JP5818778B2 - リモートルミネセンス材料を用いた照明デバイス - Google Patents
リモートルミネセンス材料を用いた照明デバイス Download PDFInfo
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- 239000000463 material Substances 0.000 title claims description 293
- 230000007246 mechanism Effects 0.000 claims description 102
- 230000005540 biological transmission Effects 0.000 claims description 82
- 239000000919 ceramic Substances 0.000 claims description 39
- 229910052712 strontium Inorganic materials 0.000 claims description 33
- 229910052791 calcium Inorganic materials 0.000 claims description 30
- 229910052788 barium Inorganic materials 0.000 claims description 26
- 229910052693 Europium Inorganic materials 0.000 claims description 18
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims description 17
- 238000005286 illumination Methods 0.000 claims description 15
- 229910052684 Cerium Inorganic materials 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 239000002223 garnet Substances 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 11
- 102100032047 Alsin Human genes 0.000 claims description 8
- 101710187109 Alsin Proteins 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- 230000003595 spectral effect Effects 0.000 claims description 2
- 150000003568 thioethers Chemical class 0.000 claims description 2
- 239000011575 calcium Substances 0.000 description 35
- 230000005855 radiation Effects 0.000 description 26
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 11
- 238000011144 upstream manufacturing Methods 0.000 description 10
- 150000001768 cations Chemical class 0.000 description 8
- 230000002596 correlated effect Effects 0.000 description 8
- -1 nitride silicate Chemical class 0.000 description 7
- 239000000565 sealant Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000000875 corresponding effect Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000009828 non-uniform distribution Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000007567 mass-production technique Methods 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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Description
a.
i.LED光を生成するLEDと、
ii.第1の発光材料を有するキャリアであって、上記LEDと接しており、上記第1の発光材料は上記LED光の少なくとも一部を第1の発光材料光に変換する当該キャリアと
を有する、光源光を生成する光源と、
b.第2の発光材料の透過機構であって、上記光源から離れて配され、上記LED光の少なくとも一部、上記第1の発光材料光の少なくとも一部又は上記LED光の少なくとも一部及び上記第1の発光材料光の少なくとも一部を第2の発光材料光に変換する当該透過機構と
を有する照明デバイスを提供する。
LEDに関連して、キャリア及び透過機構がLEDの下流に配されている。
上記キャリアは、LEDダイと好ましくは直接接している。上記キャリアは、第1の発光材料を有する封止剤を有していてもよいが、LEDダイの上に配された発光セラミック(下記も参照されたい。)を有していてもよい。上記キャリアは、また、LEDダイの上に配された発光層を有していてもよい。発光セラミック及び発光層の両方は、封止剤により封入されることが可能であり、オプションで第1の発光材料も有し得る。上記キャリアは、キャリアにおいて生成される熱を流すために、好ましくはヒートシンクと接している。
上記透過機構と光源とのゼロではない距離は、例えば、光源が空洞部又はチャンバ(上記も参照されたい。)内に配され、透過機構が封入構造体の一部である形態により実現される。上記封入構造体は、実質的には透過機構で構成されるが、一般に、封入構造体の一部のみが該機構で構成される。封入構造体の他の部分は、プリント回路基板(PCB;プリント配線基板(PWB)として示されることもある。)である。
一形態では、上記LEDは青色の放射を発し、(a)上記第1の発光材料は、青色LED光の少なくとも一部を吸収し、緑色の放射を発する緑色発光材料を有し、(b)上記第2の発光材料は、青色LED光の少なくとも一部、緑色の放出の少なくとも一部又は青色の放出の少なくとも一部及び緑色の放出の少なくとも一部の両方を吸収し、赤色の放射を発する赤色及び/又は赤橙色発光材料を有している。このやり方では、(所定の色の)照明デバイス光は白色光である。とりわけ、LEDの出力、青色LED光のスペクトル及び発光材料の量に依存して、種々の色温度の白色光が構成され得る。
特に、光源から(すなわち、特にキャリアから)ゼロではない距離で、透過機構が配されている。
Claims (18)
- LED光を生成する発光デバイス(LED)と、第1の発光材料を有するキャリアであって、前記LEDと接しており、前記第1の発光材料が前記LED光の少なくとも一部を第1の発光材料光に変換する、発光セラミックを有する当該キャリアとを有する、光源光を生成する光源と、
