JP5845672B2 - センサーデバイスおよび電子機器 - Google Patents
センサーデバイスおよび電子機器 Download PDFInfo
- Publication number
- JP5845672B2 JP5845672B2 JP2011154502A JP2011154502A JP5845672B2 JP 5845672 B2 JP5845672 B2 JP 5845672B2 JP 2011154502 A JP2011154502 A JP 2011154502A JP 2011154502 A JP2011154502 A JP 2011154502A JP 5845672 B2 JP5845672 B2 JP 5845672B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sensor
- fixed
- sensor device
- rigid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5769—Manufacturing; Mounting; Housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
- G01C21/166—Mechanical, construction or arrangement details of inertial navigation systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Gyroscopes (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011154502A JP5845672B2 (ja) | 2011-07-13 | 2011-07-13 | センサーデバイスおよび電子機器 |
| US13/545,075 US8960000B2 (en) | 2011-07-13 | 2012-07-10 | Sensor device, and electronic apparatus |
| CN201210240719.3A CN102878990B (zh) | 2011-07-13 | 2012-07-11 | 传感器装置以及电子设备 |
| US14/596,853 US10107653B2 (en) | 2011-07-13 | 2015-01-14 | Sensor device and electronic apparatus |
| US16/135,510 US10612948B2 (en) | 2011-07-13 | 2018-09-19 | Sensor device and electronic apparatus |
| US16/743,517 US11215484B2 (en) | 2011-07-13 | 2020-01-15 | Sensor device and electronic apparatus |
| US17/395,519 US11709079B2 (en) | 2011-07-13 | 2021-08-06 | Sensor device and electronic apparatus |
| US18/307,274 US12031847B2 (en) | 2011-07-13 | 2023-04-26 | Sensor device and electronic apparatus |
| US18/665,987 US12436006B2 (en) | 2011-07-13 | 2024-05-16 | Sensor device and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011154502A JP5845672B2 (ja) | 2011-07-13 | 2011-07-13 | センサーデバイスおよび電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015229383A Division JP6179580B2 (ja) | 2015-11-25 | 2015-11-25 | センサーデバイスおよび電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013019825A JP2013019825A (ja) | 2013-01-31 |
| JP2013019825A5 JP2013019825A5 (enExample) | 2014-08-21 |
| JP5845672B2 true JP5845672B2 (ja) | 2016-01-20 |
Family
ID=47480411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011154502A Active JP5845672B2 (ja) | 2011-07-13 | 2011-07-13 | センサーデバイスおよび電子機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (7) | US8960000B2 (enExample) |
| JP (1) | JP5845672B2 (enExample) |
| CN (1) | CN102878990B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121829B (zh) | 2010-08-09 | 2013-06-12 | 汪滔 | 一种微型惯性测量系统 |
| JP2014048090A (ja) * | 2012-08-30 | 2014-03-17 | Seiko Epson Corp | 電子モジュール、電子機器、及び移動体 |
| JP6136402B2 (ja) | 2013-03-15 | 2017-05-31 | セイコーエプソン株式会社 | センサーユニット、電子機器、および移動体 |
| US20140352264A1 (en) * | 2013-06-03 | 2014-12-04 | Craig Filicetti | Container with Orientation Sensor |
| JP2015034755A (ja) * | 2013-08-09 | 2015-02-19 | セイコーエプソン株式会社 | センサーユニット、電子機器、および移動体 |
| JP6255865B2 (ja) * | 2013-10-04 | 2018-01-10 | セイコーエプソン株式会社 | センサーユニット、電子機器、および移動体 |
| JP6188950B2 (ja) * | 2014-04-25 | 2017-08-30 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドSz Dji Technology Co.,Ltd | 慣性検出装置 |
