JP5809445B2 - レーザ処理装置及び方法 - Google Patents

レーザ処理装置及び方法 Download PDF

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Publication number
JP5809445B2
JP5809445B2 JP2011114374A JP2011114374A JP5809445B2 JP 5809445 B2 JP5809445 B2 JP 5809445B2 JP 2011114374 A JP2011114374 A JP 2011114374A JP 2011114374 A JP2011114374 A JP 2011114374A JP 5809445 B2 JP5809445 B2 JP 5809445B2
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liquid
gas
processing
laser
containing liquid
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Japanese (ja)
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JP2012240099A (ja
JP2012240099A5 (enExample
Inventor
博隆 小山
博隆 小山
正泰 安部
正泰 安部
原　暁
暁 原
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2011114374A priority Critical patent/JP5809445B2/ja
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Publication of JP2012240099A5 publication Critical patent/JP2012240099A5/ja
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  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
JP2011114374A 2011-05-23 2011-05-23 レーザ処理装置及び方法 Expired - Fee Related JP5809445B2 (ja)

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JP2011114374A JP5809445B2 (ja) 2011-05-23 2011-05-23 レーザ処理装置及び方法

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JP2011114374A JP5809445B2 (ja) 2011-05-23 2011-05-23 レーザ処理装置及び方法

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JP2015179649A Division JP5992081B2 (ja) 2015-09-11 2015-09-11 レーザ処理装置

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JP2012240099A JP2012240099A (ja) 2012-12-10
JP2012240099A5 JP2012240099A5 (enExample) 2014-07-03
JP5809445B2 true JP5809445B2 (ja) 2015-11-10

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125261B2 (ja) * 2013-02-12 2017-05-10 三菱重工業株式会社 ウォータジェットピーニング圧縮残留応力試験方法
JP5997804B1 (ja) * 2015-06-03 2016-09-28 株式会社Ihi 表面処理装置
JP6571711B2 (ja) 2017-04-03 2019-09-04 ファナック株式会社 レーザ装置
JP7165079B2 (ja) * 2019-03-12 2022-11-02 日本タングステン株式会社 加工用クーラント供給機構、および、加工用クーラントの供給方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057184A (en) * 1990-04-06 1991-10-15 International Business Machines Corporation Laser etching of materials in liquids
JPH06333910A (ja) * 1993-05-27 1994-12-02 Nippondenso Co Ltd レーザによるエッチング方法
JPH11145108A (ja) * 1997-11-05 1999-05-28 Denso Corp 微細加工方法および微細加工装置
JP2005324238A (ja) * 2004-05-17 2005-11-24 Toyota Motor Corp レーザ加工方法および装置
JP2011088799A (ja) * 2009-10-26 2011-05-06 Mitsubishi Electric Corp 半導体装置の製造方法およびレーザー加工装置

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