CN102197092A - 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件 - Google Patents

可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件 Download PDF

Info

Publication number
CN102197092A
CN102197092A CN2009801428343A CN200980142834A CN102197092A CN 102197092 A CN102197092 A CN 102197092A CN 2009801428343 A CN2009801428343 A CN 2009801428343A CN 200980142834 A CN200980142834 A CN 200980142834A CN 102197092 A CN102197092 A CN 102197092A
Authority
CN
China
Prior art keywords
phenyl
optical semiconductor
component
semiconductor element
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801428343A
Other languages
English (en)
Chinese (zh)
Inventor
吉武诚
佐川贵志
寺田匡庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN102197092A publication Critical patent/CN102197092A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
CN2009801428343A 2008-10-31 2009-10-30 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件 Pending CN102197092A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008281243 2008-10-31
JP2008-281243 2008-10-31
PCT/JP2009/069014 WO2010050625A1 (en) 2008-10-31 2009-10-30 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

Publications (1)

Publication Number Publication Date
CN102197092A true CN102197092A (zh) 2011-09-21

Family

ID=41503594

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801428343A Pending CN102197092A (zh) 2008-10-31 2009-10-30 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件

Country Status (8)

Country Link
US (1) US8946353B2 (https=)
EP (1) EP2352794A1 (https=)
JP (1) JP5769622B2 (https=)
KR (1) KR101632593B1 (https=)
CN (1) CN102197092A (https=)
MY (1) MY156374A (https=)
TW (1) TWI480337B (https=)
WO (1) WO2010050625A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103232707A (zh) * 2013-04-19 2013-08-07 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CN105073897A (zh) * 2013-02-15 2015-11-18 道康宁东丽株式会社 可固化有机硅组合物、其固化产物及光学半导体器件
CN105102540A (zh) * 2013-04-04 2015-11-25 株式会社Lg化学 可固化组合物
CN105694047A (zh) * 2016-04-26 2016-06-22 烟台德邦先进硅材料有限公司 主链含环状结构改性有机硅聚合物及其制备方法
US9598542B2 (en) 2011-11-25 2017-03-21 Lg Chem, Ltd. Curable composition
CN110235262A (zh) * 2016-12-27 2019-09-13 莫门蒂夫性能材料韩国株式会社 用于有机电子器件密封剂的组合物以及采用该组合物形成的密封剂
CN114788024A (zh) * 2019-12-17 2022-07-22 奥斯兰姆奥普托半导体有限责任公司 光学组件、光电子半导体器件和制造光学组件的方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
US9379296B2 (en) * 2010-01-25 2016-06-28 Lg Chem, Ltd. Silicone resin
KR20110115846A (ko) * 2010-04-16 2011-10-24 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조 방법
WO2011162294A1 (ja) * 2010-06-24 2011-12-29 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
EP2599836B1 (en) * 2010-07-27 2015-03-25 Adeka Corporation Curable composition for semiconductor encapsulation
JP2012222202A (ja) * 2011-04-11 2012-11-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
KR101334349B1 (ko) * 2011-12-15 2013-11-29 한국과학기술연구원 가열 경화성 실록산 봉지재 조성물
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
GB201212782D0 (en) * 2012-07-18 2012-08-29 Dow Corning Organosiloxane compositions
JP5819787B2 (ja) * 2012-07-19 2015-11-24 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6066385B2 (ja) * 2012-07-27 2017-01-25 エルジー・ケム・リミテッド 硬化性組成物
JP2015528046A (ja) * 2012-07-27 2015-09-24 エルジー・ケム・リミテッド 硬化性組成物
WO2014062843A1 (en) * 2012-10-16 2014-04-24 Brewer Science Inc. Silicone polymers with high refractive indices and extended pot life
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6084808B2 (ja) * 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6168754B2 (ja) * 2012-11-16 2017-07-26 アイカ工業株式会社 付加型シリコーン樹脂組成物および光半導体装置用封止剤
JP6212122B2 (ja) * 2012-12-28 2017-10-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
KR20140140836A (ko) * 2013-05-30 2014-12-10 엘지이노텍 주식회사 발광소자 패키지
JP2015113348A (ja) * 2013-12-06 2015-06-22 信越化学工業株式会社 硬化性組成物および光半導体装置
WO2015098072A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, member for transducers
WO2015136820A1 (ja) 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
EP3153517A4 (en) * 2014-06-04 2017-12-20 Dow Corning Toray Co., Ltd. Organosiloxane, curable silicone composition, and semiconductor device
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
US9893250B1 (en) * 2016-12-16 2018-02-13 Nichia Corporation Light emitting device having silicone resin-based sealing member
JP6764390B2 (ja) * 2017-11-02 2020-09-30 信越化学工業株式会社 ダイボンディング用シリコーン組成物、その硬化物、及び発光ダイオード素子
JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR102467690B1 (ko) * 2020-08-19 2022-11-17 주식회사 케이씨씨실리콘 광학용 폴리실록산 조성물 및 이를 포함하는 광학 반도체용 반사 재료
WO2022191186A1 (ja) 2021-03-08 2022-09-15 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
JP2024138210A (ja) 2023-03-08 2024-10-08 デュポン スペシャルティ マテリアルズ コリア リミテッド 高チキソ性硬化性シリコーン組成物及びその硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661210A (en) * 1996-09-25 1997-08-26 Dow Corning Corporation Optically clear liquid silicone rubber
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP2006093354A (ja) * 2004-09-22 2006-04-06 Dow Corning Toray Co Ltd 光半導体装置の製造方法および光半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4040858B2 (ja) 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
TW200427111A (en) 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7314770B2 (en) * 2004-11-18 2008-01-01 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP4872296B2 (ja) 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
US8258502B2 (en) 2006-02-24 2012-09-04 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661210A (en) * 1996-09-25 1997-08-26 Dow Corning Corporation Optically clear liquid silicone rubber
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP2006093354A (ja) * 2004-09-22 2006-04-06 Dow Corning Toray Co Ltd 光半導体装置の製造方法および光半導体装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9598542B2 (en) 2011-11-25 2017-03-21 Lg Chem, Ltd. Curable composition
CN105073897A (zh) * 2013-02-15 2015-11-18 道康宁东丽株式会社 可固化有机硅组合物、其固化产物及光学半导体器件
CN105073897B (zh) * 2013-02-15 2018-05-01 道康宁东丽株式会社 可固化有机硅组合物、其固化产物及光学半导体器件
US9688820B2 (en) 2013-04-04 2017-06-27 Lg Chem, Ltd. Curable composition
CN105102540A (zh) * 2013-04-04 2015-11-25 株式会社Lg化学 可固化组合物
CN105102540B (zh) * 2013-04-04 2017-09-05 株式会社Lg化学 可固化组合物
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CN103232707A (zh) * 2013-04-19 2013-08-07 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CN105694047A (zh) * 2016-04-26 2016-06-22 烟台德邦先进硅材料有限公司 主链含环状结构改性有机硅聚合物及其制备方法
CN105694047B (zh) * 2016-04-26 2018-09-25 烟台德邦先进硅材料有限公司 主链含环状结构改性有机硅聚合物及其制备方法
CN110235262A (zh) * 2016-12-27 2019-09-13 莫门蒂夫性能材料韩国株式会社 用于有机电子器件密封剂的组合物以及采用该组合物形成的密封剂
CN110235262B (zh) * 2016-12-27 2023-07-18 莫门蒂夫性能材料韩国株式会社 用于有机电子器件密封剂的组合物以及采用该组合物形成的密封剂
CN114788024A (zh) * 2019-12-17 2022-07-22 奥斯兰姆奥普托半导体有限责任公司 光学组件、光电子半导体器件和制造光学组件的方法

