JP5762185B2 - ダイボンディング装置 - Google Patents

ダイボンディング装置 Download PDF

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Publication number
JP5762185B2
JP5762185B2 JP2011153493A JP2011153493A JP5762185B2 JP 5762185 B2 JP5762185 B2 JP 5762185B2 JP 2011153493 A JP2011153493 A JP 2011153493A JP 2011153493 A JP2011153493 A JP 2011153493A JP 5762185 B2 JP5762185 B2 JP 5762185B2
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JP
Japan
Prior art keywords
bonding apparatus
die bonding
shaft
semiconductor chip
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011153493A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013021143A (ja
Inventor
正人 辻
正人 辻
光輝 坂本
光輝 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2011153493A priority Critical patent/JP5762185B2/ja
Priority to KR1020120072760A priority patent/KR101380815B1/ko
Priority to TW101124604A priority patent/TWI479582B/zh
Priority to CN201210241584.2A priority patent/CN102881606B/zh
Publication of JP2013021143A publication Critical patent/JP2013021143A/ja
Application granted granted Critical
Publication of JP5762185B2 publication Critical patent/JP5762185B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP2011153493A 2011-07-12 2011-07-12 ダイボンディング装置 Active JP5762185B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011153493A JP5762185B2 (ja) 2011-07-12 2011-07-12 ダイボンディング装置
KR1020120072760A KR101380815B1 (ko) 2011-07-12 2012-07-04 다이본딩 장치
TW101124604A TWI479582B (zh) 2011-07-12 2012-07-09 Grain bonding device
CN201210241584.2A CN102881606B (zh) 2011-07-12 2012-07-12 芯片焊接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011153493A JP5762185B2 (ja) 2011-07-12 2011-07-12 ダイボンディング装置

Publications (2)

Publication Number Publication Date
JP2013021143A JP2013021143A (ja) 2013-01-31
JP5762185B2 true JP5762185B2 (ja) 2015-08-12

Family

ID=47482886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011153493A Active JP5762185B2 (ja) 2011-07-12 2011-07-12 ダイボンディング装置

Country Status (4)

Country Link
JP (1) JP5762185B2 (ko)
KR (1) KR101380815B1 (ko)
CN (1) CN102881606B (ko)
TW (1) TWI479582B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531505B (zh) * 2013-10-12 2015-12-30 四川蓝彩电子科技有限公司 晶片装配系统
DE102016208008A1 (de) * 2016-05-10 2017-11-16 Carl Zeiss Smt Gmbh Lageranordnung für eine Lithographieanlage sowie Lithographieanlage
CN112585732A (zh) * 2018-08-06 2021-03-30 株式会社新川 接合头

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP3369877B2 (ja) * 1996-10-31 2003-01-20 三洋電機株式会社 ボンディングユニット
JP3206486B2 (ja) * 1997-04-08 2001-09-10 松下電器産業株式会社 チップのボンディング装置におけるボンディングヘッド
JPH10308405A (ja) * 1997-05-08 1998-11-17 Mitsubishi Electric Corp ボンディング装置及びボンディング方法並びに半導体装置の製造方法
JP2000323522A (ja) * 1999-05-14 2000-11-24 Hitachi Ltd 上下動装置
JP3402284B2 (ja) * 1999-10-29 2003-05-06 日本電気株式会社 ボンディング装置
JP2002043335A (ja) * 2000-07-21 2002-02-08 Mitsubishi Electric Corp ボンディング装置及び方法
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.
JP2005340411A (ja) * 2004-05-26 2005-12-08 Nidec Tosok Corp ボンディング装置
KR100851567B1 (ko) * 2007-04-03 2008-08-12 주식회사 탑 엔지니어링 본딩 장비의 칩 트랜스퍼 헤드

Also Published As

Publication number Publication date
TW201308459A (zh) 2013-02-16
KR101380815B1 (ko) 2014-04-04
CN102881606B (zh) 2015-08-26
KR20130008465A (ko) 2013-01-22
JP2013021143A (ja) 2013-01-31
TWI479582B (zh) 2015-04-01
CN102881606A (zh) 2013-01-16

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