uses thereof
CN102827456B (zh) * 2012-09-07 2016-03-16 黄山金瑞泰投资发展有限公司 环氧树脂组合物及其制备方法

Also Published As

Publication number Publication date
JP2016135827A (ja) 2016-07-28
CN105820516A (zh) 2016-08-03
KR20160091233A (ko) 2016-08-02
TWI585138B (zh) 2017-06-01
JP5869709B1 (ja) 2016-02-24
TW201627374A (zh) 2016-08-01
KR101880344B1 (ko) 2018-07-19
CN105820516B (zh) 2018-01-16

Similar Documents

Publication Publication Date Title
EP3165549A4 (en) Epoxy resin composition for electronic material, cured product thereof and electronic member
EP3239206A4 (en) Epoxy resin, epoxy resin composition, inorganic-filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
EP3115416A4 (en) Thermosetting resin composition and use thereof
EP3235845A4 (en) Photocurable and thermosetting resin composition, cured product and laminate
EP3345951A4 (en) HARDENABLE COMPOSITION AND HARDENED ARTICLE THEREWITH
PT3450499T (pt) Composição de resina curável e produto curado obtido a partir da mesma
EP3623423A4 (en) COMPOSITION OF THERMOSETTING RESIN
EP3266833A4 (en) Polyamide resin composition
SG11201901693YA (en) Resin composition
EP3378898A4 (en) Curable composition and cured product thereof
HUE055552T2 (hu) Epoxigyanta készítmény és szerkezet
EP3623424A4 (en) COMPOSITION OF THERMOSETTING RESIN
EP3246364A4 (en) Curable composition and cured article obtained therefrom
SG11202003707SA (en) Resin composition
EP3336121A4 (en) CURABLE COMPOSITION AND CURED PRODUCT THEREOF
EP3162855A4 (en) Polyamide resin composition and molded article comprising same
EP3730526A4 (en) RESIN COMPOSITION, HARDENED PRODUCT AND LAMINATE
EP3378899A4 (en) THERMOSETTING MATERIAL AND CURED PRODUCT
SG11201801738TA (en) Epoxy resin, epoxy resin composition, cured product and electrical or electronic component
EP3456757A4 (en) POLYIMIDE RESIN AND POLYIMIDE RESIN COMPOSITION
EP3336122A4 (en) CURABLE COMPOSITION AND CURED PRODUCT THEREOF
EP3653659A4 (en) EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING IT, AND CURED PRODUCT OBTAINED FROM THE SAID EPOXY RESIN COMPOSITION
EP3613781A4 (en) COMPOSITION OF HARDENABLE RESIN, ASSOCIATED HARDENED OBJECT, AND STRUCTURE CONTAINING THIS HARDENED OBJECT
EP3118236A4 (en) Resin composition and cured product thereof
EP3374433A4 (en) HARDENABLE ORGANOPOLYSILOXANE COMPOSITION AND CURED PRODUCT THEREOF