JP5769622B2 - Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device - Google Patents

Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device Download PDF

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JP5769622B2
JP5769622B2 JP2011518614A JP2011518614A JP5769622B2 JP 5769622 B2 JP5769622 B2 JP 5769622B2 JP 2011518614 A JP2011518614 A JP 2011518614A JP 2011518614 A JP2011518614 A JP 2011518614A JP 5769622 B2 JP5769622 B2 JP 5769622B2
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optical semiconductor
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curable organopolysiloxane
semiconductor element
organopolysiloxane composition
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JP2012507582A (en
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吉武 誠
誠 吉武
貴志 佐川
貴志 佐川
匡慶 寺田
匡慶 寺田
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東レ・ダウコーニング株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

Description

The present invention relates to a hydrosilylation reaction-curable organopolysiloxane composition, an optical semiconductor element encapsulant comprising the composition, particularly an encapsulant, and an optical semiconductor element comprising an optical semiconductor element encapsulant, particularly an encapsulant. The present invention relates to an optical semiconductor device which is sealed, particularly encapsulated with a capsrant.

A curable organopolysiloxane composition that cures by a hydrosilylation reaction is used as a sealing agent (including a protective coating agent) for an optical semiconductor element in an optical semiconductor device such as a photocoupler, a light-emitting diode device, or a solid-state imaging device. Yes. Such an optical semiconductor element sealant (including a protective coating agent) must not absorb or scatter light because the optical semiconductor element emits light or receives light.

For this reason, Patent Documents 1 to 5 propose hydrosilylation reaction-curable organopolysiloxane compositions that form a cured product having a high refractive index and light transmittance by using an organopolysiloxane having a high phenyl group content. Yes.

However, these curable organopolysiloxane compositions do not necessarily have a high light transmittance of the cured product, or have poor adhesion durability to semiconductor elements, lead frames, and packages that are in contact with the curing process, and are easily peeled off. The present inventors have found that there is a problem, and there is a problem that when the cured product is in a high temperature state for a long time, the light transmittance is lowered due to yellowing. In addition, a semiconductor device having a semiconductor element coated or sealed with these curable organopolysiloxane compositions or an optical semiconductor device having an optical semiconductor element has poor adhesion durability and is not sufficiently reliable. The present inventors have found that there is a point.

A curable organopolysiloxane composition that solves the problem of lowering the durability of adhesion is disclosed in Patent Document 6. However, since it contains a radical copolymer-based adhesion promoter as an essential component, it is coated or sealed with the cured product. The present inventors have found that there is a problem that when the stopped optical semiconductor element is used at a high temperature for a long time, the cured product is yellowed and the light transmittance is lowered.

JP 2003-128922 A JP 2004-292807 A JP 2005-105217 A JP 2007-103494 A JP 2008-1828 A JP 2006-063092 A

The present invention provides a curable organopolysiloxane composition that forms a cured product having high refractive index, light transmittance, and discoloration resistance;
Providing an optical semiconductor element encapsulant that forms a cured product having a high refractive index, light transmittance, and resistance to discoloration;
An object of the present invention is to provide an optical semiconductor device in which an optical semiconductor element, a lead frame, a package, and the like are sealed with a cured product of an optical semiconductor element sealing agent having high refractive index, light transmittance, and discoloration resistance, and excellent in reliability. And
Furthermore, it has a high refractive index and light transmittance, and has a high adhesion durability to various substrates such as semiconductor elements, lead frames, and packages that have been in contact with the curing process, and forms a cured product having a high color fastness. Providing a polysiloxane composition;
Provided an optical semiconductor element encapsulant that forms a cured product with high refractive index and light transmittance, high adhesion durability to optical semiconductor elements, lead frames, packages, etc. that were in contact during curing, and high discoloration resistance To do;
A highly reliable optical semiconductor device sealed with a cured product of an optical semiconductor element sealant that has high adhesion durability to optical semiconductor elements, lead frames, packages, etc., and has high refractive index, light transmittance, and discoloration resistance. The purpose is to provide.

The above purpose is
“[1] (A) The diphenylsiloxane unit is 5 mol% or less of the total siloxane unit, at least 20 mol% of all silicon atom-bonded organic groups in the molecule are phenyl groups, and at least 2 silicon atoms per molecule Methylphenylalkenyl polysiloxane having an atom-bonded alkenyl group, (B) the diphenylsiloxane unit is 5 mol% or less of the total siloxane units, and at least 20 mol% of all silicon atom-bonded organic groups in the molecule are phenyl groups; It comprises methylphenyl hydrogen polysiloxane having at least two silicon-bonded hydrogen atoms per molecule and (C) hydrosilylation reaction catalyst, and the diphenylsiloxane unit in the composition is 5 mol% or less of the total siloxane units. Hydrosilylation reaction-curable organopolysiloxane composition characterized in that
[2] The component (A) is an average unit formula (1): R a SiO (4-a) / 2 (wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group and a phenyl group, and At least 20 mol% is a phenyl group, and a is a positive number of 0.5 to 2.2), and the component (B) is an average unit formula (5): R 1 b H c SiO (4-bc) / 2 (wherein R 1 is a methyl group and a phenyl group, at least 20 mol% of them is a phenyl group, b is a positive number from 1.0 to 2.2, and c is a positive number from 0.002 to 1.0) .) The hydrosilylation reaction-curable organopolysiloxane composition according to [1], wherein
[3] Component (A) is (A1) average unit formula (2): R d SiO (4-d) / 2 (wherein R is an alkenyl group having 2 to 8 carbon atoms, methyl group and phenyl group) And at least 20 mol% of them are phenyl groups, d is a positive number from 1.9 to 2.2), and diphenylsiloxane units are 5 mol% or less of the total siloxane units, and at least per molecule. A methylphenylalkenylpolysiloxane having two silicon atom-bonded alkenyl groups and having a viscosity at 25 ° C. of 10 to 100,000 mPa · s and liquid at room temperature, and (A2) average unit formula (3): R e SiO (4-e) / 2 (wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group and a phenyl group, at least 20 mol% of which is a phenyl group, and e is 0.5 to 1.7) And a mole percent of total siloxane units, at least two silicon atoms. Mixture with organopolysiloxane resin having a mixed alkenyl group and solid at room temperature {in the mixture, (A1) component is 99-30% by weight, (A2) component is 1-70% by weight, total It is 100% by weight}. The hydrosilylation reaction-curable organopolysiloxane composition according to [2].
[4] The hydrosilylation reaction-curable organopolysiloxane composition according to [1] or [2], wherein both the component (A) and the component (B) do not have a diphenylsiloxane unit.
[5] The hydrosilylation reaction-curable organopolysiloxane composition according to [3], wherein the (A1) component, the (A2) component, and the (B) component do not have a diphenylsiloxane unit.
[6] In a quartz cell, a cured product having a light transmittance of at least 90% at an optical path length of 0.2 cm and a wavelength of 450 nm and a refractive index (25 ° C.) of visible light (589 nm) of at least 1.5 is formed. The hydrosilylation reaction-curable organopolysiloxane composition according to [1], [2] or [4], wherein
[7] In a quartz cell, the light transmittance at a wavelength of 450 nm at an optical path length of 0.2 cm is at least 90%, and the refractive index (25 ° C.) at visible light (589 nm) is at least 1.5 to form a cured product. The hydrosilylation reaction-curable organopolysiloxane composition according to [3] or [5], wherein
[8] The cured product is held in a hot air circulation oven at 150 ° C. for 1000 hours, and then has a light transmittance (25 ° C.) at a wavelength of 450 nm at an optical path length of 0.2 cm at least 98%, The hydrosilylation reaction-curable organopolysiloxane composition according to [6] or [7]. Is achieved.

Moreover,
[9] An optical semiconductor element encapsulant comprising the hydrosilylation reaction-curable organopolysiloxane composition according to [6].
[10] An optical semiconductor element encapsulant comprising the hydrosilylation reaction-curable organopolysiloxane composition according to [7].
[11] The optical semiconductor element sealant forms a cured product having a light transmittance (25 ° C.) of at least 99% at a wavelength of 450 nm with an optical path length of 0.2 cm, and the cured product is heated to a 150 ° C. hot air circulation type. The optical semiconductor according to [9] or [10], wherein after being held in an oven for 1000 hours, the light transmittance (25 ° C.) at a wavelength of 450 nm with an optical path length of 0.2 cm is at least 98% Device sealant. Is achieved.

Further, “[12] The optical semiconductor element sealing agent according to [9], [10] or [11] is sealed in the optical semiconductor device having the optical semiconductor element in the casing and cured. The light-emitting semiconductor element is sealed with a light-transmitting cured product of the optical semiconductor element sealing agent.
[13] The optical semiconductor device according to [12], wherein the optical semiconductor element is a light-emitting diode element, and the optical semiconductor device is a light-emitting diode device.
[14] The optical semiconductor device according to [12] or [13], wherein the casing is made of a plastic having a polar group.
[15] The optical semiconductor device according to [14], wherein the plastic having a polar group is a polyphthalamide resin. Is achieved.

