JP5785496B2 - ファセットされたシリサイドコンタクトを有する半導体デバイス及び関連する製造方法 - Google Patents
ファセットされたシリサイドコンタクトを有する半導体デバイス及び関連する製造方法 Download PDFInfo
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- JP5785496B2 JP5785496B2 JP2011531097A JP2011531097A JP5785496B2 JP 5785496 B2 JP5785496 B2 JP 5785496B2 JP 2011531097 A JP2011531097 A JP 2011531097A JP 2011531097 A JP2011531097 A JP 2011531097A JP 5785496 B2 JP5785496 B2 JP 5785496B2
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- 239000004065 semiconductor Substances 0.000 title claims description 190
- 238000004519 manufacturing process Methods 0.000 title claims description 46
- 229910021332 silicide Inorganic materials 0.000 title claims description 45
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 title claims description 45
- 239000000463 material Substances 0.000 claims description 128
- 238000000034 method Methods 0.000 claims description 60
- 239000000945 filler Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 17
- 238000011065 in-situ storage Methods 0.000 claims description 8
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 5
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 5
- 230000001939 inductive effect Effects 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 description 31
- 239000012212 insulator Substances 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000007772 electrode material Substances 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 150000004767 nitrides Chemical class 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 239000003989 dielectric material Substances 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 5
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Description
Claims (9)
- 半導体デバイス(300)を製造する方法であって、
半導体材質(102)の層を有する基板(100)を提供することと、
半導体材質(102)の前記層を覆うゲート構造(112,128)を作製することと、
前記ゲート構造(112,128)に隣接する半導体材質(102)の前記層内に凹部(202)を形成して、前記半導体材質(102)の{110}面に一致する露出させられた凹部表面(204)をもたらすために、前記半導体材質(102)の一部を異方性エッチングすることと、
摂氏500〜580度の範囲内の成長温度の下で前記凹部(202)内のフィラー半導体材質(302)をエピタキシャル成長させることによって、前記凹部(202)を少なくとも部分的に充填して、前記凹部(202)内にファセット形状半導体領域(304)を形成することとを備え、
前記ファセット形状半導体領域(304)は、2つの{111}面の交差において、前記基板(100)に対して下を向き、前記露出させられた凹部表面(204)を向いているファセット領域(306)を備えている、方法。 - 前記凹部(202)を少なくとも部分的に充填することは、前記凹部内にその場でドープされる半導体材質(302)をエピタキシャル成長させることを備えている請求項1の方法。
- 前記凹部(202)を少なくとも部分的に充填した後に前記ファセット形状半導体領域(304)上にシリサイドコンタクト区域(308)を形成することを更に備えた請求項1の方法。
- 前記凹部(202)を少なくとも部分的に充填することは、応力誘起半導体材質(302)で前記凹部(202)を少なくとも部分的に充填することを備えている請求項1の方法。
- 半導体デバイス(200)であって、
半導体材質(102)の層と、
半導体材質(102)の前記層を覆うゲート構造(112,128)と、
半導体材質(102)の前記層内のチャネル領域(218)であって前記ゲート構造(112,128)の下層となるチャネル領域(218)と、
半導体材質(102)の前記層内のソース及びドレイン領域(216)であって、前記チャネル領域(218)がそれらの間に配置され、ファセット形状半導体領域(206,306)を備えたソース及びドレイン領域(216)と、
前記ソース及びドレイン領域(216)を覆うファセット形状シリサイドコンタクト区域(210,308,406)と、
前記ゲート構造(112,128)に隣接する前記半導体材質(102)の前記層に形成された凹部(202)であって、前記半導体材質(102)の{110}面に一致する凹部表面(204)を有する凹部(202)内に配置されたファセット形状半導体領域(206,306)であって、表面に前記ファセット形状シリサイドコンタクト区域(210,308)が形成されているファセット形状半導体領域(206,306)と、を備え、
前記半導体デバイス(200)はPMOSトランジスタデバイスであって、
前記半導体材質(102)の前記層はシリコンゲルマニウムであって、
前記ファセット形状半導体領域は前記シリコンゲルマニウムの2つの{111}面の交差によって部分的に画定されており、
前記ファセット形状半導体領域(206,306)が、2つの{111}面の交差において、前記基板(100)に対して下を向き、前記凹部表面(204)を向いている下向きファセット領域(306)か、2つの{111}面の交差に頂を有し、前記基板(100)に対して上を向き、前記凹部表面(204)の逆を向いている上向きファセット領域(206)のいずれかを備えている、半導体デバイス(200,300,400)。 - 半導体デバイス(200)を製造する方法であって、
半導体材質(102)の層を有する基板(100)を提供することと、
前記半導体材質(102)の前記層を覆うゲート構造(112,128)を作製することと、
前記ゲート構造(112,128)に隣接する半導体材質(102)の前記層内に凹部(202)を形成して、前記半導体材質(102)の{110}面に一致する露出させられた凹部表面(204)をもたらすために、前記半導体材質(102)の一部を異方性エッチングすることと、
摂氏600〜650度の範囲内の成長温度の下で前記凹部(202)内のフィラー半導体材質(205)をエピタキシャル成長させることによって、前記凹部(202)を少なくとも部分的に充填して、前記凹部(202)内にファセット形状半導体領域(206)を形成することとを備え、
前記ファセット形状半導体領域(206)は、2つの{111}面の交差に頂を有し、前記基板(100)に対して上を向き、前記露出させられた凹部表面(204)の逆を向いている上向きファセット領域(208)を備えている、方法。 - 前記凹部(202)を少なくとも部分的に充填することは、前記凹部内にその場でドープされる半導体材質(302)をエピタキシャル成長させることを備えている請求項6の方法。
- 前記凹部(202)を少なくとも部分的に充填した後に前記ファセット形状半導体領域(206)上にシリサイドコンタクト区域(210,308)を形成することを更に備えた請求項6の方法。
- 前記凹部(202)を少なくとも部分的に充填することは、応力誘起半導体材質(205)で前記凹部(202)を少なくとも部分的に充填することを備えている請求項6の方法。
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