| EP3171131A4 (en) | 2014-07-16 | 2018-03-07 | Seiko Epson Corporation | Sensor unit, electronic apparatus, and mobile body |
| JP6597069B2 (ja) * | 2015-09-02 | 2019-10-30 | セイコーエプソン株式会社 | センサーユニット、電子機器、および移動体 |
| JP6582237B2 (ja) * | 2016-01-12 | 2019-10-02 | パナソニックIpマネジメント株式会社 | 画像表示装置 |
| DE102018216663A1 (de) * | 2018-09-27 | 2020-04-02 | Continental Automotive Gmbh | Sensoreinrichtung |
| CN210469486U (zh) * | 2019-09-20 | 2020-05-05 | 北京海益同展信息科技有限公司 | 一种检测设备用工作台 |
| JP2024042245A (ja) * | 2022-09-15 | 2024-03-28 | セイコーエプソン株式会社 | 慣性計測装置 |
| DE102023211280A1 (de) * | 2023-11-14 | 2025-05-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikroelektromechanische Vorrichtung und Verfahren zur Herstellung einer mikroelektromechanischen Vorrichtung |
| CN117769114B (zh) * | 2023-12-22 | 2024-06-21 | 上海傲世控制科技股份有限公司 | 一种光纤陀螺仪的波导集成结构以及一种三轴光纤陀螺仪 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2159278B (en) * | 1984-05-23 | 1988-04-13 | Stc Plc | Heading sensor |
| US5241861A (en) * | 1991-02-08 | 1993-09-07 | Sundstrand Corporation | Micromachined rate and acceleration sensor |
| JPH088453Y2 (ja) * | 1991-04-15 | 1996-03-06 | 日本航空電子工業株式会社 | 加速度計 |
| JPH05340960A (ja) | 1992-06-09 | 1993-12-24 | Hitachi Ltd | 多次元加速度センサ |
| JPH07306047A (ja) * | 1994-05-10 | 1995-11-21 | Murata Mfg Co Ltd | 多軸検出型振動ジャイロ |
| US5542296A (en) * | 1995-01-03 | 1996-08-06 | Reidemeister; Eric P. | Compact capacitive acceleration sensor |
| US5777855A (en) * | 1996-06-18 | 1998-07-07 | Eastman Kodak Company | Method and apparatus for connecting flexible circuits to printed circuit boards |
| JP3780086B2 (ja) | 1998-01-22 | 2006-05-31 | Necトーキン株式会社 | 姿勢角度検出装置 |
| JPH11289141A (ja) | 1998-04-02 | 1999-10-19 | Toshiba Corp | 回路基板及びその製造方法 |
| DE19858621C2 (de) | 1998-12-18 | 2001-02-01 | Autoflug Gmbh | Verfahren zum Verbessern der Meßwerte eines inertialen Meßsystems |
| US6216537B1 (en) * | 1999-03-31 | 2001-04-17 | Medtronic, Inc. | Accelerometer for implantable medical device |
| JP2001102746A (ja) | 1999-09-30 | 2001-04-13 | Sony Corp | 回路装置とその製造方法 |
| JP3674440B2 (ja) * | 2000-02-15 | 2005-07-20 | 株式会社村田製作所 | 振動ジャイロ |
| US7152473B1 (en) * | 2000-03-17 | 2006-12-26 | Input/Output, Inc. | Integrated and multi-axis sensor assembly and packaging |
| JP3525862B2 (ja) * | 2000-05-22 | 2004-05-10 | トヨタ自動車株式会社 | センサ素子及びセンサ装置 |
| JP2002009228A (ja) | 2000-06-20 | 2002-01-11 | Seiko Epson Corp | 半導体装置 |
| US7040922B2 (en) | 2003-06-05 | 2006-05-09 | Analog Devices, Inc. | Multi-surface mounting member and electronic device |
| JP3966237B2 (ja) * | 2003-06-19 | 2007-08-29 | セイコーエプソン株式会社 | 圧電デバイス、圧電デバイスを搭載した電子機器 |
| JP2005197493A (ja) | 2004-01-08 | 2005-07-21 | Ihi Aerospace Co Ltd | 回路基板組立体 |
| US7137744B2 (en) * | 2004-06-14 | 2006-11-21 | Emcore Corporation | Fiber optic transceiver module with rigid and flexible circuit boards |
| JP2006017663A (ja) * | 2004-07-05 | 2006-01-19 | Alps Electric Co Ltd | 回転角検出装置 |
| JP4465607B2 (ja) * | 2004-12-27 | 2010-05-19 | 東洋電装株式会社 | 傾倒センサ |