Furthermore, [[16] 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetra The hydrosilylation reaction-curable organopolysiloxane composition according to any one of [1] to [5], wherein the total content of siloxane is 5% by weight or less.
[17] Total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane The optical semiconductor element sealing agent according to [9], [10] or [11], wherein the amount is 5% by weight or less.
[18] The optical semiconductor element sealing agent according to [17] is sealed and cured in the optical semiconductor device including the optical semiconductor element in the casing, and the light emitting semiconductor element is the optical semiconductor. An optical semiconductor device which is sealed with a light-transmitting cured product of an element sealing agent.
Is achieved.

The curable organopolysiloxane composition according to claims 1 to 8 of the present invention forms a cured product having high refractive index, light transmittance, and discoloration resistance.
The optical semiconductor element sealing agent according to claims 9 to 11 of the present invention forms a cured product having a high refractive index, light transmittance, and high color fastness.
In the optical semiconductor device according to the twelfth to fifteenth aspects of the present invention, since the optical semiconductor element and the like are sealed with the cured product of the optical semiconductor element sealing agent, the refractive index, the light transmittance, and the discoloration resistance. High reliability.

The curable organopolysiloxane composition according to claim 16 of the present invention has a high refractive index and a high light transmittance, and has a high adhesion durability to various substrates such as a semiconductor element, a lead frame, and a package that have been in contact during curing. Forms a cured product with high resistance to discoloration.
The optical semiconductor element sealing agent according to claim 17 of the present invention, particularly the encapsulant, has a high refractive index and light transmittance, and was in contact with the sealing agent, particularly the encapsulant during curing. A cured product having high adhesion durability to optical semiconductor elements, lead frames, packages, and the like and high discoloration resistance is formed.
In the optical semiconductor device according to claim 18 of the present invention, an optical semiconductor element or the like is sealed, in particular, encapsulated by the optical semiconductor element sealing agent, particularly a hardened encapsulant, so that the refractive index is High light transmittance, adhesion durability and discoloration resistance, and excellent reliability.

FIG. 1 is a cross-sectional view of a surface-mounted light emitting diode (LED) device A that is a representative example of the optical semiconductor device of the present invention.

First, the curable organopolysiloxane composition and the optical semiconductor element sealant of the present invention, particularly the encapsulant, will be described in detail.
In the curable organopolysiloxane composition of the present invention, (A) the diphenylsiloxane unit is 5 mol% or less of the total siloxane units, and at least 20 mol% of all silicon-bonded organic groups in the molecule are phenyl groups, Methylphenylalkenyl polysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, (B) diphenylsiloxane units being 5 mol% or less of the total siloxane units, and at least 20 of all silicon atom-bonded organic groups in the molecule Mole% is a phenyl group, and consists of methylphenyl hydrogen polysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule and (C) hydrosilylation reaction catalyst.

In the hydrosilylation reaction-curable organopolysiloxane composition and the optical semiconductor element sealing agent of the present invention, the alkenyl group bonded to the silicon atom in the component (A) and the hydrogen atom bonded to the silicon atom in the component (B) It cures by hydrosilylation reaction by the catalytic action of component (C). The component (A), methylphenylalkenyl polysiloxane, has at least two silicon-bonded alkenyl groups per molecule, diphenylsiloxane units are 5 mol% or less of the total siloxane units, and phenyl groups are present in the molecule. And at least 20 mol% of all the silicon-bonded organic groups.

Examples of silicon atom-bonded alkenyl groups having 2 to 8 carbon atoms in component (A) include vinyl, allyl, butenyl, pentenyl, and hexenyl groups. A vinyl group is preferred from the viewpoint of chemical reactivity.
Since the component (A) is cured by a hydrosilylation reaction with the component (B), it is necessary that at least two silicon atom-bonded alkenyl groups having 2 to 8 carbon atoms exist in one molecule. When the molecular structure of the component (A) is a straight chain, the silicon-bonded alkenyl group having 2 to 8 carbon atoms is present only at both ends, at both ends and side chains, or only at side chains. When the molecular structure of component (A) is branched, a silicon atom-bonded alkenyl group having 2 to 8 carbon atoms is present only at the terminal, at both terminals and both side chains, only at the side chain, or at the branching point. To do. One alkenyl group having 2 to 8 carbon atoms is usually bonded to the same silicon atom, but may be bonded to two or three.

The silicon atom-bonded phenyl group in the component (A) has a small attenuation due to light refraction, reflection, scattering, etc. in the cured product produced by the hydrosilylation reaction between the component (A) and the component (B). The content of silicon atom-bonded phenyl groups in the silicon atom-bonded all organic groups of component (A) is at least 20 mol%, preferably at least 30 mol%, more preferably at least 40 mol%. However, if the phenyl group content is too high, the transparency is lowered due to the turbidity of the composition, so 80 mol% or less is preferable.

The silicon atom-bonded phenyl group in component (A) can exist in the form of diphenylsiloxane units, but in the cured product produced by the hydrosilylation reaction between component (A) and component (B), light transmission is achieved. Since the ratio and discoloration resistance are high, the diphenylsiloxane unit in the composition needs to be 5 mol% or less of the total siloxane units.
Therefore, the content of the diphenylsiloxane unit in the total siloxane unit in the component (A) needs to satisfy that, and the content of the diphenylsiloxane unit in the total siloxane unit in the component (A) is 5 mol% or less. Preferably, it is 3 mol% or less, more preferably none.

When the molecular structure of the component (A) is linear, the silicon atom-bonded phenyl group is present only at both ends, at both ends and side chains, or only at side chains. When the molecular structure of the component (A) is branched, the silicon atom-bonded phenyl group is present only at the terminal, at both terminals and both side chains, only at the side chain, or at the branch point. One phenyl group is usually bonded to the same silicon atom.

Examples of the molecular structure of component (A) include linear, branched, and cyclic structures, and combinations thereof. The branched shape is not limited to a pure branched shape, and may be any of a branched straight chain shape, a net shape, a cage shape, and a three-dimensional shape. Component (A) may be a mixture of a plurality of organopolysiloxanes having the above structure.

The component (A) is preferably liquid at room temperature, particularly 25 ° C. in terms of the workability of molding of the curable organopolysiloxane composition of the present invention and the optical semiconductor element sealant, although the viscosity is not limited, It is preferably within a range of 10 to 1,000,000 mPa · s at 25 ° C., and more preferably within a range of 100 to 50,000 mPa · s. This is because if the viscosity of the component (A) is less than the lower limit of the above range, the mechanical strength of the resulting cured product tends to decrease, whereas if it exceeds the upper limit of the above range, the resulting composition This is because the handling operability of the object tends to decrease.

Such component (A) has an average unit formula (1): R a SiO (4-a) / 2 (wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group and a phenyl group, At least 20 mol% of them are phenyl groups, and a is a positive number of 0.5 to 2.2. Examples of the alkenyl group having 2 to 8 carbon atoms as R include a vinyl group, an allyl group, a butenyl group, a pentenyl group, and a hexenyl group. However, in terms of ease of production of the component (A) and hydrosilylation reactivity, A vinyl group is preferred .

In view of the curability of the curable organopolysiloxane composition and the optical semiconductor element sealant of the present invention and the properties of the cured product, the component (A) is represented by (A1) average unit formula (2): R d SiO (4- d) / 2 (2)
Wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group and a phenyl group, at least 20 mol% of which is a phenyl group, and d is a positive number from 1.9 to 2.2. The diphenylsiloxane unit is 5 mol% or less of the total siloxane unit, has at least 2 silicon atom-bonded alkenyl groups having 2 to 8 carbon atoms per molecule, and has a viscosity at 25 ° C. of 10 to 100, Methylphenylalkenylpolysiloxane liquid at room temperature of 000 mPa · s and (A2) average unit formula (3): R e SiO (4-e) / 2 (3)
Wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group and a phenyl group, at least 20 mol% of which is a phenyl group, and e is a positive number from 0.5 to 1.7. An organopolysiloxane resin having a diphenylsiloxane unit of 5 mol% or less of the total siloxane units, having at least 2 silicon-bonded alkenyl groups having 2 to 8 carbon atoms per molecule, and solid at room temperature; {In the mixture, the component (A1) is 99 to 30% by weight, the component (A2) is 1 to 70% by weight, and the total is 100% by weight}.

The component (A1) is liquid at room temperature, particularly 25 ° C.
The component (A1) has an average d of 1.9 to 2.2 in the average unit formula (2), so the molecular structure is linear or slightly branched, but in particular, the average structural formula (4 ):

(Wherein R 1 is an alkenyl group having 2 to 8 carbon atoms, a methyl group and a phenyl group, and at least 20 mol% of them is a phenyl group, and m has a viscosity of 10 to 100,000 mPa at 25 ° C. A linear methylphenylalkenyl polysiloxane represented by the formula:

In the above average structural formula, R 1 is an alkenyl group having 2 to 8 carbon atoms, a methyl group, and a phenyl group. In the cured product of the composition of the present invention, since attenuation due to light refraction, reflection, scattering, etc. is small, at least 20 mol% of R 1 in the molecule is a phenyl group, preferably at least 30 mol% is a phenyl group. Particularly preferably, at least 40 mol% is a phenyl group. However, if the phenyl group content is too large, the transparency decreases due to the turbidity of the composition, and therefore the phenyl group content is preferably 80 mol% or less. In terms of the color fastness of the curable organopolysiloxane composition of the present invention and the cured product of the optical semiconductor element sealant, the diphenylsiloxane unit in this component is 5 mol% or less of the total siloxane units, preferably It is 3 mol% or less, and most preferably 0 mol%.

