JP5769622B2 - 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 Download PDF

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Publication number
JP5769622B2
JP5769622B2 JP2011518614A JP2011518614A JP5769622B2 JP 5769622 B2 JP5769622 B2 JP 5769622B2 JP 2011518614 A JP2011518614 A JP 2011518614A JP 2011518614 A JP2011518614 A JP 2011518614A JP 5769622 B2 JP5769622 B2 JP 5769622B2
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optical semiconductor
mol
curable organopolysiloxane
semiconductor element
organopolysiloxane composition
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Japanese (ja)
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JP2012507582A (ja
JP2012507582A5 (https=
Inventor
吉武　誠
誠 吉武
貴志 佐川
貴志 佐川
匡慶 寺田
匡慶 寺田
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2011518614A 2008-10-31 2009-10-30 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 Active JP5769622B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011518614A JP5769622B2 (ja) 2008-10-31 2009-10-30 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008281243 2008-10-31
JP2008281243 2008-10-31
JP2011518614A JP5769622B2 (ja) 2008-10-31 2009-10-30 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
PCT/JP2009/069014 WO2010050625A1 (en) 2008-10-31 2009-10-30 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

Publications (3)

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JP2012507582A JP2012507582A (ja) 2012-03-29
JP2012507582A5 JP2012507582A5 (https=) 2012-11-08
JP5769622B2 true JP5769622B2 (ja) 2015-08-26

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Country Status (8)

Country Link
US (1) US8946353B2 (https=)
EP (1) EP2352794A1 (https=)
JP (1) JP5769622B2 (https=)
KR (1) KR101632593B1 (https=)
CN (1) CN102197092A (https=)
MY (1) MY156374A (https=)
TW (1) TWI480337B (https=)
WO (1) WO2010050625A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
US9379296B2 (en) * 2010-01-25 2016-06-28 Lg Chem, Ltd. Silicone resin
KR20110115846A (ko) * 2010-04-16 2011-10-24 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조 방법
WO2011162294A1 (ja) * 2010-06-24 2011-12-29 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
EP2599836B1 (en) * 2010-07-27 2015-03-25 Adeka Corporation Curable composition for semiconductor encapsulation
JP2012222202A (ja) * 2011-04-11 2012-11-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
WO2013077700A1 (ko) 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
KR101334349B1 (ko) * 2011-12-15 2013-11-29 한국과학기술연구원 가열 경화성 실록산 봉지재 조성물
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
GB201212782D0 (en) * 2012-07-18 2012-08-29 Dow Corning Organosiloxane compositions
JP5819787B2 (ja) * 2012-07-19 2015-11-24 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6066385B2 (ja) * 2012-07-27 2017-01-25 エルジー・ケム・リミテッド 硬化性組成物
JP2015528046A (ja) * 2012-07-27 2015-09-24 エルジー・ケム・リミテッド 硬化性組成物
WO2014062843A1 (en) * 2012-10-16 2014-04-24 Brewer Science Inc. Silicone polymers with high refractive indices and extended pot life
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6084808B2 (ja) * 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6168754B2 (ja) * 2012-11-16 2017-07-26 アイカ工業株式会社 付加型シリコーン樹脂組成物および光半導体装置用封止剤
JP6212122B2 (ja) * 2012-12-28 2017-10-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6105966B2 (ja) * 2013-02-15 2017-03-29 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CN105102540B (zh) * 2013-04-04 2017-09-05 株式会社Lg化学 可固化组合物
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
KR20140140836A (ko) * 2013-05-30 2014-12-10 엘지이노텍 주식회사 발광소자 패키지
JP2015113348A (ja) * 2013-12-06 2015-06-22 信越化学工業株式会社 硬化性組成物および光半導体装置
WO2015098072A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, member for transducers
WO2015136820A1 (ja) 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
EP3153517A4 (en) * 2014-06-04 2017-12-20 Dow Corning Toray Co., Ltd. Organosiloxane, curable silicone composition, and semiconductor device
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
CN105694047B (zh) * 2016-04-26 2018-09-25 烟台德邦先进硅材料有限公司 主链含环状结构改性有机硅聚合物及其制备方法
US9893250B1 (en) * 2016-12-16 2018-02-13 Nichia Corporation Light emitting device having silicone resin-based sealing member
AU2017385760B2 (en) * 2016-12-27 2020-05-07 Momentive Performance Materials Korea Co., Ltd Encapsulation composition for organic electronic device, and encapsulation formed using same
JP6764390B2 (ja) * 2017-11-02 2020-09-30 信越化学工業株式会社 ダイボンディング用シリコーン組成物、その硬化物、及び発光ダイオード素子
DE102019134728A1 (de) * 2019-12-17 2021-06-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optische komponente, optoelektronisches halbleiterbauteil und verfahren zur herstellung einer optischen komponente
JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR102467690B1 (ko) * 2020-08-19 2022-11-17 주식회사 케이씨씨실리콘 광학용 폴리실록산 조성물 및 이를 포함하는 광학 반도체용 반사 재료
WO2022191186A1 (ja) 2021-03-08 2022-09-15 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
JP2024138210A (ja) 2023-03-08 2024-10-08 デュポン スペシャルティ マテリアルズ コリア リミテッド 高チキソ性硬化性シリコーン組成物及びその硬化物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661210A (en) * 1996-09-25 1997-08-26 Dow Corning Corporation Optically clear liquid silicone rubber
JP4040858B2 (ja) 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
TW200427111A (en) 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2006063092A (ja) 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
US7314770B2 (en) * 2004-11-18 2008-01-01 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP4872296B2 (ja) 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
US8258502B2 (en) 2006-02-24 2012-09-04 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

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Publication number Publication date
TW201033288A (en) 2010-09-16
JP2012507582A (ja) 2012-03-29
KR101632593B1 (ko) 2016-06-22
US8946353B2 (en) 2015-02-03
CN102197092A (zh) 2011-09-21
MY156374A (en) 2016-02-15
TWI480337B (zh) 2015-04-11
WO2010050625A1 (en) 2010-05-06
US20110254047A1 (en) 2011-10-20
KR20110089164A (ko) 2011-08-04
EP2352794A1 (en) 2011-08-10

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