| US8239162B2 (en) * | 2006-04-13 | 2012-08-07 | Tanenhaus & Associates, Inc. | Miniaturized inertial measurement unit and associated methods |
| JP2006337196A (ja) * | 2005-06-02 | 2006-12-14 | Kayaba Ind Co Ltd | 多軸加速度検出装置 |
| JP4935126B2 (ja) * | 2006-03-15 | 2012-05-23 | パナソニック株式会社 | 角速度センサ |
| DE102006030849B4 (de) * | 2006-07-04 | 2009-03-12 | Continental Automotive Gmbh | Sensorbaugruppe und Verfahren zum Herstellen einer Sensorbaugruppe |
| JP2008224428A (ja) * | 2007-03-13 | 2008-09-25 | Denso Corp | センサ装置 |
| JP2008256570A (ja) * | 2007-04-05 | 2008-10-23 | Fujitsu Media Device Kk | 角速度センサ |
| FR2924215B1 (fr) * | 2007-11-23 | 2010-01-01 | Thales Sa | Systeme comprenant deux instruments combines et procede d'alignement du systeme |
| US8100010B2 (en) * | 2008-04-14 | 2012-01-24 | Honeywell International Inc. | Method and system for forming an electronic assembly having inertial sensors mounted thereto |
| CN102004522A (zh) * | 2009-08-31 | 2011-04-06 | 鸿富锦精密工业(深圳)有限公司 | 主板 |
| US8368154B2 (en) * | 2010-02-17 | 2013-02-05 | The Regents Of The University Of California | Three dimensional folded MEMS technology for multi-axis sensor systems |
| JP5737848B2 (ja) * | 2010-03-01 | 2015-06-17 | セイコーエプソン株式会社 | センサーデバイス、センサーデバイスの製造方法、モーションセンサー及びモーションセンサーの製造方法 |
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2011
- 2011-07-13 JP JP2011154502A patent/JP5845672B2/ja active Active
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2012
- 2012-07-10 US US13/545,075 patent/US8960000B2/en active Active
- 2012-07-11 CN CN201210240719.3A patent/CN102878990B/zh active Active
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2015
- 2015-01-14 US US14/596,853 patent/US10107653B2/en active Active
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2018
- 2018-09-19 US US16/135,510 patent/US10612948B2/en active Active
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2020
- 2020-01-15 US US16/743,517 patent/US11215484B2/en active Active
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2021
- 2021-08-06 US US17/395,519 patent/US11709079B2/en active Active
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2023
- 2023-04-26 US US18/307,274 patent/US12031847B2/en active Active
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2024
- 2024-05-16 US US18/665,987 patent/US12436006B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US11215484B2 (en) | 2022-01-04 |
| US12436006B2 (en) | 2025-10-07 |
| US20210364330A1 (en) | 2021-11-25 |
| US20190017852A1 (en) | 2019-01-17 |
| JP2013019825A (ja) | 2013-01-31 |
| US20130014578A1 (en) | 2013-01-17 |
| US20240302191A1 (en) | 2024-09-12 |
| US10107653B2 (en) | 2018-10-23 |
| US8960000B2 (en) | 2015-02-24 |
| US11709079B2 (en) | 2023-07-25 |
| US10612948B2 (en) | 2020-04-07 |
| US20230258481A1 (en) | 2023-08-17 |
| US20150122020A1 (en) | 2015-05-07 |
| CN102878990A (zh) | 2013-01-16 |
| CN102878990B (zh) | 2015-12-02 |
| US12031847B2 (en) | 2024-07-09 |
| US20200149934A1 (en) | 2020-05-14 |
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