As the linear methylphenylalkenylpolysiloxane represented by the above average structural formula, both ends dimethylvinylsiloxy group blocked methylphenylpolysiloxane, both ends methylphenylvinylsiloxy group blocked methylphenylpolysiloxane, both ends methyldivinylsiloxy group blocked Methylphenylpolysiloxane, both ends dimethylvinylsiloxy-blocked dimethylsiloxane / methylphenylsiloxane copolymer, both ends trimethylsiloxy-blocked methylvinylsiloxane / methylphenylsiloxane copolymer, both ends trimethylsiloxy-blocked dimethylsiloxane / methylvinylsiloxane / methylphenyl Siloxane copolymer, both ends dimethylphenylsiloxy-blocked methylvinylsiloxane / methylphenylsiloxane copolymer, both ends Methyl hexenyl siloxy groups at methylphenyl polysiloxane, both terminals blocked with trimethylsiloxy groups methylhexenylsiloxane-methylphenylsiloxane copolymers are exemplified.

The component (A2) has an average e of 0.5 to 1.7 in the average unit formula (3), so that the molecular structure is any of branched, reticulated, caged and three-dimensional, or a combination thereof. is there. The component (A2) is solid at room temperature, particularly 25 ° C.

As the siloxane units constituting the organopolysiloxane resin represented by the average unit formula (3), triorganosiloxane units (abbreviated M units), diorganosiloxane units (abbreviated D units), monoorganosiloxane units (abbreviated T units) and There are SiO 4/2 units (abbreviated Q units).
The organopolysiloxane resin represented by the average unit formula (3) requires T units, Q units, or T units and Q units, but may further contain D units in order to lower the softening point. preferable.
Preferred siloxane unit combinations include: T unit and D unit; T unit and M unit; T unit and D unit and M unit; T unit and D unit and Q unit; T unit and D unit and Q unit and M unit; There are units, Q units, and M units.

Examples of monoorganosiloxane units include RSiO 3/2 units, and examples include MeSiO 3/2 units, PhSiO 3/2 units, and Vi SiO 3/2 units.
Examples of the diorganosiloxane unit include R 2 SiO 2/2 units, which include MePhSiO 2/2 units, Me 2 SiO 2/2 units, MeVi SiO 2/2 units, and Ph 2 SiO 2/2 units.
Examples of triorganosiloxane units include R 3 SiO 1/2 units, and examples include Me 3 SiO 1/2 units, Me 2 PhSiO 1/2 units, MeViPhSiO 1/2 units, and MeVi 2 SiO 1/2 units. Here, Me means a methyl group, Vi means a vinyl group, and Ph means a phenyl group.
The siloxane unit is further a siloxane unit in which one of R groups in the siloxane unit is substituted with an OH group, for example, R (HO) SiO 2/2 unit, R 2 (HO) SiO 1/2 unit, There may be (HO) SiO 3/2 units.

In the methylphenylalkenyl polysiloxane composed of the siloxane unit, at least 20 mol% of the alkenyl group having 2 to 8 carbon atoms bonded to the silicon atom, methyl group and phenyl group is a phenyl group, preferably at least 30 mol%. Is a phenyl group, particularly preferably at least 40 mol% is a phenyl group. However, if the phenyl group content is too high, the transparency is lowered due to the turbidity of the composition, so 80 mol% or less is preferable.

The diphenylsiloxane unit is 5 mol% or less, preferably 3 mol% or less, and most preferably 0 mol% of the total siloxane unit from the viewpoint of discoloration resistance of the cured product. In the present invention, the diphenylsiloxane unit is an XPh 2 SiO 1/2 unit such as a methyldiphenylsiloxane unit or a vinyldiphenylsiloxane unit (wherein X is an alkenyl group having 2 to 8 carbon atoms or a methyl group, and Ph is phenyl Group).

The curable organopolysiloxane composition and the optical semiconductor element encapsulant of the present invention comprise 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl- The total content of 1,3,5,7-tetraphenylcyclotetrasiloxane is preferably 5% by weight or less. Since these cyclic products are often contained as by-products in the component (A), the component (A) contains 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5. The total content of 1,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is preferably 5% by weight or less, more preferably 3% by weight or less, and none Is most preferred.

The content of these cyclic products can be determined by headspace gas chromatography and quantitative analysis using n-undecane as an internal standard. 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane for n-undecane Is measured in advance using a standard sample, and 1,3,5-trimethyl-1,3,5-triphenylcyclohexane is determined from the peak intensity of the gas chromatograph and the amount of n-undecane added to the sample. Trisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane are quantified (the same applies hereinafter).

The component (A) is produced by synthesizing by a conventional method such as equilibration polymerization reaction or cohydrolysis condensation reaction, and removing volatile components. For example, a cyclic methylphenylsiloxane oligomer is bonded to a molecular chain end-blocking agent (eg, 1,3-divinyltetramethyldisiloxane, 1,3-divinyl-1,3-diphenyldimethyldisiloxane) and a polymerization catalyst (eg, potassium hydroxide). , Potassium dimethylsiloxanolate, tetramethylammonium hydroxide or tetramethylammonium dimethylsiloxalate), and equilibration polymerization is performed to neutralize or thermally decompose the polymerization catalyst. 3,5-trimethyl-1,3,5-triphenyl cyclotrisiloxane and 3,5,7-tetramethyl 3,5,7 - prepared by removing the tape tiger phenyl cyclotetrasiloxane be able to.

The diphenylsiloxane unit as component (B) is 5 mol% or less of the total siloxane units, and at least 20 mol% of all silicon atom-bonded organic groups in the molecule are phenyl groups, and at least two silicon atoms per molecule The methylphenyl hydrogen polysiloxane having a bonded hydrogen atom is preferably an average unit formula (5): R 2 b H c SiO (4-bc) / 2 (5)
(In the formula, R 2 is a methyl group and a phenyl group, and at least 20 mol% of them is a phenyl group, b is a positive number from 1.0 to 2.2, and c is a positive number from 0.002 to 1.0.) Indicated by

In order for component (B) to cure by hydrosilylation reaction with component (A), it is necessary that at least two silicon-bonded hydrogen atoms are present in each molecule, preferably at least three. . When the molecular structure of component (B) is linear, it exists only at both ends, both ends and side chains, or only at side chains. When the molecular structure of component (B) is cyclic, silicon-bonded hydrogen atoms are present only in the side chain. In the case where the molecular structure of the component (B) is branched, silicon-bonded hydrogen atoms are present only at the ends, only at the side chains, at branch points, both at the ends and the side chains, and the like. One hydrogen atom is usually bonded to the same silicon atom, but two hydrogen atoms may be bonded.

The silicon atom-bonded phenyl group in component (B) has a small attenuation due to light refraction, reflection, scattering, etc. in the cured product produced by the hydrosilylation reaction between component (A) and component (B). In the silicon atom-bonded all organic groups of component (B), the content of silicon atom-bonded phenyl groups is at least 20 mol%, preferably at least 30 mol%, particularly preferably at least 40 mol%. However, if the phenyl group content is too high, the transparency is lowered due to the turbidity of the composition, so 80 mol% or less is preferable.

The silicon atom-bonded phenyl group in component (B) can exist in the form of diphenylsiloxane units, but in the cured product produced by the hydrosilylation reaction between component (A) and component (B), light transmission Since the ratio and the discoloration resistance are high, the diphenylsiloxane unit in the composition of the present invention needs to be 5 mol% or less of the total siloxane unit, and the diphenylsiloxane unit of the total siloxane unit in the component (B) The content must also satisfy it. Therefore, the content of diphenylsiloxane units in the total siloxane units in component (B) is 5 mol% or less, preferably 3 mol% or less, and most preferably none.

(When the molecular structure of component B is linear, silicon atom-bonded phenyl groups are present only at both ends, both ends and side chains, or only at side chains. (B) Molecular structure of component Is branched, a silicon atom-bonded phenyl group is present only at the end, at both ends and side chains, only at the side chain, or at branch points, etc. One phenyl group is usually bonded to the same silicon atom. doing.

Examples of the molecular structure of component (B) include linear, branched, and cyclic structures. The branched shape is not limited to a pure branched shape, and may be any of a branched straight chain shape, a net shape, a cage shape, and a three-dimensional shape.

The component (B) is preferably liquid at room temperature, particularly 25 ° C., and its viscosity is not limited, but is preferably in the range of 1 to 10,000 mPa · s at 25 ° C. It is preferably within the range of 000 mPa · s. This is because if the viscosity of component (B) is less than the lower limit of the above range, it tends to volatilize during mixing with other components or during storage, and the composition of the curable organopolysiloxane composition may not be stable. On the other hand, an organohydrogenpolysiloxane exceeding the upper limit of the above range is not easy to produce.

A typical example when the component (B) is linear is the average structural formula (2):
(Wherein R 3 is a methyl group, a phenyl group and a hydrogen atom, at least 20 mol% of the total number of methyl groups and phenyl groups is a phenyl group, and at least two of all R 3 in the molecule are hydrogen atoms. And n is a number having a viscosity within a range of 1 to 10,000 mPa · s at 25 ° C.).

