TWI480337B - 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置 - Google Patents

可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置 Download PDF

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Publication number
TWI480337B
TWI480337B TW098137056A TW98137056A TWI480337B TW I480337 B TWI480337 B TW I480337B TW 098137056 A TW098137056 A TW 098137056A TW 98137056 A TW98137056 A TW 98137056A TW I480337 B TWI480337 B TW I480337B
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Taiwan
Prior art keywords
optical semiconductor
component
group
optical
unit
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TW098137056A
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English (en)
Chinese (zh)
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TW201033288A (en
Inventor
吉武誠
佐川貴志
寺田匡慶
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道康寧東麗股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW098137056A 2008-10-31 2009-10-30 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置 TWI480337B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008281243 2008-10-31

Publications (2)

Publication Number Publication Date
TW201033288A TW201033288A (en) 2010-09-16
TWI480337B true TWI480337B (zh) 2015-04-11

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Family Applications (1)

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TW098137056A TWI480337B (zh) 2008-10-31 2009-10-30 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置

Country Status (8)

Country Link
US (1) US8946353B2 (https=)
EP (1) EP2352794A1 (https=)
JP (1) JP5769622B2 (https=)
KR (1) KR101632593B1 (https=)
CN (1) CN102197092A (https=)
MY (1) MY156374A (https=)
TW (1) TWI480337B (https=)
WO (1) WO2010050625A1 (https=)

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JP6105966B2 (ja) * 2013-02-15 2017-03-29 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
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CN105102540B (zh) * 2013-04-04 2017-09-05 株式会社Lg化学 可固化组合物
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
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KR20140140836A (ko) * 2013-05-30 2014-12-10 엘지이노텍 주식회사 발광소자 패키지
JP2015113348A (ja) * 2013-12-06 2015-06-22 信越化学工業株式会社 硬化性組成物および光半導体装置
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JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
CN105694047B (zh) * 2016-04-26 2018-09-25 烟台德邦先进硅材料有限公司 主链含环状结构改性有机硅聚合物及其制备方法
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JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR102467690B1 (ko) * 2020-08-19 2022-11-17 주식회사 케이씨씨실리콘 광학용 폴리실록산 조성물 및 이를 포함하는 광학 반도체용 반사 재료
WO2022191186A1 (ja) 2021-03-08 2022-09-15 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
JP2024138210A (ja) 2023-03-08 2024-10-08 デュポン スペシャルティ マテリアルズ コリア リミテッド 高チキソ性硬化性シリコーン組成物及びその硬化物

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Also Published As

Publication number Publication date
TW201033288A (en) 2010-09-16
JP2012507582A (ja) 2012-03-29
KR101632593B1 (ko) 2016-06-22
US8946353B2 (en) 2015-02-03
CN102197092A (zh) 2011-09-21
MY156374A (en) 2016-02-15
WO2010050625A1 (en) 2010-05-06
US20110254047A1 (en) 2011-10-20
JP5769622B2 (ja) 2015-08-26
KR20110089164A (ko) 2011-08-04
EP2352794A1 (en) 2011-08-10

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