JP5861846B2 - 電力変換器およびその製造方法 - Google Patents

電力変換器およびその製造方法 Download PDF

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Publication number
JP5861846B2
JP5861846B2 JP2013541637A JP2013541637A JP5861846B2 JP 5861846 B2 JP5861846 B2 JP 5861846B2 JP 2013541637 A JP2013541637 A JP 2013541637A JP 2013541637 A JP2013541637 A JP 2013541637A JP 5861846 B2 JP5861846 B2 JP 5861846B2
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insulating layer
metal block
power converter
wiring board
printed wiring
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Japanese (ja)
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JPWO2013065316A1 (ja
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岡本　健次
健次 岡本
茜 渡辺
茜 渡辺
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2013541637A 2011-11-02 2012-11-02 電力変換器およびその製造方法 Active JP5861846B2 (ja)

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JP2013541637A JP5861846B2 (ja) 2011-11-02 2012-11-02 電力変換器およびその製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2011240961 2011-11-02
JP2011240961 2011-11-02
JP2012079472 2012-03-30
JP2012079472 2012-03-30
JP2013541637A JP5861846B2 (ja) 2011-11-02 2012-11-02 電力変換器およびその製造方法
PCT/JP2012/007037 WO2013065316A1 (ja) 2011-11-02 2012-11-02 電力変換器

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JPWO2013065316A1 JPWO2013065316A1 (ja) 2015-04-02
JP5861846B2 true JP5861846B2 (ja) 2016-02-16

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DE (1) DE112012004593B4 (de)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110676236A (zh) * 2019-08-27 2020-01-10 华东光电集成器件研究所 一种厚膜功率混合集成电路

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112015000141B4 (de) 2014-03-31 2021-11-11 Fuji Electric Co., Ltd. Stromrichtvorrichtung
JP6699111B2 (ja) 2015-08-18 2020-05-27 富士電機株式会社 半導体装置及び半導体装置の製造方法
WO2017036946A1 (en) * 2015-09-03 2017-03-09 Lumileds Holding B.V. Method of making an led device
JP2023183301A (ja) * 2022-06-15 2023-12-27 日立Astemo株式会社 電力変換装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000228466A (ja) * 1999-02-08 2000-08-15 Hitachi Ltd 半導体装置及びその製造方法ならびに電子装置
JP3410398B2 (ja) * 1999-08-26 2003-05-26 ティーディーケイ株式会社 電力増幅モジュール
JP2003031741A (ja) * 2001-07-13 2003-01-31 Sumitomo Electric Ind Ltd 半導体集積装置
ATE369724T1 (de) * 2003-10-29 2007-08-15 Power One Italy Spa Wärmeableiteinsatz, schaltung mit einem solchen einsatz und verfahren zur herstellung
DE102004002743A1 (de) * 2004-01-20 2005-08-04 Stefan Kienitz Kühlkörper für Leistungselektronik
JP2006179856A (ja) * 2004-11-25 2006-07-06 Fuji Electric Holdings Co Ltd 絶縁基板および半導体装置
JP2007305772A (ja) * 2006-05-11 2007-11-22 Fuji Electric Device Technology Co Ltd 半導体装置および半導体装置の製造方法
DE102007037297A1 (de) * 2007-08-07 2009-02-19 Continental Automotive Gmbh Schaltungsträgeraufbau mit verbesserter Wärmeableitung
JP2009081246A (ja) * 2007-09-26 2009-04-16 Daikin Ind Ltd 半導体実装基板及びその製造方法
JP5246143B2 (ja) * 2009-11-24 2013-07-24 富士電機株式会社 半導体モジュールおよびその製造方法ならびに電気機器
JP2012074425A (ja) * 2010-09-28 2012-04-12 Daikin Ind Ltd パワーモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110676236A (zh) * 2019-08-27 2020-01-10 华东光电集成器件研究所 一种厚膜功率混合集成电路

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