In the cured product of the composition of the present invention, since the attenuation due to light refraction, reflection, scattering, etc. is small, the phenyl group is preferably at least 30 mol% of the total number of methyl groups and phenyl groups, more preferably at least 40 mol%.
However, if the phenyl group content is too large, the transparency is lowered due to the turbidity of the composition, and therefore it is preferably 80 mol% or less.
When the component (A) has two alkenyl groups in the molecule, it is preferable that at least three of all R 3 in the molecule are hydrogen atoms. Component (B) has a viscosity at 25 ° C. of 1 to 10,000 mPa · s, preferably 2 to 5,000 mPa · s. N in the average structural formula (2) is a number of 0 or more, preferably 1 or more.

Preferred specific examples of the linear organohydrogenpolysiloxane represented by the average structural formula (2) include a linear methylphenylpolysiloxane, a linear methylhydrogensiloxane / methylphenylsiloxane copolymer, or a straight chain. A linear methylhydrogensiloxane / diphenylsiloxane copolymer; linear methylphenylhydrogen poly having both ends of a dimethylhydrogensiloxy group, a methylphenylhydrogensiloxy group, a trimethylsiloxy group, or a dimethylphenylsiloxy group Siloxane. The polysiloxane contains oligomeric siloxane.

A typical example when the component (B) is branched is an average siloxane unit formula (4):
(C 6 H 5 SiO 3/2 ) x (HMe 2 SiO 1/2 ) y (4)
(In the formula, C 6 H 5 is a phenyl group, Me is a methyl group, x is 0.3 to 0.75, y is 0.25 to 0.7, and x + y = 1.0. A branched methylphenyl hydrogen polysiloxane represented by formula (II) and an average siloxane unit formula:
(C 6 H 5 SiO 3/2 ) x (MeSiO 3/2 ) y (HMe 2 SiO 1/2 ) z
(In the formula, C 6 H 5 is a phenyl group, Me is a methyl group, x is 0.3 to 0.7, y is 0 to 0.3, and z is 0.25 to 0. 0.7 and x + y + z = 1.0)
It is a branched methylphenyl hydrogen polysiloxane shown by these. The polysiloxane contains oligomeric siloxane.

There are the following specific examples of the component (B).
Methylphenylhydrogensiloxane oligomers of the formula (HMePhSi) 2 O, (HMe 2 SiO) 2 SiMePh, (HMe 2 SiO) 3 SiPh or (HMePhSiO) 3 SiPh; (PhSiO 3/2 ) and (Me 2 HSiO 1 / 2 ) branched methylphenylhydrogenpolysiloxane, (PhSiO 3/2 ), (Me 2 SiO 2/2 ) and (Me 2 HSiO 1/2 ) units Hydrogen polysiloxane, (PhSiO 3/2 ), (MePhSiO 2/2 ) and (Me 2 HSiO 1/2 ) branched methylphenyl hydrogen polysiloxane, (PhSiO 3/2 ), (MeSiO 3/2 ) and (Me 2 HSiO 1/2 ) units of branched methylphenyl hydrogen polysiloxane, (PhSiO 3/2 ) and (MeHSiO 2/2 ) units of branched methylphenyl hydropolysiloxane Genpolysiloxane. In the above formula, Ph is a phenyl group, and Me is a methyl group.
The branched shape here includes a net shape, a saddle shape, and a three-dimensional shape. In any case, those which are liquid at room temperature, particularly 25 ° C., are preferred.

Component (B) is produced by a co-hydrolysis condensation reaction or an equilibration polymerization reaction, which is a conventional method.
Component (B) may be used in combination of two or more different substituents, constituent siloxane units, polymerization degree, viscosity and the like.
Component (B) is 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane The total content of is preferably 5% by weight or less, more preferably 3% by weight or less, and most preferably none.

The blending amount of the component (B) is 10 to 500% of the total number of moles of silicon-bonded hydrogen atoms in the component (B) with respect to the total number of moles of alkenyl groups in the component (A). {Ie, [total number of moles of silicon-bonded hydrogen atoms in component (B)] / [total number of moles of alkenyl groups in component (A)] = 0.1-5.0}, preferably The amount is 50 to 200%, and more preferably 70 to 150%. This is because when the blending amount of the component (B) is less than the lower limit of the above range, the resulting composition tends not to be cured sufficiently, whereas when the upper limit of the above range is exceeded, the resulting curing is obtained. This is because the product tends to have a high modulus or the heat resistance tends to decrease.

The catalyst for hydrosilylation reaction of component (C) is a catalyst for promoting the hydrosilylation reaction between the alkenyl group in component (A) and the silicon-bonded hydrogen atom in component (B). As such component (C), a platinum group element catalyst and a platinum group element compound catalyst are preferable, and a platinum-based catalyst, a rhodium-based catalyst, and a palladium-based catalyst are exemplified. A platinum-based catalyst is preferred because it can significantly accelerate the hydrosilylation reaction of the component (A) and the component (B), and thus the curing of the composition.

As this platinum-based catalyst, platinum fine powder, platinum black, chloroplatinic acid, chloroplatinic acid modified alcohol, chloroplatinic acid and diolefin complex, platinum-olefin complex, platinum-bis (acetoacetate), platinum-bis Platinum-carbonyl complexes such as (acetylacetonate), chloroplatinic acid / divinyltetramethyldisiloxane complexes, chloroplatinic acid / alkenylsiloxane complexes such as chloroplatinic acid / tetravinyltetramethylcyclotetrasiloxane complexes, platinum / divinyltetramethyl Examples include disiloxane complexes, platinum / alkenylsiloxane complexes such as platinum / tetravinyltetramethylcyclotetrasiloxane complexes, and complexes of chloroplatinic acid and acetylene alcohols, but in terms of hydrosilylation reaction performance, platinum-alkenylsiloxanes. Complexes are particularly preferred.

1,3-Divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7- as alkenylsiloxane for platinum-alkenylsiloxane complex Tetravinylcyclotetrasiloxane, alkenylsiloxane in which a part of the methyl groups of these alkenylsiloxanes are substituted with groups such as ethyl groups and phenyl groups, and the vinyl group of these alkenylsiloxanes is substituted with groups such as allyl groups and hexenyl groups Illustrative are alkenylsiloxanes. In particular, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane is preferred because the stability of the platinum-alkenylsiloxane complex is good.

Further, since the stability of the platinum-alkenylsiloxane complex can be improved, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,3-diallyl-1,1 are added to the complex. , 3,3-tetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, 1,3-divinyl-1,1,3,3-tetraphenyldisiloxane, , 3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane and other alkenyl siloxanes, and dimethylsiloxane oligomers and other organosiloxane oligomers are preferred, especially alkenyl siloxane oligomers. It is preferable to do.

The amount of component (C) is not particularly limited as long as it is an amount capable of curing the composition of the present invention. Specifically, with respect to the composition of the present invention, the amount of metal atoms in this component is preferably in the range of 0.01 to 500 ppm by weight, and more preferably in the range of 0.01 to 100 ppm. The amount is preferably within the range, and particularly preferably within the range of 0.1 to 50 ppm. This is because if the blending amount of component (C) is less than the lower limit of the above range, the composition tends not to be cured sufficiently, while if the upper limit of the above range is exceeded, the resulting cured product is obtained. This is because there is a risk of causing problems such as coloring.

In the cured product of the hydrosilylation reaction-curable organopolysiloxane composition and the optical semiconductor element sealing agent of the present invention, the present invention comprising the components (A) to (C) because of high light transmittance and discoloration resistance. The diphenylsiloxane unit in the hydrosilylation reaction-curable organopolysiloxane composition and the optical semiconductor element encapsulant must be 5 mol% or less, preferably 3 mol% or less of the total siloxane units. This is because the diphenylsiloxane unit has a light absorption different from that of other phenyl group-substituted siloxane units at 300 to 400 nm, so that the diphenylsiloxane unit is contained in the curable organopolysiloxane composition and the optical semiconductor element sealing agent of the present invention. This is because if it exceeds 5 mol%, the cured product has a light transmittance at 300 to 400 nm, which tends to cause discoloration.

In the curable organopolysiloxane composition and the optical semiconductor element sealant of the present invention, (D) a hydrosilylation reaction inhibitor may be blended in order to extend the pot life at room temperature and improve the storage stability. preferable. Alkylic alcohols such as 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyn-2-ol as hydrosilylation reaction inhibitors; 3 -Ene-in compounds such as methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; 1,3,5,7-tetramethyl-1,3,5,7-tetravinyl Methyl alkenylsiloxane oligomers such as cyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane; dimethylbis (3-methyl-1-butyne-3-oxy) Examples include alkyneoxysilanes such as silane and methylvinylbis (3-methyl-1-butyne-3-oxy) silane; and benzotriazole.

The blending amount of this hydrosilylation reaction inhibitor (D) is an amount sufficient to suppress gelation or curing when mixing the (A) component, the (B) component, and the (C) component. Sufficient to allow storage. The amount is preferably in the range of 0.0001 to 5 parts by weight, more preferably in the range of 0.01 to 3 parts by weight, based on 100 parts by weight of the total of component (A) and component (B).

In the curable organopolysiloxane composition and the optical semiconductor element sealing agent of the present invention, (E) an adhesion promoter or an adhesion promoter (E) Hereinafter, “adhesion promoter” may be blended. For this purpose, the (E) adhesion promoter is preferably selected from the known organosilicon compound-based adhesion promoters for hydrosilylation reaction-curable organopolysiloxane compositions that have excellent color fastness.