Also Published As

Publication number Publication date
TW201033288A (en) 2010-09-16
JP2012507582A (ja) 2012-03-29
KR101632593B1 (ko) 2016-06-22
US8946353B2 (en) 2015-02-03
MY156374A (en) 2016-02-15
TWI480337B (zh) 2015-04-11
WO2010050625A1 (en) 2010-05-06
US20110254047A1 (en) 2011-10-20
JP5769622B2 (ja) 2015-08-26
KR20110089164A (ko) 2011-08-04
EP2352794A1 (en) 2011-08-10

Similar Documents

Publication Publication Date Title
CN102197092A (zh) 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件
JP5469874B2 (ja) 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
CN100378172C (zh) 可固化的有机聚硅氧烷组合物和半导体器件
CN102066492B (zh) 可固化的有机基聚硅氧烷组合物和半导体器件
EP2326686B1 (en) Curable organopolysiloxane composition and semiconductor device
EP2032653B1 (en) Curable organopolysiloxane composition and semiconductor device
TWI661007B (zh) 硬化性聚矽氧組合物、硬化性熱熔聚矽氧，及光裝置
EP2128201A1 (en) Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
KR101705036B1 (ko) 부가 경화형 실리콘 조성물, 광학소자 봉지재 및 광학소자
CN113214651A (zh) 可固化有机硅组合物、其固化产物以及光学半导体器件
EP3587498B1 (en) Curable organopolysiloxane composition and semiconductor device
CN106009687B (zh) 有机硅材料、可固化有机硅组合物和光学器件
CN103571209A (zh) 加成固化型硅酮组合物、及半导体装置
CN110862802B (zh) 加成固化型有机硅组合物及半导体装置
JP7222569B2 (ja) 硬化性シリコーン組成物及び光半導体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20110921