JP5814688B2 - 熱伝導性樹脂組成物およびそれを含む放熱材 - Google Patents

熱伝導性樹脂組成物およびそれを含む放熱材 Download PDF

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JP5814688B2
JP5814688B2 JP2011173873A JP2011173873A JP5814688B2 JP 5814688 B2 JP5814688 B2 JP 5814688B2 JP 2011173873 A JP2011173873 A JP 2011173873A JP 2011173873 A JP2011173873 A JP 2011173873A JP 5814688 B2 JP5814688 B2 JP 5814688B2
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resin composition
conductive resin
mass
metal powder
carbon material
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JP2012072363A (ja
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良蔵 阪本
良蔵 阪本
坂東　和彦
和彦 坂東
祐一 浅野
祐一 浅野
橋詰　良樹
良樹 橋詰
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三木ポリマー株式会社
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JP2011173873A 2010-08-31 2011-08-09 熱伝導性樹脂組成物およびそれを含む放熱材 Active JP5814688B2 (ja)

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JP2010193408 2010-08-31
JP2011173873A JP5814688B2 (ja) 2010-08-31 2011-08-09 熱伝導性樹脂組成物およびそれを含む放熱材

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JP2012072363A JP2012072363A (ja) 2012-04-12
JP5814688B2 true JP5814688B2 (ja) 2015-11-17

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WO2013021669A1 (ja) * 2011-08-09 2013-02-14 東洋アルミニウム株式会社 熱伝導性樹脂組成物およびそれを含む放熱材
JP2014065159A (ja) * 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd ウレタン発泡成形体およびその製造方法
JP6105269B2 (ja) * 2012-12-11 2017-03-29 帝人フィルムソリューション株式会社 体積抵抗率の低いフィルム
JP5798136B2 (ja) * 2013-01-25 2015-10-21 日信工業株式会社 熱可塑性樹脂組成物の製造方法及び熱可塑性樹脂組成物
JP6591141B2 (ja) * 2013-02-20 2019-10-16 旭化成株式会社 メタリック樹脂組成物、成形品及びその製造方法
JP6526939B2 (ja) * 2013-06-14 2019-06-05 スターライト工業株式会社 熱伝導性樹脂成形品
WO2016125737A1 (ja) * 2015-02-04 2016-08-11 ナミックス株式会社 熱伝導性ペースト及びその製造方法
JP2016207424A (ja) * 2015-04-21 2016-12-08 旭化成株式会社 電材ペースト用アルミニウム粉組成物
JP6527010B2 (ja) * 2015-04-27 2019-06-05 スターライト工業株式会社 熱伝導性樹脂成形体およびその製造方法
KR101799573B1 (ko) * 2016-02-19 2017-11-20 금호석유화학 주식회사 전도성 수지 조성물 및 이를 이용한 플라스틱 성형품
US20190300771A1 (en) * 2016-09-28 2019-10-03 Teijin Limited Heat dissipation sheet
WO2021081786A1 (en) * 2019-10-30 2021-05-06 The Procter & Gamble Company Molded article with metallic appearance
EP4051731A1 (en) 2019-10-30 2022-09-07 The Procter & Gamble Company Molded article with metallic appearance
WO2022226953A1 (en) * 2021-04-30 2022-11-03 The Procter & Gamble Company Molded article with metallic appearance
KR102816075B1 (ko) * 2022-09-26 2025-06-05 에이치엔에스하이텍 (주) 수직 및 수평방향 방열성이 향상된 방열시트

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JPS6268854A (ja) * 1985-09-19 1987-03-28 Toyo Alum Kk 導電性樹脂組成物
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JP5332464B2 (ja) * 2008-09-30 2013-11-06 住友ベークライト株式会社 樹脂組成物および樹脂組成物を使用して作製した半導体装置
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JP2012072364A (ja) 2012-04-12

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