Typical examples include trialkoxysiloxy groups (for example, trimethoxysiloxy group, triethoxysiloxy group) or trialkoxysilylalkyl groups (for example, trimethoxysilylethyl group, triethoxysilylethyl group) and “hydrosilyl group, silicon atom Bonded alkenyl group (for example, vinyl group, allyl group), methacryloxyalkyl group bonded to silicon atom (for example, 3-methacryloxypropyl group), epoxy group bonded alkyl group bonded to silicon atom (for example, 3-glycol group) A functional group selected from the group consisting of a cidoxypropyl group, a 4-glycidoxybutyl group, a 2- (3,4-epoxycyclohexyl) ethyl group, and a 3- (3,4-epoxycyclohexyl) propyl group) ” A linear structure having about 4 to 20 organosilanes or silicon atoms Organosiloxane oligomer of branched structure or a cyclic structure; aminoalkyl reaction of trialkoxysilane and an epoxy group bonded alkyltrialkoxysilane, there is an epoxy group-containing ethyl polysilicate.

Specific examples include vinyltrimethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, hydrogentriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4 -Epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, reaction product of 3-glycidoxypropyltriethoxysilane and 3-aminopropyltriethoxysilane, silanol group Condensation reaction product of blocked methylvinylsiloxane oligomer and 3-glycidoxypropyltrimethoxysilane, Condensation reaction of silanol group blocked methylvinylsiloxane oligomer and 3-methacryloxypropyltriethoxysilane , Tris (3-trimethoxysilylpropyl) is isocyanurate.

These adhesion promoters preferably do not contain an active nitrogen atom such as an amino group from the viewpoint of maintaining yellowing resistance when a cured product is used for a long time under heating and preventing light transmission from decreasing.

These adhesion promoters are preferably in the form of a low-viscosity liquid at normal temperature, and preferably in the range of 1 to 500 mPa · s at 25 ° C.
The blending amount of these adhesion promoters in the composition is not particularly limited as long as it does not inhibit the curing characteristics and the characteristics of the cured product, but the total of 100 weights of the components (A), (B), and (C). The content is preferably in the range of 0.01 to 10 parts by weight, more preferably in the range of 0.1 to 5 parts by weight with respect to parts.

In addition, the hydrosilylation reaction-curable organopolysiloxane composition of the present invention includes, as the other optional components, inorganic fillers such as silica, glass, alumina, and zinc oxide; silicone rubber powder as long as the effects of the present invention are not impaired. , Silicone resin powder, organic resin fine powder such as polymethacrylate resin; heat-resistant agent, dye, pigment, flame retardant, solvent and the like may be blended.

However, the diphenylsiloxane unit in the curable organopolysiloxane composition and the optical semiconductor element sealing agent is 5 mol% or less, preferably 3 mol% or less, more preferably none at all. It is necessary to select and mix essential and optional components.
The total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane It is necessary to select and blend the essential and optional components so that the amount does not exceed 5% by weight, preferably does not exceed 3% by weight, more preferably none.

The curable organopolysiloxane composition of the present invention is preferably liquid at room temperature, particularly at 25 ° C., in terms of moldability, and has a viscosity at 25 ° C. of 10 to 1,000,000 mPa · s. In particular, it is preferably in the range of 100 to 50,000 mPa · s.
The curable organopolysiloxane composition of the present invention can be produced by uniformly mixing the components (A) to (C), or the components (A) to (C) and optional components.

Since the hydrosilylation reaction-curable organopolysiloxane composition of the present invention is mainly composed of the components (A) and (B), the cured product inevitably has a refractive index (25 ° C.) in visible light (589 nm). The light transmittance is high at the initial stage and after being kept for a long time under heating. The cured product preferably has a refractive index (25 ° C.) in visible light (589 nm) of at least 1.5, and a light transmittance (25 ° C.) at a wavelength of 450 nm with an optical path length of 0.2 cm is at least 99%. Preferably there is.
Further, after the cured product is held in a hot air circulation oven at 150 ° C. for 1000 hours, the light transmittance (25 ° C.) at a wavelength of 450 nm with an optical path length of 0.2 cm is preferably at least 98%.

This is because the optical semiconductor element has a refractive index of a cured product of less than 1.5, an initial light transmittance of less than 99%, or light after being kept in a hot air circulation oven at 150 ° C. for 1000 hours. This is because if the cured product having a transmittance (25 ° C.) of less than 98% is sealed, sufficient reliability may not be imparted to the optical semiconductor device.

The optical semiconductor element sealant of the present invention comprises the hydrosilylation reaction-curable organopolysiloxane composition of claim 6, preferably of claim 7. The above-mentioned composition, components, properties, production method and the like of the hydrosilylation reaction-curable organopolysiloxane composition of the present invention are applied in principle to the optical semiconductor element sealing agent of the present invention.
The optical semiconductor element sealant of the present invention has a light transmittance of at least 99% at a wavelength of 450 nm at an optical path length of 0.2 cm in a quartz cell, and a refractive index (25 ° C.) of visible light (589 nm) of at least 1. A cured product of .5 is formed.
Further, after the cured product is held in a hot air circulation oven at 150 ° C. for 1000 hours, the light transmittance (25 ° C.) at a wavelength of 450 nm with an optical path length of 0.2 cm is preferably at least 98%.

This is because the optical semiconductor element has a refractive index of a cured product of less than 1.5, an initial light transmittance of less than 99%, or light after being kept in a hot air circulation oven at 150 ° C. for 1000 hours. This is because if the cured product having a transmittance (25 ° C.) of less than 98% is sealed, sufficient reliability may not be imparted to the optical semiconductor device.

This refractive index can be measured by, for example, an Abbe refractometer. At this time, the refractive index at an arbitrary wavelength can be measured by changing the wavelength of the light source in the Abbe refractometer. Moreover, this light transmittance can be calculated | required, for example by measuring the light transmittance (25 degreeC) in wavelength 450nm about optical path length 0.2cm about cured | curing material with a spectrophotometer.

The hydrosilylation reaction-curable organopolysiloxane composition and the optical semiconductor element sealing agent of the present invention are cured by standing at room temperature or by heating, but it is preferable to heat in order to cure rapidly. The heating temperature is preferably in the range of 50 to 200 ° C.

Such a hydrosilylation reaction-curable organopolysiloxane composition and an optical semiconductor encapsulant of the present invention are cured products having a high refractive index, light transmittance, and discoloration resistance, and a cured product having high adhesion durability to a substrate. It is useful as an electrical / electronic adhesive, potting agent, encapsulant, protective coating agent, underfill agent and the like. In particular, because of its high refractive index and light transmittance, optical semiconductor elements, optical semiconductor device sealing agents (including potting agents, encapsulants, protective coating agents, underfill agents), adhesives (die bonding agents) And the like.

Such a hydrosilylation reaction-curable organopolysiloxane composition and an optical semiconductor sealing agent of the present invention comprising 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3, 5,7-tetramethyl-3,5,7 - what the total content of Te tiger phenyl cyclotetrasiloxane is 5 wt% or less, the steel also not contain an adhesion promoter, stainless steel, aluminum Metals such as copper, silver, titanium, and titanium alloys; semiconductor elements such as silicon semiconductors, gallium phosphide semiconductors, gallium arsenide semiconductors, and gallium nitride semiconductors; ceramics, glass, thermosetting resins, heat having polar groups Excellent initial adhesion to plastic resins, adhesion durability, especially adhesion resistance when subjected to a thermal cycle. Agents, potting agents, encapsulants, protective coating agents, is useful as an underfill agent.

In particular, because of its high refractive index and light transmittance, optical semiconductor elements, optical semiconductor device sealing agents (including potting agents, encapsulants, protective coating agents, underfill agents), adhesives (die bonding agents) And the like.

Next, the semiconductor device of the present invention will be described in detail.
In the optical semiconductor device of the present invention, an optical semiconductor element, particularly an optical semiconductor element in a housing is sealed, particularly encapsulated by the above-mentioned optical semiconductor element sealant, particularly a hardened encapsulant. It is characterized by that. Specific examples of the optical semiconductor element include a light emitting diode (LED) element, a semiconductor laser element, an organic EL, a photodiode element, a phototransistor element, a solid-state imaging element, a photocoupler light emitting element, and a light receiving element.
Since the refractive index and light transmittance of the cured product of the curable organopolysiloxane composition are high, the optical semiconductor element is preferably a light emitting diode (LED) element.

The housing for that purpose is made of a material such as a metal, ceramic, thermosetting resin, or thermoplastic resin having a polar group, to which the curable organopolysiloxane composition of the present invention and the optical semiconductor element sealant can be easily bonded. It is preferable that the shape and structure are not limited.
Examples of the metal include stainless steel, aluminum, and duralumin. Examples of the thermosetting resin include an epoxy resin, a phenol resin, and an unsaturated polyester resin. Examples of the thermoplastic resin having a polar group include polyphthalamide resin, polybutylene terephthalate resin, and ABS. Resins and liquid crystalline polymers are exemplified.

The optical semiconductor element sealant of the present invention, particularly the encapsulant, is preferably cured in a state where it is in contact with both the optical semiconductor element in the housing and the inner wall of the electrically insulating housing.
The refractive index (25 ° C.) and the light transmittance (25 ° C.) of visible light (589 nm) of the optical semiconductor element sealant, particularly a cured encapsulant, are as described above.