第2の発光材料の透過機構であって、前記光源から離れて配され、前記第1の発光材料光の少なくとも一部、又は前記LED光の少なくとも一部及び前記第1の発光材料光の少なくとも一部を第2の発光材料光に変換する、透過性のセラミック発光材料を有する当該透過機構と
を有する、照明デバイス。 - 前記LEDが青色発光LEDを有し、前記第1の発光材料が黄緑のスペクトル範囲に主波長を持つ光を発し、前記第2の発光材料が赤橙の範囲に主波長を持つ光を発する、請求項1記載の照明デバイス。
- 前記LEDが青色発光LEDを有し、前記第1の発光材料が、三価のセリウムを含有するガーネット、二価のユーロピウムを含有する酸窒化物、二価のユーロピウムを含有するケイ酸塩及び二価のユーロピウムを含有するチオガリウム酸塩より成る群から選択される1つ又はそれ以上の発光材料、好ましくは少なくとも三価のセリウムを含有するガーネットを有し、前記第2の発光材料が、三価のセリウムを含有するアルカリ土類硫化物及び二価のユーロピウムを含有する窒化物より成る群から選択される1つ又はそれ以上の発光材料、好ましくは少なくとも二価のユーロピウムを含有する窒化物を有する、請求項1記載の照明デバイス。
- 前記第2の発光材料が、(Ca,Sr,Ba)AlSiN3:Eu、好ましくはCaAlSiN3:Euを有する、請求項1ないし3のいずれか一項に記載の照明デバイス。
- 前記第2の発光材料が、(Ca,Sr,Ba)2Si5N8:Eu、好ましくは(Sr,Ba)2Si5N8:Euを有する、請求項1ないし4のいずれか一項に記載の照明デバイス。
- 前記キャリア及び前記透過機構が、ヒートシンクと接している、請求項1ないし5のいずれか一項に記載の照明デバイス。
- 前記透過機構が射出窓にコーティングされたコーティング部を有し、このコーティング部が前記第2の発光材料を有する、請求項1ないし6のいずれか一項に記載の照明デバイス。
- 前記透過機構が、前記第2の発光材料を有する射出窓を有する、請求項1ないし7のいずれか一項に記載の照明デバイス。
- 前記射出窓が、中空形状を有し、前記光源を少なくとも部分的に囲んでいる、請求項7又は8記載の照明デバイス。
- 前記透過機構が、平らな形状を有している、請求項1ないし8のいずれか一項に記載の照明デバイス。
- 前記透過機構が、凸形の形状を有している、請求項1ないし9のいずれか一項に記載の照明デバイス。
- 前記光源光が、黒体軌跡(BBL)の15SDCM(等色標準偏差)以内のカラーポイントを持つ白色光である、請求項1ないし11のいずれか一項に記載の照明デバイス。
- 前記第2の発光材料が前記第1の発光材料光の少なくとも一部を変換する、請求項1ないし12のいずれか一項に記載の照明デバイス。
- 第1の発光材料光及び第2の発光材料光と、オプションでLED光とを有する照明デバイス光を生成し、前記光源及び前記透過機構を少なくとも部分的に囲み、前記照明デバイス光を平行にするコリメータを更に有する、請求項1ないし13のいずれか一項に記載の照明デバイス。
- 前記第1の発光材料がモノリシックセラミック発光素子である、請求項1ないし14のいずれか一項に記載の照明デバイス。
- 前記第2の発光材料がモノリシックセラミック発光素子である、請求項1ないし15のいずれか一項に記載の照明デバイス。
- 前記第1の発光材料は三価のセリウムを含有するガーネットを有し、前記第2の発光材料は、二価のユーロピウムを含有する窒化物を有する、請求項1ないし16のいずれか一項に記載の照明デバイス。
- 前記透過機構の表面積は、前記ダイの表面積よりも少なくとも10倍大きい、請求項1ないし17のいずれか一項に記載の照明デバイス。
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EP09155556.5 | 2009-03-19 | ||
EP09155556 | 2009-03-19 | ||
PCT/IB2010/051147 WO2010106504A1 (en) | 2009-03-19 | 2010-03-17 | Illumination device with remote luminescent material |
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JP2012521086A JP2012521086A (ja) | 2012-09-10 |
JP2012521086A5 JP2012521086A5 (ja) | 2013-05-02 |
JP5818778B2 true JP5818778B2 (ja) | 2015-11-18 |
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US (1) | US9349924B2 (ja) |
EP (1) | EP2412038B1 (ja) |
JP (1) | JP5818778B2 (ja) |
KR (1) | KR101798216B1 (ja) |
CN (1) | CN102356479A (ja) |
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WO (1) | WO2010106504A1 (ja) |
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2010
- 2010-03-17 CN CN2010800124663A patent/CN102356479A/zh active Pending
- 2010-03-17 CA CA2755838A patent/CA2755838C/en not_active Expired - Fee Related
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- 2010-03-17 WO PCT/IB2010/051147 patent/WO2010106504A1/en active Application Filing
- 2010-03-17 US US13/256,956 patent/US9349924B2/en not_active Expired - Fee Related
- 2010-03-17 KR KR1020117024621A patent/KR101798216B1/ko active IP Right Grant
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Publication number | Publication date |
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CN102356479A (zh) | 2012-02-15 |
CA2755838C (en) | 2018-01-02 |
EP2412038A1 (en) | 2012-02-01 |
KR101798216B1 (ko) | 2017-11-15 |
CA2755838A1 (en) | 2010-09-23 |
US9349924B2 (en) | 2016-05-24 |
JP2012521086A (ja) | 2012-09-10 |
EP2412038B1 (en) | 2019-01-02 |
WO2010106504A1 (en) | 2010-09-23 |
KR20110129968A (ko) | 2011-12-02 |
US20120007130A1 (en) | 2012-01-12 |
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