JP5850064B2 - 振動計測装置及び振動計測方法 - Google Patents

振動計測装置及び振動計測方法 Download PDF

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Publication number
JP5850064B2
JP5850064B2 JP2013555245A JP2013555245A JP5850064B2 JP 5850064 B2 JP5850064 B2 JP 5850064B2 JP 2013555245 A JP2013555245 A JP 2013555245A JP 2013555245 A JP2013555245 A JP 2013555245A JP 5850064 B2 JP5850064 B2 JP 5850064B2
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Prior art keywords
vibration
sensor
measurement
vibration sensor
sensor holder
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Japanese (ja)
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JPWO2013111687A1 (ja
Inventor
哲博 前里
哲博 前里
勝 増井
勝 増井
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Meidensha Corp
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Meidensha Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00Measuring characteristics of vibrations in solids by using direct conduction to the detector

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
JP2013555245A 2012-01-24 2013-01-18 振動計測装置及び振動計測方法 Active JP5850064B2 (ja)

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JP2013555245A JP5850064B2 (ja) 2012-01-24 2013-01-18 振動計測装置及び振動計測方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012011987 2012-01-24
JP2012011987 2012-01-24
PCT/JP2013/050965 WO2013111687A1 (fr) 2012-01-24 2013-01-18 Dispositif et procédé de mesure de vibrations
JP2013555245A JP5850064B2 (ja) 2012-01-24 2013-01-18 振動計測装置及び振動計測方法

Publications (2)

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JPWO2013111687A1 JPWO2013111687A1 (ja) 2015-05-11
JP5850064B2 true JP5850064B2 (ja) 2016-02-03

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JP2013555245A Active JP5850064B2 (ja) 2012-01-24 2013-01-18 振動計測装置及び振動計測方法

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JP (1) JP5850064B2 (fr)
KR (1) KR101675926B1 (fr)
CN (1) CN104067095B (fr)
MX (1) MX2014008838A (fr)
WO (1) WO2013111687A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106052998B (zh) * 2016-07-14 2020-01-31 深圳市信维通信股份有限公司 振动器的测试系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5237780U (fr) * 1975-09-10 1977-03-17
JPH084201Y2 (ja) * 1987-08-18 1996-02-07 東芝機械株式会社 鋳造製品取出し装置の昇降腕
JPH05389U (ja) * 1991-06-25 1993-01-08 日本電気株式会社 パレツト用ハンド
JPH0737591U (ja) * 1993-04-16 1995-07-11 村田機械株式会社 ロボットハンド
JPH0686034U (ja) * 1993-05-27 1994-12-13 新日本製鐵株式会社 ロボットによる振動測定に用いる振動検出器保持装置
JPH08201159A (ja) 1995-01-26 1996-08-09 Omron Corp 振動センサ取付装置
JP5222177B2 (ja) * 2009-02-16 2013-06-26 大日本スクリーン製造株式会社 基板処理装置および基板保持機構

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Publication number Publication date
CN104067095A (zh) 2014-09-24
MX2014008838A (es) 2014-10-24
JPWO2013111687A1 (ja) 2015-05-11
KR20140113698A (ko) 2014-09-24
KR101675926B1 (ko) 2016-11-14
WO2013111687A1 (fr) 2013-08-01
CN104067095B (zh) 2016-12-07

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