Examples of the optical semiconductor device of the present invention include a light emitting diode (LED) device, a photocoupler, a CCD device, a semiconductor laser device, an optical detector, an optical waveguide, an optical waveform modulator, and an optical integrated circuit.
In particular, since the light transmittance is high, the optical semiconductor device of the present invention is preferably a light emitting diode (LED) device.

A cross-sectional view of a single surface-mounted light emitting diode (LED) device, which is a representative example of the optical semiconductor device of the present invention, is shown in FIG. In the light emitting diode (LED) device shown in FIG. 1, a light emitting diode (LED) chip 2 in a polyphthalamide (PPA) resin casing 1 is die-bonded on a die pad 6. The inner lead 3 is wire-bonded by a bonding wire 4. The light-emitting diode (LED) chip 2 is sealed, particularly encapsulated, together with the inner wall of the housing 1 by the optical semiconductor element sealant of the present invention, particularly an encapsulated cured material 5.

In order to manufacture the surface mount type light emitting diode (LED) device shown in FIG. 1, a light emitting diode (LED) chip 2 in a polyphthalamide (PPA) resin casing 1 is die-bonded to a die pad 6, and this light emitting diode is produced. (LED) The chip 2 and the inner lead 3 are wire-bonded by a gold bonding wire 4. Next, after the optical semiconductor element sealing agent of the present invention, particularly the encapsulant, is injected into the housing 1, it is preferably cured by heating to 50 to 200 ° C. after defoaming.

The hydrosilylation reaction-curable organopolysiloxane composition, the optical semiconductor element sealant, particularly the encapsulant and the optical semiconductor device of the present invention will be described in detail with reference to Examples and Comparative Examples. In addition, the viscosity in an Example and a comparative example is the value measured in 25 degreeC. In the examples and comparative examples, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively.
Various properties of the hydrosilylation reaction-curable organopolysiloxane composition and the optical semiconductor element sealant, particularly the encapsulant and its cured product, were measured as follows. The results are shown in Table 1. Further, a surface mount type light emitting diode (LED) device was manufactured using an optical semiconductor element sealant, particularly an encapsulant, and the peel rate of the cured product was evaluated as follows. Indicated. In the examples and comparative examples, the curable organopolysiloxane composition may mean an optical semiconductor element sealant, but is simply indicated as “curable organopolysiloxane composition”.

[Contents of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane]
1,3,5-Trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7 in hydrosilylation reaction curable organopolysiloxane composition The content of -tetraphenylcyclotetrasiloxane was determined by quantitative analysis using headspace gas chromatography using n-undecane as an internal standard. That is, 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclo for n-undecane in advance. The relative intensity of tetrasiloxane was measured using a standard sample, and 1,3,5-trimethyl-1,3,5-triphenyl was determined from the peak intensity of the gas chromatograph and the amount of n-undecane added to the sample. Cyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane were quantified.

For quantification, about 2 g of the sample was weighed into a dedicated 20 ml vial, sealed, heated at 150 ° C. for 3 hours with a headspace sampler G1888 made by Agilent Technologies, and then a capillary gas chromatograph made by Agilent Technologies (column used: J & W Scientific DB-5, column length 30 m, column inner diameter 0.25 mm, liquid phase thickness 0.25 μm). The column temperature was maintained at 40 ° C. for 5 minutes, then heated to 250 ° C. at 10 ° C. per minute and then maintained for 5 minutes. A flame ionization detector (FID) was adopted as the detector.

[Refractive index of curable organopolysiloxane composition]
The refractive index of the hydrosilylation reaction-curable organopolysiloxane composition was measured at 25 ° C. using an Abbe refractometer. Note that visible light (589 nm) was used as a light source.

[Light transmittance of cured product of curable organopolysiloxane composition]
The hydrosilylation reaction-curable organopolysiloxane composition was put between two glass plates and held at 150 ° C. for 1 hour to be cured (optical path length 0.2 cm). The light transmittance of the cured product was measured at 25 ° C. using a self-recording spectrophotometer capable of measuring at an arbitrary wavelength in the range of visible light (wavelength 400 nm to 700 nm). The light transmittance contained in the glass plate and the light transmittance of only the glass plate were measured, and the difference was taken as the light transmittance of the cured product. In Table 1, the light transmittance at a wavelength of 450 nm is shown.

[Light transmittance of the cured curable organopolysiloxane composition after being held at 150 ° C. for 1000 hours]
After holding the test body which measured said light transmittance for 1000 hours in 150 degreeC hot-air circulation type oven, the light transmittance was measured similarly. In Table 1, the light transmittance at a wavelength of 450 nm is shown.

[Hardness of cured product of curable organopolysiloxane composition]
A sheet-like cured product was prepared by press molding the hydrosilylation reaction-curable organopolysiloxane composition at 150 ° C. for 1 hour. The hardness of the sheet-like cured product was measured with a type A or type D durometer as defined in JIS K 6253.

[Adhesive strength of cured product of curable organopolysiloxane composition to polyphthalamide (PPA) resin plate]
A polytetrafluoroethylene resin spacer (width 10 mm, length 20 mm, thickness 1 mm) is sandwiched between two polyphthalamide (PPA) resin plates (width 25 mm, length 50 mm, thickness 1 mm), and the gap The hydrosilylation reaction curable organopolysiloxane composition was filled, clipped, and held in a hot air circulating oven at 150 ° C. for 1 hour to cure. After cooling to room temperature, the clip and spacer were removed, and a polyphthalamide (PPA) resin plate was pulled in the opposite horizontal direction by a tensile tester, and the stress at the time of breaking the cured product was measured.

[Adhesive strength of cured product of curable organopolysiloxane composition to aluminum plate]
A spacer made of polytetrafluoroethylene resin (width 10 mm, length 20 mm, thickness 1 mm) is sandwiched between two aluminum plates (width 25 mm, length 75 mm, thickness 1 mm), and a curable organopolysiloxane composition is formed in the gap The product was filled, clipped, and kept in a hot air circulating oven at 150 ° C. for 1 hour to cure. After cooling to room temperature, the clip and spacer were removed, and the aluminum plate was pulled in the opposite horizontal direction by a tensile tester, and the stress at the time of breaking the cured product was measured.

[Production of surface-mount type light emitting diode (LED) device]
The inner lead 3 extends from the side wall toward the center of the inner bottom of the cylindrical polyphthalamide (PPA) resin casing 1 (inner diameter 2.0 mm, depth 1.0 mm) whose bottom is closed, A light emitting diode (LED) chip 2 is placed on the center of the inner lead 3, and the light emitting diode (LED) chip 2 and the inner lead 3 are electrically connected by a bonding wire 4. The hydrosilylation reaction-curable organopolysiloxane composition of each example or each comparative example is degassed into a case 1 made of PPA) and injected using a dispenser, and is heated at 100 ° C. in a hot air circulating oven at 30 ° C. Sixteen surface-mounted light-emitting diode (LED) devices A shown in FIG. 1 were produced by curing by heating for one minute at 150 ° C. for one hour.

[Initial peeling rate of cured product]
About 16 surface-mounted light emitting diode (LED) devices A, the peeled state between the inner wall of the polyphthalamide (PPA) casing 1 and the heat-cured product of the composition was observed with an optical microscope, and the number of peeled / 16 pieces were made into the peeling rate.

[Peeling rate after holding at constant temperature and humidity]
After holding 16 surface-mounted light emitting diode (LED) devices A in 30 ° C./70 RH% air for 72 hours, the temperature is returned to room temperature (25 ° C.), and the case 1 is made of polyphthalamide (PPA) resin. The presence or absence of delamination between the inner wall and the heat-cured product of the composition was observed with an optical microscope, and the number of delaminations / 16 was defined as the delamination rate.

[Peeling rate after holding at 280 ° C./30 seconds]
After placing the 16 surface-mounted light-emitting diode (LED) devices A after holding the above constant temperature and humidity in a hot air circulation oven at 280 ° C. for 30 seconds, the temperature was returned to room temperature (25 ° C.), and polyphthalamide (PPA ) The presence or absence of delamination between the inner wall of the resin casing 1 and the heat-cured product of the composition was observed with an optical microscope, and the number of delaminations / 16 was defined as the delamination rate.

[Peeling rate after thermal shock cycle]
The above 16 surface-mounted light emitting diode (LED) devices A held at 280 ° C. for 30 seconds are held at −40 ° C. for 30 minutes, then held at + 100 ° C. for 30 minutes, and this temperature cycle (from −40 ° C. to + 100 ° C.) was repeated a total of 5 times, then returned to room temperature (25 ° C.), and the presence or absence of peeling between the inner wall of the polyphthalamide (PPA) resin casing 1 and the heat-cured product of the composition was observed with an optical microscope. The number of peeled / 16 pieces was taken as the peel rate.

[Example 1]
Linear molecular chain both ends dimethylvinylsiloxy group-blocked methylphenylpolysiloxane (viscosity = 3,500 mPa · s, silicon atom-bonded vinyl group content = 1.5% by weight, silicon in silicon atom-bonded all organic groups) 84% by weight of atomic bond phenyl group content = 49 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%)
Average siloxane unit formula: (PhSiO 3/2 ) 0.4 (HMe 2 SiO 1/2 ) 0.6
A branched organopolysiloxane represented by the formula (viscosity = 700 mPa · s, content of silicon atom-bonded hydrogen atoms = 0.65 wt%, content of silicon atom-bonded phenyl groups in all silicon atom-bonded organic groups = 25 Mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%) 3 parts by weight,
Average structural formula: HMe 2 SiO (MePhSiO) 4 SiMe 2 H
Dimethylhydrogensiloxy group-blocked methylphenylpolysiloxane (viscosity = 350 mPa · s, content of silicon atom-bonded hydrogen atoms = 0.22 wt%, silicon atoms in all silicon atom-bonded organic groups) Bonded phenyl group content = 33.3 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%) 13 parts by weight,
1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (in this composition, the amount of platinum metal in the complex is 2.5 ppm by weight), and 2-phenyl- When 0.05 part by weight of 3-butyn-2-ol was uniformly mixed, the content of diphenylsiloxane units in the total siloxane units was 0 mol%, and 1,3,5-trimethyl-1,3,5 The total content of triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is 2.5% by weight and has a viscosity of 1,250 mPa · s A hydrosilylation reaction-curable organopolysiloxane composition was prepared.

The properties of the hydrosilylation reaction curable organopolysiloxane composition and the cured product thereof were measured. These results are shown in Table 1. Further, using this curable organopolysiloxane composition, a surface mount type light emitting diode (LED was manufactured and evaluated for reliability. Table 2 shows the results.

[Example 2]
Linear molecular chain both ends dimethylvinylsiloxy group-blocked methylphenylpolysiloxane (viscosity = 3,500 mPa · s, silicon atom-bonded vinyl group content = 0.20 wt%, silicon in silicon atom-bonded all organic groups) 66 parts by weight of atomic bond phenyl group content = 49 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%)
Average siloxane unit formula: (PhSiO 3/2 ) 0.75 (ViMe 2 SiO 1/2 ) 0.25
Branched organopolysiloxane represented by the formula {Property = solid (25 ° C.), content of silicon atom-bonded vinyl group = 5.62% by weight, content of silicon atom-bonded phenyl group in all silicon atom-bonded organic groups Rate = 50 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%} 20 parts by weight,
Average siloxane unit formula: (PhSiO 3/2 ) 0.4 (HMe 2 SiO 1/2 ) 0.6
A branched organopolysiloxane represented by the formula (viscosity = 700 mPa · s, content of silicon atom-bonded hydrogen atoms = 0.65 wt%, content of silicon atom-bonded phenyl groups in all silicon atom-bonded organic groups = 25 Mol%, content of diphenylsiloxane units in the total siloxane units = 0 mol%) 13 parts by weight,
1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (in this composition, the amount of platinum metal in the complex is 2.5 ppm by weight), and 2-phenyl- When 0.05 part by weight of 3-butyn-2-ol was uniformly mixed, the content of diphenylsiloxane units in the total siloxane units was 0 mol%, and 1,3,5-trimethyl-1,3,5 The total content of triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is 1.8% by weight and the viscosity is 2,300 mPa · s A hydrosilylation reaction-curable organopolysiloxane composition was prepared.

The properties of the hydrosilylation reaction curable organopolysiloxane composition and the cured product thereof were measured. These results are shown in Table 1. Further, a surface-mount type light emitting diode (LED) was produced using this curable organopolysiloxane composition, and reliability evaluation was performed. These results are shown in Table 2.

[Example 3]
Linear molecular chain both ends dimethylvinylsiloxy group-blocked methylphenylpolysiloxane (viscosity = 3,500 mPa · s, silicon atom-bonded vinyl group content = 0.20 wt%, silicon in silicon atom-bonded all organic groups) Content of atomically bonded phenyl groups = 49 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%) 16 parts by weight,
Average siloxane unit formula: (PhSiO 3/2 ) 0.75 (ViMe 2 SiO 1/2 ) 0.25
Branched organopolysiloxane represented by the formula {Property = solid (25 ° C.), content of silicon atom-bonded vinyl group = 5.62% by weight, content of silicon atom-bonded phenyl group in all silicon atom-bonded organic groups Rate = 50 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%} 40 parts by weight,
Average structural formula: HMe 2 SiO (MePhSiO) 4 SiMe 2 H
Dimethylhydrogensiloxy group-blocked methylphenylpolysiloxane (viscosity = 350 mPa · s, content of silicon atom-bonded hydrogen atoms = 0.22 wt%, silicon atoms in all silicon atom-bonded organic groups) 44 parts by weight of platinum-containing 1,3-divinyl-1,1,3,3-tetra (content of bound phenyl group = 33.3 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%)) A methyldisiloxane complex (in this composition, the amount of platinum metal in the complex to be 2.5 ppm by weight) and 0.05 parts by weight of 2-phenyl-3-butyn-2-ol were mixed uniformly. The content of diphenylsiloxane units in the total siloxane units is 0 mol%, and 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7- A hydrosilylation reaction-curable organopolysiloxane composition having a total content of tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane = 0.4% by weight and a viscosity of 2,800 mPa · s was prepared. .

The properties of the hydrosilylation reaction curable organopolysiloxane composition and the cured product thereof were measured. These results are shown in Table 1. Further, a surface-mount type light emitting diode (LED) was produced using this curable organopolysiloxane composition, and reliability evaluation was performed. These results are shown in Table 2.

[Comparative Example 1]
Linear molecular chain both ends dimethylvinylsiloxy group-blocked methylphenylpolysiloxane (viscosity = 3,500 mPa · s, silicon atom-bonded vinyl group content = 1.5% by weight, silicon in silicon atom-bonded all organic groups) 87% by weight of atomic bond phenyl group content = 49 mol%, diphenylsiloxane unit content in total siloxane units = 0 mol%)
Average siloxane unit formula: (PhSiO 3/2 ) 0.4 (HMe 2 SiO 1/2 ) 0.6
A branched organopolysiloxane represented by the formula (viscosity = 700 mPa · s, content of silicon atom-bonded hydrogen atoms = 0.65 wt%, content of silicon atom-bonded phenyl groups in all silicon atom-bonded organic groups = 25 Mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%) 3 parts by weight,
Average structural formula: HMe 2 SiO (Ph 2 SiO) 2 SiMe 2 H
Dimethylhydrogensiloxy group-blocked diphenylpolysiloxane (viscosity = 150 mPa · s, silicon atom-bonded hydrogen atom content = 0.32 wt%, silicon atom-bonded silicon atoms in all organic groups bonded to silicon atoms) Content of phenyl group = 50 mol%, content of diphenylsiloxane unit in total siloxane units = 50 mol%) 10 parts by weight,
1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (in this composition, the amount of platinum metal in the complex is 2.5 ppm by weight), and 2-phenyl- When 0.05 part by weight of 3-butyn-2-ol was uniformly mixed, the content of diphenylsiloxane units in the total siloxane units was 5.3 mol%, and 1,3,5-trimethyl-1,3 , 5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane = 2.3 wt%, viscosity 1,350 mPa A hydrosilylation reaction-curable organopolysiloxane composition that is s was prepared.

The properties of the hydrosilylation reaction curable organopolysiloxane composition and the cured product thereof were measured. These results are shown in Table 1. Further, a surface-mount type light emitting diode (LED) was produced using this curable organopolysiloxane composition, and reliability evaluation was performed. These results are shown in Table 2.

[Comparative Example 2]
Linear molecular chain-terminated dimethylvinylsiloxy group-blocked dimethylsiloxane diphenylsiloxane copolymer (viscosity = 3,700 mPa · s, silicon atom-bonded vinyl group content = 1.48 wt%, silicon atom-bonded all organic groups) Content of silicon atom-bonded phenyl groups in the content = 49 mol%, content of diphenylsiloxane units in the total siloxane units = 49 mol%) 66 parts by weight,
Average siloxane unit formula: (PhSiO 3/2 ) 0.75 (ViMe 2 SiO 1/2 ) 0.25
Branched organopolysiloxane represented by the formula {Property = solid (25 ° C.), content of silicon atom-bonded vinyl group = 5.62% by weight, content of silicon atom-bonded phenyl group in all silicon atom-bonded organic groups Rate = 50 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%} 20 parts by weight,
Average siloxane unit formula: (PhSiO 3/2 ) 0.4 (HMe 2 SiO 1/2 ) 0.6
A branched organopolysiloxane represented by the formula (viscosity = 700 mPa · s, content of silicon atom-bonded hydrogen atoms = 0.65 wt%, content of silicon atom-bonded phenyl groups in all silicon atom-bonded organic groups = 25 Mol%, content of diphenylsiloxane units in the total siloxane units = 0 mol%) 13 parts by weight,
1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (in this composition, the amount of platinum metal in the complex is 2.5 ppm by weight), and 2-phenyl- When 0.05 part by weight of 3-butyn-2-ol was uniformly mixed, the content of diphenylsiloxane units in the total siloxane units was 28.5%, and 1,3,5-trimethyl-1,3, The total content of 5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane = 1.8% by weight and a viscosity of 2,350 mPa · s. A hydrosilylation reaction-curable organopolysiloxane composition, s, was prepared.

The properties of the hydrosilylation reaction curable organopolysiloxane composition and the cured product thereof were measured. These results are shown in Table 1. Further, a surface-mount type light emitting diode (LED) was produced using this curable organopolysiloxane composition, and reliability evaluation was performed. These results are shown in Table 2.

[Comparative Example 3]
Linear molecular chain both ends dimethylvinylsiloxy group-blocked methylphenylpolysiloxane (viscosity = 3,500 mPa · s, silicon atom-bonded vinyl group content = 0.20 wt%, silicon in silicon atom-bonded all organic groups) 27% by weight of atomic bond phenyl group content = 49 mol%, diphenylsiloxane unit content in total siloxane units = 0 mol%)
Average siloxane unit formula: (PhSiO 3/2 ) 0.75 (ViMe 2 SiO 1/2 ) 0.25
Branched organopolysiloxane represented by the formula {Property = solid (25 ° C.), content of silicon atom-bonded vinyl group = 5.62% by weight, content of silicon atom-bonded phenyl group in all silicon atom-bonded organic groups Rate = 50 mol%, content of diphenylsiloxane units in total siloxane units = 0 mol%} 40 parts by weight,
Average structural formula: HMe 2 SiO (Ph 2 SiO) 2 SiMe 2 H
Dimethylhydrogensiloxy group-blocked diphenylpolysiloxane (viscosity = 150 mPa · s, silicon atom-bonded hydrogen atom content = 0.32 wt%, silicon atom-bonded silicon atoms in all organic groups bonded to silicon atoms) (Phenyl group content = 50 mol%, diphenylsiloxane unit content in total siloxane units = 50 mol%) 33 parts by weight,
1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (in this composition, the amount of platinum metal in the complex is 2.5 ppm by weight), and 2-phenyl- When 0.05 part by weight of 3-butyn-2-ol was uniformly mixed, the content of diphenylsiloxane units in the total siloxane units was 17.0 mol%, and 1,3,5-trimethyl-1,3 , 5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane = 0.7 wt%, viscosity 3,000 mPa A hydrosilylation reaction-curable organopolysiloxane composition that is s was prepared.

The properties of the hydrosilylation reaction curable organopolysiloxane composition and the cured product thereof were measured. These results are shown in Table 1. Further, a surface-mount type light emitting diode (LED) was produced using this curable organopolysiloxane composition, and reliability evaluation was performed. These results are shown in Table 2.


Note: In hardness, A means measurement with a type A durometer and D means measurement with a type D durometer.

Since the hydrosilylation reaction-curable organopolysiloxane composition of the present invention forms a cured product having a high refractive index, light transmittance, and resistance to discoloration, and a cured product having a high adhesion durability to a substrate. It is useful as an adhesive, potting agent, encapsulant, protective coating agent, underfill agent and the like.
Since the optical semiconductor element sealing agent of the present invention forms a cured product having a high refractive index, light transmittance, and discoloration resistance, and further a cured product having a high adhesion durability to a substrate, an optical semiconductor element and an optical semiconductor device It is useful as a sealing agent (including potting agent, encapsulant, protective coating agent, underfill agent), adhesive (including die bonding agent) and the like.
The optical semiconductor device of the present invention is useful as an optical semiconductor device such as an optical device, an optical device, an illumination device, and an illumination device because the optical semiconductor device is sealed with a cured product of the optical semiconductor device sealing agent. .

A Surface Mount Type Light Emitting Diode (LED) Device 1 Polyphthalamide (PPA) Resin Housing 2 Light Emitting Diode (LED) Chip 3 Inner Lead 4 Bonding Wire 5 Hardened Optical Semiconductor Device Sealant 6 Die Pad

Claims (18)

  1. (A) The diphenylsiloxane unit is 5 mol% or less of the total siloxane units, at least 20 mol% of all silicon atom-bonded organic groups in the molecule are phenyl groups, and at least two silicon atom-bonded alkenyl groups per molecule (B) diphenylsiloxane units are 5 mol% or less of the total siloxane units, at least 20 mol% of all silicon atom-bonded organic groups in the molecule are phenyl groups, and at least per molecule It comprises methylphenyl hydrogen polysiloxane having two silicon-bonded hydrogen atoms and (C) hydrosilylation reaction catalyst, and the diphenylsiloxane unit in the composition is 5 mol% or less of the total siloxane units, and 1,3 , 5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1, A hydrosilylation reaction-curable organopolysiloxane composition, wherein the total content of 3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is 5% by weight or less.
  2. Component (A) is an average unit formula (1): R a SiO (4-a) / 2 wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group or a phenyl group, and at least 20 thereof. Mol% is a phenyl group, a is a positive number of 0.5 to 2.2), and the component (B) is an average unit formula (5): R 1 b H c SiO (4-bc) / 2 ( Wherein R 1 is a methyl group or a phenyl group, at least 20 mol% of them is a phenyl group, b is a positive number from 1.0 to 2.2, and c is a positive number from 0.002 to 1.0. The hydrosilylation reaction-curable organopolysiloxane composition of claim 1, characterized in that it is indicated.
  3. (A) component is (A1) average unit formula (2): R d SiO (4-d) / 2 (wherein R is an alkenyl group having 2 to 8 carbon atoms, methyl group or phenyl group, At least 20 mol% of them are phenyl groups and d is a positive number from 1.9 to 2.2), and the diphenylsiloxane unit is not more than 5 mol% of the total siloxane units, and at least 2 molecules per molecule A methylphenylalkenylpolysiloxane having a silicon atom-bonded alkenyl group and having a viscosity at 25 ° C. of 10 to 100,000 mPa · s and liquid at room temperature, and (A2) average unit formula (3): R e SiO (4 -e) / 2 (wherein R is an alkenyl group having 2 to 8 carbon atoms, a methyl group or a phenyl group, at least 20 mol% of which is a phenyl group, and e is a positive number from 0.5 to 1.7) The diphenylsiloxane unit is 5 mol% or less of the total siloxane unit. A mixture of methylphenylalkenylpolysiloxane resin having at least two silicon-bonded alkenyl groups per molecule and solid at room temperature {in the mixture, (A1) component is 99 to 30% by weight; The component (A2) is 1 to 70% by weight, and the total is 100% by weight}. The hydrosilylation reaction-curable organopolysiloxane composition according to claim 2,
  4. The hydrosilylation reaction-curable organopolysiloxane composition according to claim 1 or 2, wherein both the component (A) and the component (B) do not have a diphenylsiloxane unit.
  5. The hydrosilylation reaction-curable organopolysiloxane composition according to claim 3, wherein none of the components (A1), (A2), and (B) has a diphenylsiloxane unit.
  6. In a quartz cell, a light transmittance at a wavelength of 450 nm at an optical path length of 0.2 cm is at least 99%, and a cured product having a refractive index (25 ° C.) in visible light (589 nm) of at least 1.5 is formed. The hydrosilylation reaction-curable organopolysiloxane composition according to claim 1, claim 2, or claim 4.
  7. In a quartz cell, a light transmittance at a wavelength of 450 nm at an optical path length of 0.2 cm is at least 99%, and a cured product having a refractive index (25 ° C.) in visible light (589 nm) of at least 1.5 is formed. The hydrosilylation reaction-curable organopolysiloxane composition according to claim 3 or 5.
  8. The light transmittance (25 ° C.) at a wavelength of 450 nm with an optical path length of 0.2 cm after holding the cured product in a hot-air circulating oven at 150 ° C. for 1000 hours is at least 98%. The hydrosilylation reaction-curable organopolysiloxane composition according to claim 6 or 7.
  9. An optical semiconductor element encapsulant comprising the hydrosilylation reaction-curable organopolysiloxane composition according to claim 6.
  10. An optical semiconductor element encapsulant comprising the hydrosilylation reaction-curable organopolysiloxane composition according to claim 7.
  11. The optical semiconductor element sealant forms a cured product having a light transmittance (25 ° C.) of at least 99% at a wavelength of 450 nm with an optical path length of 0.2 cm, and the cured product is placed in a hot air circulation oven at 150 ° C. The optical semiconductor element sealing according to claim 9 or 10, characterized in that after holding for 1000 hours, the light transmittance (25 ° C) at a wavelength of 450 nm with an optical path length of 0.2 cm is at least 98%. Agent.
  12. An optical semiconductor element encapsulant according to claim 9, 10, or 11 is sealed and cured in the optical semiconductor device having an optical semiconductor element in the housing, and the light emitting semiconductor An optical semiconductor device, wherein an element is sealed with a translucent cured product of the optical semiconductor element sealing agent.
  13. 13. The optical semiconductor device according to claim 12, wherein the optical semiconductor device is a light emitting diode device, and the optical semiconductor device is a light emitting diode device.
  14. The optical semiconductor device according to claim 12 or 13, wherein the casing is made of plastic having a polar group.
  15. The optical semiconductor device according to claim 14, wherein the plastic having a polar group is a polyphthalamide resin.
  16. The total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is 3 The hydrosilylation reaction-curable organopolysiloxane composition according to any one of claims 1 to 5, wherein the composition is at most% by weight.
  17. The total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is 3 wherein the% by weight or less, the optical semiconductor element sealant according to claim 9, claim 10 or claim 11.
  18. An optical semiconductor element sealing agent according to claim 17 is sealed and cured in the optical semiconductor device including the optical semiconductor element in the casing, and the light emitting semiconductor element is sealed with the optical semiconductor element. An optical semiconductor device which is sealed with a translucent cured product of an agent.
JP2011518614A 2008-10-31 2009-10-30 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device Active JP5769622B2 (en)

Priority Applications (4)

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